Print-and-Apply Module is a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.

Using existing bar code information, it queries a facility's WMS or other control system for the data needed for label printing. The system can take product data from receiving or pick-and-pass operations and print a shipping label that routes the box through a facility to its final destination. Ideal when throughput requirements demand the automation of the print-and-apply function, operates at over 30 cartons/min.

Typically implemented using the BOSS control system, which handles the interaction of machine and transactional data from the PLC level to the WMS level on one PC.

Standard hardware components include the underlying conveyor, a bar code scanner and printer. Options include a weighing scale and verification scanner. An optional divert unit can redirect rejected product for manual handling. A second optional printer can be added for increased throughput and system redundancy. Can top-apply or side-apply labels.

FKI Logistex North America, www.fkilogistex.com

NORTH BILLERICA, MA --BTU International has announced a number of upgrades to its wafer bump reflow production line.

The addition of an integrated three-axes robot from Brooks Automation enhances wafer handling and the system's capability for 24x7 applications, helping to maximize equipment uptime.

A new, simplified control system that uses a single operator interface provides more precise and flexible control throughout the system, including the reflow oven and flux coater. The control system enables the use of 300-mm standards including E40, E84, E87, E90, E94 and standard SECSII/GEM interface.

Designed to be easily scalable for use in future 300-mm fabrication. Can be used as a 200-mm to 300-mm bridge tool with FOUP inserts; features Brooks Automation FixLOAD loadports for use with 300-mm FOUPs.

 
BTU International, www.btu.com

Carlsbad, CA — Machine Vision Products (MVP) will highlight the Supra M AOI system in booth 8650 at Semicon West this week in San Francisco, CA.

Modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format digital camera and a high-precision linear x/y stage. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 15 to 22 mm/pixel. Has CAD-driven, library-based programming for precise measurement of component placement and solder joint analysis.

In a 960 x 965 mm footprint, provides an acquisition speed of 20 1.4 images/sec. Can achieve up to 45 sq. cm./sec., depending on board layout and density.

Offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. Includes on-the-fly single camera acquisition, improved optics and lighting, 0201 capability and adaptable algorithms with high detectability and low PPM false accept and false reject rates.

Machine Vision Products Inc., sales@machinevisionproducts.com

IS640-333 has a nominal dielectric constant of 3.33 at 10 GHz and  a dissipation factor of 0.0038 at 10 GHz. Available in standard 20, 30 and 60 mil thickness configurations. Other configurations may be available on request. Launched to target the low noise block (LNB) down converter market. 

The complete family of IS640 patent-pending products are formulated to provide exceptional thickness and dielectric constant control without using inorganic fillers.

IS640-333, IS640-338, IS640-345, IS640-325, IS640-320 and IS640-300 are manufactured in Isola’s Chandler, AZ facility.

Isola Group S.A.R.L., www.isola-usa.com

Universal Instruments Corp. has designed a line that can assemble 2,000 microprocessors per hour (supposedly 60% to 80% faster than existing lines).

GSM Genesis platform features a twin beam gantry system and proprietary linear motors based on the company’s Variable Reluctance Motor (VRM) technology. Each beam can support one of three different heads: 30-spindle rotary Lightning head – a chip placement solution with VRM technology that is smaller than mechanical turret heads typically deployed to place small discrete components; a seven spindle Flexjet head with integrated cameras to handle a range of components; or a four spindle Pressure Enhanced (PE) head used in conjunction with a high resolution digital upward-looking Magellan camera to place challenging components that demand higher accuracy.

A chipshooter platform configured with two Lightning heads can assemble 32,000 to 37,000 capacitors/hr. Optimal tact time for the line is between 18 and 20 sec. A module comprising 16 to 20 capacitors can be addressed by a single chipshooter platform, while modules with 20 to 40 capacitors require a second chipshooter.

A flip chip platform features two PE heads. The machine’s motion control parameters – such as acceleration, settling band and stabilization time – are said to deliver higher accuracy. A special low-viscosity fluxer is integrated on the machine. With the flip chips fed in waffle packs, can assemble 2,000 flip chips/hr.

Universal Instruments, www.uic.com

Used for tracking semiconductor wafers through the manufacturing process, In-Sight 1721 offers a slimmer package and twice the speed of its predecessors, yet maintains mounting and functional compatibility with them.

“As fabs move toward full wafer traceability, they are more dependent than ever on reliable automated wafer identification,” said Justin Testa, Senior VP of ID Products. “This newest member of Cognex’s series of industry-leading wafer readers reads faster with higher yield under difficult real world process conditions.”

Advanced image formation technology and OCR, 2-D matrix and barcode recognition algorithms deliver reliable reading performance on SEMI-standard scribes. Said to provide high read rates on wafer marks that have been affected by CMP, edge beads, copper metallization, blue or green nitride coating and other process effects.

Offers flexible mounting options for easy installation on wafer sorters, ion implanters, probers and other tools. GUI simplifies set up, automatic tuning minimizes operator intervention. Built-in network and serial communications provide connectivity to other process tools and the fab network.

Available in September.

Cognex Corp., www.cognex.com.

Profiler is a technology dedicated to post-reflow inspection. Profiler technology is fully integrated into the AOI software suite and the standard model library comes equipped with preset test parameters. A user-friendly auto-setting wizard quickens the programming time and the fine-tuning of inspection programs.

Unique algorithms analyze the grey level profile of leads and joints, eliminating the need for angled camera systems which are difficult to program and give high levels of false failures. Highly robust algorithms in combination with a custom built proprietary color lighting source, enable the detection of lifted leads, total or partial lack of solder, impurities and co-planarity defects, reportedly surpassing the test coverage of a number of multiple cameras systems.

ViTechnology, vitechnology.com

CSM7100 SMD pick-and-place fulfils the requirements of a high-mix/low-volume production. The low-cost system places components from 0402 to 33 x 33 mm QFP. The narrow built feeders are intelligent and programmable to reduce changeover time and avoid setup errors.

The large number of feeders (up to 100 x 8 mm) enables manufacturing of complex PCBs in one run and allows for a broad range of standard components. Changeover effort is minimum. High feeder variety provides a wide application range and high flexibility. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Tall components (15 mm height) can be placed.

All components are aligned "on-the-fly" with a laser centring system. With this touch-less technology components are measured exactly and no damage can occur. Furthermore, the laser alignment system is self-calibrating and requires no maintenance.

Has placement rate of 4,000 cph. Footprint is 80 x 80 cm, with a placement area of 380x250 mm. LIGHTPLACER Windows-based software features a fully graphical man-machine interface. Can be programmed online or offline. Barcode labels on feeders and components guarantee the correct, quick feeder setup using a barcode reader.

The combination of the pick-and-place with a dispenser saves the cost and floor space of additional equipment. A time/pressure or screw valve dispenser can be integrated.

ESSEMTEC AG, www.essemtec.com

SML5050RBG1K-TR is a low-profile, surface-mount, full-spectrum RGB LED. Said to provide excellent performance and terrific visibility in a compact size of 5.5 x 5.5 mm. The RGB diodes emit high-intensity light in a viewing angle of 120°. The red diode's wavelength varies between 620 and 630 nm; the green diode’s is between 520 and 535 nm; and the blue operates between 460 and 475 nm. Luminous intensities range from 150 to 500 mcd at 20 mA current. A water clear lens protects the diode array.

Use with s OptiLED Light Pipes to simplify the spatial relationship between the PCB and remote indicator illumination points. Light pipes channel the LED-generated light to the exact location where the light is required. Compatibility with infrared and vapor phase reflow soldering processes and pick-and-place automated equipment make the LED series cost effective. Broadens the illumination options available for back lighting computer panels, handheld instruments like PDAs, data- and tele-communication status indicators, etc. Solid-state design renders LEDs impervious to electrical and mechanical shock, vibration, frequent switching and environmental extremes. Average life span of 100,000-plus hours (11 years.

LEDtronics Inc., www.ledtronics.com

Flux Pen is a precise, inexpensive, handy tool for applying liquid flux to tiny chip components and individual solder joints. Can be used with different types of fluxes. Its fine tip allows the user to apply flux to very small areas in densely populated assemblies. Cuts down on waste and prevents over-fluxing, reducing possible cleaning time and preventing contamination.

Transparent cartridge allows the user to see the amount of remaining material in the pen; has small, compact size and large capacity. Flux is dispensed by lightly squeezing the barrel; the user controls the amount of flux flow. A snug-fitting cap prevents flux evaporation in the barrel. Constructed of rugged polypropylene, the refillable pen features an ergonomic design, and is compact enough to fit into the top pocket of a lab coat.

Cobar Solder Products (U.S.); contact Bob Silveri: cspbob@aol.com.

GÖPEL electronic announces the availability of the first products for extended JTAG/boundary scan solutions based on the hardware platform Scanflex. Add new capabilities for analog and mixed-signal test.

Three PCI-based boundary scan controllers (SFX Controller) of various performance classes will be available, with six different TAP-Transceivers (SFX Transceiver) and an I/O module (SFX Module) for parallel, digital I/O. The product family will be expanded to include USB, PXI, VXI and fire wire controllers as well as TAP 8 and TAP 16 gang tranceivers.

A Scanflex system is controlled by a SFX controller. The PCI-based SFX/PCI1149 is available in three performance classes: A, B and C, with a max. TCK frequency of 20, 50 or 80 MHz, respectively. Integrated Fastscale technology allows upgrades “on the fly” through software while it is inside the host PC. Controllers include the ADYCS II feature to compensate for signal propagation delay, as well as HYSCAN for  data synchronization of serial and parallel vectors.

The portfolio transceivers includes desktop solutions for 2, 4, 6 and 8 TAP configurations, as well as compact versions with 2 and 4 TAP for more rugged environments. Include 32 dynamic, parallel digital I/O, two analog I/O channels, three static digital I/O and trigger lines. Have removable TAP Interface Cards (TIC). The first available TIC – a single ended interface with line drivers supporting TAP cable up to 5 feet long – provides programmability for input threshold, output voltage, input and output impedance, TCK frequency, delay compensation, a relay controlled power signal and read-back capability of TAP output signals.

SFX5296 provides 96 parallel I/O channels. Each is individually configurable as input, output, bi-directional or Tri-State. Feature Unstress protection and voltage programmability for groups of 32 I/O. 

GÖPEL electronic GmbH, goepel.com

FEINFOCUS, a business unit of COMET, announces the HDX-ray 16-bit Imaging Chain for FOX x-ray inspection systems. Captures high-resolution images with film-like quality, even in real-time. Provides sharp digital images for thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects, hybrids and encapsulants.

Fully-integrated 2.6 mega pixel imaging subsystem features more than 65,000 grey scales with freely-selectable frame rates from 1 to 30 fps, for imaging of low-contrast, low-density and high-contrast, high-density structures and materials at the same time.  Powered by the Feinfocus GUI.

FOX nanofocus x-ray inspection system provides xy feature recognition of 300 nm (0.3 µm) and asmallest focal spot size (less than 1 µm). Employs a modular concept, available in multiple configurations. Offers geometric magnification up to 2,720x (total magnification up to 8,120x).

COMET, comet.ch