Libra Industries has introduced a lead-free transition services package to help manufacturers extend their internal engineering capacity to successfully comply with the RoHS directive. 

The package consists of in-house BOM review and conversion, and assistance with product redesign though Libra’s Design Service.  The company has partnered with Engent Inc. (Norcross, GA) to offer pilot assembly and reliability testing for new lead-free product designs. These services are available a la carte, or as a complete package.

Libra Industries, libraind.com

DEK will show its cost-saving, throughput-enhancing packaging technologies at  booth #7111 during Semicon West in San Francisco.

The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.

Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.

Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping. 

DEK, dek.com

Samtec has announced the addition of RF cable connectors and cable assemblies to mate with its line of MMCX, MCX and SMA connectors.

SMA subminiature RF cable assemblies are available with straight and right angle terminations and feature high durability, compact semi-precision connectors. They use .085” (2.16 mm) and .141” (3.58 mm) semi-rigid cables and standard flexible cables, including double-shielded RG-316.

Mini connector cable assemblies are available as jacks and plugs and with a choice of straight or right angle terminations. These quick connect/disconnect style connectors are for applications with limited weight and space availability.

Micro-Mini cable plugs are also available with straight and right angle terminations, and feature quick connect/disconnect style snap-on mating.  A “Ganged” variation is also offered for terminating two, four, six or eight wires simultaneously.

Samtec Inc. , samtec.com                 

Router Solutions Inc. (RSI), a supplier of electronic computer ided design (ECAD) data preparation and paperless repair software, announces the latest release of its CAMCAD data preparation solution.

V4.5 includes the following enhancements:

• 74 customer driven enhancements

• Bill of Materials variant support

• Multiple machine support

• In-Circuit Test (ICT) Fixture reuse analysis

• New Electrical Part Library

• Various Design For Test (DFT) improvements

• Teradyne Spectrum export module 

• Seica flying probe export module

• DigitalTest ICT export module

• MVP Paste AOI export module

• MVP Component AOI export module

The new variant support provides the ability to incorporate different variations of a single PCB within a single file without having to duplicate the boards. Users can apply the different variants to the board at any time during the data preparation process, reducing management issues of multiple files for each variant.

With support for over 34 PCB-related writers now in CAMCAD, there is also flexibility to store a specific DFT solution with each electrical test writer within CAMCAD using the multiple machine feature.

Reuse analysis module allows existing fixture information to be imported against an updated revision of a PCB and a report will be generated within minutes showing how easy it will be to use the existing fixture on the new board.

Router Solutions Inc., rsi-inc.com 

K2000 motorized circular blade depanelizer is a safe, easy way to separate prescored PCBs without dust or scrap. Now available with xy table for improved board handling. 

PCB panels are singulated by passing the scoreline between two circular blades. Front and back blade guards assure operator safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.

When using the xy table, the operator places the PCB onto the guide rails of the table and brings the scoreline between the top and bottom blade guards to pass it to the cutting area. The motor driven lower blade will pull the PCB through to separate the panels. Two cutting speeds are available for optimal PCB separation. Panels up to 12.5 in. can be singulated. Blades are made of long lasting tool steel and can be re-sharpened.  

The tooling plate for Simm cards allows exact placement of the PCB matrix onto the moveable base. The plate is positioned on the right side for singulating the carrier strip on the left of the panels and then moved to the other side to singulate the remaining carrier strip. Adjustable end stops for the tooling plate allow for exact positioning of the scoreline with the circular blades. Tooling pins and support rails for either side of the panel guarantee safe placement and support of the SIMM cards. The rails can be adjusted to insure that there is no contact with the components on the cards.

FKN Systek, Fknsystek.com

At SEMICON West booth # 9209, Adhesives Research will feature its ARclad custom PSA tape technology for the semiconductor industry, which includes several tape products for chemical mechanical polishing, as well as a heat-releasable wafer dicing tape for high-risk dies.

PSA tape technologies cover three applications within CMP, including the fabrication of stacked CMP pads, bonding CMP pads to polishing machine platens and bonding CMP textiles to stainless steel polishing heads.

ARclad 90450 is a double-faced bonding tape using one permanent adhesive chemistry for bonding to the top pad and another permanent adhesive chemistry specific to bonding to the foam sub pad.

ARclad 8904 and ARclad90334 were designed for bonding stacked pads to the platen.

Both are double-faced tapes with a permanent adhesive for bonding to the sub pad and a removable adhesive for bonding to the platen. Designed for adhesion to low surface-energy polishing tables. Contain a blue polyethylene release liner. Prevents tearing during application and improve die cutting, while promoting an easy, smooth release. 8904 employs a permanent rubber-based pressure-sensitive adhesive for bonding to the sub pad, while 90334 uses an acrylic permanent pressure-sensitive adhesive.

ARclad 90452 is a permanent/removable double-faced tape with the permanent adhesive designed to bond the polishing pad, without a sub pad, directly to the platen. The removable adhesive allows for easy, clean pad removal when polishing is completed.

ARclad 8917,a permanent/removable CMP/carrier bonding tape, provides good solvent resistance, operability in a broad functional pH range, offers a smooth adhesive surface to improve CMP yields, creates a stronger bond to CMP textiles and ensures clean removability from machine surfaces. Comes with two clear polyester liners for visual inspection of the bonding surface prior to application, has good coat weight (9.0 mils) and total thickness variation control.

Heat-releasable, pressure-sensitive adhesive tapes with a stretchable backing film and a polyester film release liner allow needle-less removal of fragile die, while reducing mechanical damage. With the application of heat, the tapes release cleanly, leaving no adhesive residue. The stretchable backing allows for easier mounting, dicing and die-removal, while enhancing visual system capabilities.

Adhesives Research Inc., www.adhesivesresearch.com

AlSiC (Aluminum Silicon Carbide) is a metal matrix composite suited for optoelectronic housings and lids.

Enables a tailored coefficient of thermal expansion, for compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

Near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and rapid prototyping. The un-restricted geometry enables inclusion of design features such as septums, walls and radial features. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Corp., www.alsic.com

Zestron America and QTS Inc., a stencil frame manufacturer, have successfully completed extensive compatibility tests. Under the direction of Zestron’s engineering team, newly developed QTS stencil frames were successfully tested with VIGON SC 200. The MPC technology removes raw solder paste and adhesive in a single process.

Tests were performed at one of a Technical Centers in accordance with Zestron’s Standard Stencil Compatibility Test Methods in ultrasonic and spray-in-air equipment. The frame structure and nylon composed buttons, for example, showed excellent compatibility with VIGON SC 200. 

To obtain a copy of the compatibility certificate, contact ZESTRON America at (888) 999-9116 or QTS at (508) 359-7800.

A new version of Assembléon’s zero-defect set-up assistance software is said to simplify set-up of its SMD placement machines, particularly in applications where the production line is configured to process a multiplicity of smaller production batches.

Two new features are available for SVS-Pro supported machines and the feeder Loading Unit.  For board family set-up, the production preparation software uses ‘dummy’ feeders so that the set-up is identical during optimization of the various process programs of the family. The use of dummy feeders implies that in the set-up of a particular process program a part number is defined but is not present, although it may be present in the process program of another board in the family. SVS-Pro 3.1 allows two different modes of operation.

In the stricter mode of operation, it checks all feeders in a process program, including those for which no mountline exists (dummies). If a feeder is not present, the software will not allow production to proceed even if the related part number is not used on the board. In a less strict mode, it does not check the dummy feeders and does not generate an error, but allows production to start. 

Placement machines and the Loading Unit can now read multiple composite barcodes and format string for quantity barcodes in combination with non-leaded barcodes.

Improves operator guidance during feeder programming, showing which feeders are needed in the selected set-up.

For AX machines, provides automatic feeder pitch programming.

Offers multi-language support, including multi-byte languages, on the AX machines and the Loading Unit.  Supported languages are English, German, Traditional Chinese and Simplified Chinese.

 Assembléon, www.assembleon.com

Anderson Power Products has introduced the high density PowerMod connector family. The connector system, offered in three to 30 circuits, is available for straight PCB, right angle PCB, panel or cable mountings, offering design flexibility for system packaging.

Rated for 30 ampsm features mechanical polarized UL94V-O housings for proper circuit mating. Connectors have up to four sequential pin mating options available for mate-first/break-last and make-last/break-first circuits.

Offers stainless steel positive retention latches and optional back shells that provide additional safety and security.  Available in 13 different sizes: single-row 3, 4, 6 and 8 circuit; two-row 6, 8, 12 and 16 circuit; and third row 9, 12, 18, 24 and 30 circuit connectors.  UL- and TÜV- recognized, CSA certified.

Anderson Power Products, andersonpower.com

The Electronic Industries Alliance (EIA), the Japan Green Procurement Survey Standardization Initiative (JGPSSI) and JEDEC have published the first international standard for product material content reporting. The Joint Industry Guide for Material Composition Declaration for Electronic Products will harmonize the disclosure of material content data across the electronics supply chain.

Developed by EIA and JGPSSI, and standardized using JEDEC procedures, the standard was motivated by the trend toward international environmental regulations that restrict the use of certain substances. The most well-known of these regulations is the EU’s RoHS Directive, which will take effect in 2006, and will ban the use of specific materials that have traditionally been used in electronics manufacture.

The Guide provides a standardized list of materials that must be disclosed when present in products and subparts that are supplied to electrical and electronic equipment manufacturers for incorporation into their products. The list will benefit suppliers and their commercial customers by providing consistency and efficiency in the material declaration process. It will also encourage the development of consistent data exchange formats and tools to facilitate data transfer along the global supply chain.

Issues covered include:

Targeted lists of materials and substances for disclosure;

The composition amount or "threshold level" that requires disclosure for particular materials and substances;

Regulatory requirements that establish threshold levels, where appropriate;

Data fields for information exchange.

Available free of charge at www.eia.org/jig.

Flex Arm adds a new dimension of flexibility – in virtually every direction - with its 19” vertical post. Designed for mounting microscopes, vision systems, etc., is flexible, sturdy and stable. Allows vertical movement along the post (z-axis) as well as Theta (rotational), in addition to other lockable/positionable axes of movement.

Two versions available, equipped with a standard table clamp or a weighted base. Both are bench friendly, and do not require users to keep the horizontal arm at table height. Lower arm can be placed as high as 19” off the table, allowing users to work around existing bench top products or structures. The second (upper) adjustable arm can pivot and be adjusted at any number of angles for flexibility and clearance of benchtop objects.

The O.C. White Company, www.ocwhite.com