ProFlow enclosed print head is a key element of the lead-free portfolio DEK has created to help the transition to high-quality, repeatable lead-free processing. When implementing lead-free assembly, high accuracy mass imaging using the print head reportedly maximises the process window, compared to conventional squeegee blades.

Reduces the number of variables – such as paste rheology and ambient humidity – that need to be controlled for lead-free utilisation. The result is a simplified paste evaluation process and confident vendor selection, supported by repeatable results to justify procurement decisions.

In operational use, the greater transfer force maximises stencil aperture fill and paste release efficiency. Has repeatable aperture filling, low paste wastage and high throughput.

DEK, www.dek.com/lead-free

According to Christopher Associates, OEM requirements for improved manufacturing yields have led to strong demand for the Koh Young 3 dimensional solder paste inspection systems.

The KY 3030VAXL (24 x 27” panel size) high-speed 3-D solder paste inspection system was developed to inspect very high density, high technology telecommunications substrates for 100% volumetric and shape defects. Designed, manufactured and delivered within 10 weeks of receipt of order to a large EMS manufacturer.

Additional installations include a number of the KY 3030VAL (18 x 20” substrate) systems installed at a major EMS manufacturer; a major automotive electronics manufacturer has also ordered multiple systems. Among the advantages cited after extensive evaluations by each customer were ease of use, accuracy and speed.  

Christopher Associates Inc., christopherweb.com

St. Louis -- HIGHLIGHTER multi-directional LED ring light uses a simple mouse to control the direction of the lights, as well as the intensity and number of LEDs illuminated. Works on all makes of microscopes, as well as the speckFINDER  Video Microscope.

Inspection and quality control workers can view surface defects and overcome visibility problems. Hard-to-see imperfections in plastic and metal surfaces, defects in solder joints and details on translucent surfaces all become apparent when highlighted.

Users can direct up to 40 LEDS either clockwise or counter clockwise by rotating the mouse control.  A left mouse click activates automatic continuous rotation of 1 to 39 LEDS so the operator can compare and contrast the image under different lighting, without having to move the object being viewed. A right click of the mouse alters light intensity to meet optical instrument and individual requirements.  The dimmable ring light offers five settings from 100 to 2%. 

The ergonomic mouse occupies minimal workspace and eliminates “big box” controls.

Davor Manufacturing Corp., dazor.com 

1075-EXR 44 wave solder flux is developed specifically for Pb-free wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies.

Is water-based and non-flammable, eliminating special storage requirements and reducing VOC emissions. Said to provide excellent surface wetting, eliminate cleaning and reduce solder balling. Can also be used for Sn/Pb assemblies. 

Indium Corp., www.indium.com 

TOKYO -- Tatsuta System Electronics Co. released a new EMI shield film, SF PC-5000, formulated for flex interconnects, COF, hinge applications in cellular phones, digital camera modules and LCD drivers. Total thickness is 22 microns. Well suited for dynamic flex operations, also acts as a covercoat.

Base dielectric is a soft epoxy only 5 microns thick, covered with 0.1 to 0.15 microns of silver and 17 microns of anisotropic conductive Adhesive. Said to exhibit excellent thermal stability during reflow with no blistering or warpage and minimal shrinkage.  Comes with a matte black finish, a 50-micron PET transfer film for handling and a 120-micro film for protection.

Further info.and samples available from FRP Services & Co.: (914) 868-4090 Ext. 110; kobayashi@frpusa.com  

Promation recently expanded their in-line label placement stations by adding a “Print on Demand” feature prior to the pick-and-place function.

ELC-100 is a standard in-line label pick-and-place station that uses the customer’s pre-printed label rolls. ELC-200 allows customers to print their labels (based upon select criteria) and have them placed on the PCB.

Both stations can accurately place labels, ranging from 7 x 7 mm to 40 x 40 mm, through the use of an x/y gantry and touch panel interface. Clamshell design allows full access to the labeling system.

Available with YL and LLX size internal conveyors.

Promation, pro-mation-inc.com

nLight, a manufacturer of high-power semiconductor lasers, has released a near-infrared (NIR) diode laser that emits 3W continuous-wave (CW) power from a single, 100-micron broad area emitter. Available in a C-Mount or High Heat Load (HHL) package, the high-brightness, 808-nm, multimode diode laser is a pump source for solid-state lasers, and heat or illumination source for medical and industrial applications.

Has an operating current of 2.8A and compliance voltage of 1.85V. Beam divergence is <36 degrees by <10 degrees, FWHM.  As an added feature, nLight can include an AR-coated cylinder lens to collimate the fast-axis to <2 degrees, FWHM, with >95% power transmission.

NLight, nLight.net 

To better serve the small volume user, Alpha-Core now stocks Round Magnet Wire from 34  to 14 AWG on 10 lb spools and Tinned Solid Copper Wire on 2 lb and 10 lb spools. Tinned solid wire, available both round and flat from 36 to 22 AWG, is used in pins and PCB connections while the magnet wire is used in board-mounted components in power supplies, voice coils in speakers and motor coils.

Alpha-Core, www.alphacore.com

CM1230 is the newest solution in the family of PicoGuard ultra low capacitance diode arrays for electrostatic discharge (ESD) protection of high-speed serial interfaces. With a space efficient CSP and an ultra low input capacitance of 0.8 pF per channel, is said to be the industry’s smallest form factor low capacitance ESD diode solution.

Data interfaces such as high-speed serial data interfaces for mobile handset displays as well as USB 2.0 and Serial ATA interfaces found in many digital consumer and computing applications require robust ESD protection for high value SOCs with low levels of capacitance and inductance to preserve signal integrity. Providing protection against ESD strikes up to ±8kV contact and ±15kV air discharge, the CM1230 meets the performance requirements of these applications.      

California Micro Devices Corp., www.calmicro.com

A Mobile Device Rework (MDR) package with integrated solder paste dispenser has been developed to rework mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment. The new package will be on display at booth 8715 at SEMICON West

The fully integrated rework system can dispense solder paste dots small enough for 0201 rework. Can also dispense additional materials including epoxy and underfill.

Equipped with a motorized placement module, WinCOMISS software controls bond force during placement and soldering.

Provides rework capability for the smallest of devices up to RF shield cans, and for the challenge of  extremely high-density packages.  The “cycle” includes device removal, residual solder clean-up, fresh paste dispense and component replacement. A fully automated version (Auto-MDR) is also available.

Finetech Inc., www.finetechusa.com

The Optoelectronics Division of Bivar Inc. introduces a new surface-mount RGB-based device for optimized control of color and brightness, including a brilliant white, packaged in a low-profile, industry standard PLCC- 4 (plastic leaded chip carrier) device with a 120º viewing angle. Applications include high-contrast video displays (such as LCD monitors, backlighting in automotive dash clusters and exterior automotive lighting), instrument panel backlighting, navigation and switching systems, and medical instrumentation.

Features an internal tri-chip circuit, employing three individually addressable LED die. Lens appearance when off is water clear. Comprised of a single AllnGaP and two InGaN/SIC chip dies, featuring peak wavelengths of 625, 568 and 430 nm respectively. The result is a programmable white or brilliant full color display that can meet specific display needs. Absolute maximum rating of forward current drive is 200mA (Peak If). Other models in the product family include single and bi-color chip available in red, green, blue and yellow, including ultra and HE colors such as 395 UV– 525nm pure green.

The PLCC-4 configuration, including a four-pad metal heat dissipating base, measures 0.075” high, with a footprint of 0.110” x 0.138”.

Bivar Inc., www.bivar.com

BEAVERTON, OR— Tamura H.A. System Inc. will highlight TPD6-25F, a lead-free selective soldering system, in booth 8551 at SEMICON West in July.

The stand-alone system features cost-efficient application, a selective spray fluxer with precision needlepoint and six individual FLIP units ¾ individually programmable on soldering time and soldering height.

Top clearance of parts is 150 mm and maximum bottom clearance is 25 mm. Features a 60 second throughput tact time per board/panel, as well as touch-panel operation with up to 20 PCA memories. The system’s preheater uses solder bath temperature, and the spray fluxer is a precision needle spray nozzle that is position programmable.

Tamura H.A. System Inc., www.tamura-ha.com