LMWS laser marking workstation, for benchtop operation, features a Class 1 industrial design with improved functionality. Easily configurable, requiring minimal workspace, for low-volume production and R&D environments in automotive, medical, aerospace, electronic components, and battery industries. For marking metals, ceramics and many plastics, and with cutting, drilling, and welding capabilities. Powered by a 10-50W LMF fiber laser marker; same graphic user interface as other models. Separable from the base LMF, yet designed to function as one unit. Motorized Z axis and rotary stage for easy adjustment of part and focus. Spring-loaded manual door opens for 180 degree access to parts and tooling. Large viewing window for visual process monitoring. Comes with F 100, 160 and 254 lenses for marking various parts and sizes. Fume extraction port with flexible tubing for adjustment to different parts.

Amada Miyachi America, www.amadamiyachi.com

SWF LL S151 laser soldering machine comes with controlled wire feed, 100W diode laser and has a wavelength of 980nm ±10nm. Wire and wire slip use monitored via a rotary encoder control wheel. Wire roll holder is aligned so wire roll positions and roll diameters can be set. Work angle can be selected. Controlled wire feed regulates or stops wire feed when it encounters a resistance or impacts with a specific force, and avoids wire kinking by adjusting for component and handling tolerances. Air cooled. Temperature can be controlled in real time. Can preset temp. curve or pure laser power. Includes process camera for setup. Records operating data. For inline and standalone use.

Eutect, www.eutect.de/home.html?L=1

EP17HT-100 is a single-part epoxy designed to cure in 60-90 min. at 200-220°F. Formulated for potting, encapsulation, bonding and sealing applications. Cures can be accelerated at higher temperatures. Is a moderate viscosity compound that can be cast in sections up to a 0.5" thick. Is not premixed and frozen. Reportedly has an unlimited working life at room temp. Offers volume resistivity of >1015 ohm-cm. Bonds well to metals, composites, ceramics, glass and many plastics. Exhibits a tensile lap shear strength exceeding 2,700 psi at ambient temp. after being post-cured for several hours at 350-400°F. Has thermal conductivity of 4-5 BTU·in/(hr·ft²·°F). Service temp. range -100°F to +500°F.

Master Bond, www.masterbond.com

CalcuQuote now reads and shares inventory master data with Manex through an application programming interface. Automatically ties bills of material (BoM) to their corresponding Manex part number, for easy viewing of part description, alternate part suggestions, Manex part number, standard cost, target price, part classification, and more.

VisionPDM, www.calcuquote.com

PF608-PI-21 (SnAg4.0Cu0.5/x) and PF606-P-BS1 (SnAg3.0Cu0.5/x) bumping solder pastes are designed to decrease voids in wafer bumping. Are said to offer excellent stencil printing transfer rates and void rates of <10%.

Shenmao America, www.shenmao.com

XF-784, a 1 mil matte antistatic, barcode tracking label material, is said to enhance print receptivity and the capability to withstand harsh fluxes and cleaning chemistry found in PCB manufacturing. Shows improved performance over the gloss coatings when exposed to a non-reflow environment prior to cleaning. Reduce charge generated on adhesive when label is removed from liner. Provides peel voltages of less than 100V per inch square. Designed to prevent significant charge buildup on the label surface, which can result in a static discharge event. Label surface resistance between 1.0 x 108 and 1.0 x 1011 ohms.

Polyonics, polyonics.com

TR7007QI stop-and-go SPI system is designed for accuracy. Is built on 3D projection technology. Automatically optimizes inspection route. SmartWarp system compensates for board warpage during inspection. Provides the choice of quad/dual projector inspection. Includes shadow-free quad/dual digital fringe projectors and 100% solder paste defect coverage, including low bridges.

Test Research Inc., http://www.tri.com.tw/en/index.html

Permalex-Pro R series is a reinforced blade assembly for continuous operation for high-volume SMT printing. Adapts a steel rod to the non-printing edge of the squeegee, to aid handling and assembly. Improves straightness and durability of squeegee during installation and operation.

Transition Automation, www.transitionautomation.com   

IW1 S151 EMS is a flexible mini-wave system based on the IW1 induction slot pump system. Nozzle receptacle is made of coated V4A and has an integrated selective shielding gas guide; shielding gas shroud lies against solder wave. Assemblies are submerged by lowering into the continually flowing solder. Solder reportedly flows in an endless loop protected from oxidation by nitrogen. Input area and part handling around the machine can be ergonomically designed. Two soldering frames are always in use; one of the frames is processed in the machine, while the second is in preparation. Solder frame is fixed to a rail, inserted into the machine, or on a turntable input manually or automatically populated. Assembly is provided with flux before soldering process begins. Flux is applied via an injection nozzle that applies flux points of 1.5mm to 3mm diameter. Can populate second solder frame with assemblies while components are being soldered. Both solder frames are exchanged in a single step. Linear axis handler receives solder frames and positions them within the machine. Solder nozzle can be replaced quickly. Point, line and matrix nozzles are available.

Eutect, www.eutect.de/home.html?L=1

Recipe Generator is a MOLE MAP software feature that provides reflow oven recipe generation. Is a starting point for in-spec process and development of final recipe. Is accessed from within the software’s reflow oven environment. Prompts selection of reflow oven type, board thickness, component density and solder paste type. Automatically produces reflow recipe zone temperature set points and conveyor speed. Has a drop-down menu and is Windows 10 compatible. Can be used with V-MOLE, SuperMOLE Gold 2 and MegaMOLE 20 thermal profilers.

ECD, www.ecd.com

HSIO validation assistant is a data mining tool for ScanWorks. Automatically analyzes database of signal integrity test data and quantifies risk associated with potential design flaws or poorly performing devices on a system’s high-speed input/output (HSIO) buses. Organizes and correlates validation database to identify vulnerabilities. Redundant validation testing can be identified and eliminated. ScanWorks HVA has been integrated into ScanWorks HSIO; validates signal integrity on high-speed buses on Intel circuit board designs.

Asset InterTech, www.asset-intertech.com

inSite app is faster and has been updated with a new user interface. Now provides process visibility to FactoryLogix software users. Converts an iPhone, iPad or iPod Touch into a mobile portal to a vast range of manufacturing and traceability information. Is said to provide quick, easy and mobile access to routinely required and actionable information within FactoryLogix. Shows WIP status, yield and problem points, forward and reverse traceability, summary data, quality data, and more. Recalls and displays CAD images by serial number.

Aegis Software, www.aiscorp.com