RSV series convection reflow soldering ovens include vacuum to reduce voids to fewer than 1%. Come in five or six heating zone versions, each with one vacuum zone and two cooling zones. Footprint is 5,070mm up to 6,229mm. Handle PCBs from 100 x 150mm up to 330 x 250mm. Large flux collection unit is said to reduce flux cleanings to a few times per year.

Eightech Tectron, www.eightech.com

Maxrel solder alloy comes in solder paste, preform and wire formats. Maintains shear strength after 1,000 thermal cycles under high CTE mismatch conditions. For LED chip-on-board (COB) assembly where high CTE mismatch can exist between the die stack and substrate, and creep fatigue properties of the solder material are important.

Alpha, alpha.alent.com/Markets/LED

Two Part Mix solder pastes come in two compartment bags that keep flux and solder powder separate from each other until mixed.  Have two-year shelf life without refrigeration.  Mix inside bag by squeezing flux toward powder, causing seal to release. Knead bag end-to-end for two to three minutes to fully mix the paste.

Chip Quik, www.chipquik.com

Jumbo Elephant surface cleaner removes electrically charged particles on electronic assemblies. Combines ionization, compressed air cleaning, extraction and filtration technologies. Ionization neutralizes surface charges. Integrated compressed air nozzle removes fine particles from wells or indentations. Particles are exhausted and filtered. Particle-free purified air can be fed back to the working area. Portable. Max. noise level is 49 dB.

Ult, www.ult.de

Vario AOI line has a new camera module. Compact housing includes one orthogonal and four angled-view cameras with 360° inspection, along with multispectral lighting. All cameras have large and congruent field of view and short image acquisition time. Telecentric optical system for orthogonal camera works in conjunction with adapted focal plane of angled-view modules for fault detection. Has axis system based on linear actuators. Optional 3D module features shadow-free measurement of components and solder joints, as well as circumference inspection, inspection for pins bent in x-y axis and measurement of pin height.

Goepel electronic, www.goepel.com

EVO Cam digital microscope has magnification up to 300x and auto focus. Is designed for precision inspection tasks, rework, and repair. Includes live video streaming, full-HD 1080p/60fps image quality, and an 8-point LED ring light. A 30:1 optical zoom provides ability to view whole samples or smallest details. Is reportedly ideal for inspecting printed circuit boards, wafers, connectors, and SMT products.

Vision Engineering, www.visioneng.us

YSi-V 5M comes with 5Mp cameras for 2D AOI. Is field upgradeable for high-speed 3D inspection and 4D capability, the latter by employing four additional off-axis cameras along with its main downward-looking camera.

Yamaha IM, yamaha-motor-im.com

i1000 19-inch, rack-mounted in-circuit test handlers have dual-lane conveyors. Can run multiple ICT tests serially and with two 1,664-node boards in parallel.

Keysight Technologies, www.keysight.com/find/ict

Spectrum II Premier with IntelliJet jetting is for dispensing small dot sizes at high frequencies for advanced packaging applications. Incorporates two-piece ReadiSet jet cartridge. Jets fluids in dot sizes from one to hundreds of nL. Closed-loop process controls integrate features for IntelliJet setup, calibration, and control. Is built on Spectrum II fluid dispensing platform. Has self-calibration features. Only wetted fluid path parts are changed on ReadiSet jet cartridge.

Nordson Asymtek, www.Nordsonasymtek.com

planarCT module is for phoenix microme|x and nanome|x x-ray inspection systems to inspect solder joints and packages in printed circuit board assemblies. Non-destructive planar CT scan technology is for slice-based and volume inspection. Can adjust scan parameters, place the board on the inspection table, close the door and start the CT scan. High-precision manipulation table rotates region of interest in the x-ray beam; DXR detector captures 2D x-ray image series for slice reconstruction. Reconstructed slice or multislice view allows inspection results of a single plane or a whole package without overlaying structures from other board areas.

GE Measurement & Control, www.ge-mcs.com

Alpha mult-level Precision Milled Stencils are designed to enable control of paste deposits when assembling printed circuit boards containing a variety of thicknesses. Reportedly provide flexibility in the transition from one thickness to another. Reduced pressure can be used when printing stepped stencils; have increased flexibility in design of the “keep-out” area. Enable use of closed-head printing systems.

Alpha, www.alpha.alent.com

MY600JD solder paste jet printer now has high-speed and high-precision capabilities. Suitable for semiconductor and SMT applications such as semiconductor chip encapsulation, cavity fill and conductive adhesive dispensing. Is said to achieve micrometer precision while delivering throughputs 2 to 10 times higher than those of traditional dispensers, depending on the application. 

Mycronic, www.mycronic.com