The Nikon ECLIPSE LV series includes the ECLIPSE LV150, LV150A (with automated nosepiece) and the ECLIPSE LV100D (episcopic/diascopic illumination) microscopes. Said to address the need for precise microscopy measuring solutions to keep up with higher performance demands in the semiconductor and medical device markets, the rapid development of new materials and the inspection requirements of components with widely varying dimensions. 

The modular design allows versatility and flexibility that enables it to cover a variety of applications, from development and quality control to manufacturing inspection. Reportedly provide superb performance when inspecting semiconductors, flat panel displays, packages, electronics substrates, materials, medical devices and other samples. Can accommodate sample heights from 47 to 82mm by inserting a column riser between the main body and arm of the microscope. This feature is useful for viewing the surface of precision molds, optical materials and other thick samples.  

Accepts industry-supplied stages handle samples up to 116.5 mm, for observation of fiber ends and other tools. Features a range of industrial stages and accessories, all are durable with a new triple plate design.

A variety of observation methods are available, including: first order compensator, UV polarizing and epi-fluorescence -- in addition to brightfield, darkfield, DIC and simple polarizing. Have a high- intensity, low-power consumption white halogen light source, and an adjustable high intensity mercury fiber light source.   

Nikon Instruments Inc., www.nikonusa.com

MYLabel keeps track of each individual reel, stick or tray used in an SMT production line. Vital production data, such as tape pitch, orientation, batch code and quantity, are stored in a central database and used for feeder loading and complete traceability. New features include easy data extraction from the supplier’s barcode label and barcode-activated functions for ergonomics.

When registering part deliveries, the software will recognize the component supplier’s barcode label, regardless of format and coding standard, and extract the part number, quantity and batch ID. Attribute parameters, such as tape pitch and orientation, are then extracted from the part database, and a new entry is created. The risk of mislabeled parts is eliminated, since no manual data entry is involved in the registration and labeling process.

Features sound signals that alert the operator about error conditions, and barcode-activated instructions for common tasks, like Print and Discard.

Integrates with other factory software using ODBC/SQL.

MYDATA automation

W. L. Gore & Assoc. has released the GORE 100 Series Connectors, the newest addition to the GORE Blindmate/Push-on Connector family. The connectors are a high-density blindmate, microwave interconnect system offering performance through 100 GHz.

An extension of the SMP and SMPM connector families, the connectors were developed for increased packaging density, low mass and increased performance at higher frequencies. Blindmate interfaces said to be robust, durable and lightweight. A socket-to-socket bullet weighs less than 0.02 g. The connectors accommodate radial and axial misalignment with negligible VSWR change.

“The 100 Series Connector is 35% smaller than the current SMPM connectors,” said Paul Czikora, microwave connector technologist. “They offer increased electrical performance and reduced mechanical footprint, enabling designers to create thinner, lighter, smaller and more cost-effective TR modules, printed circuit boards and power dividers.”

W. L. Gore & Assoc. Inc., gore.com

CR-5000 Lightning was created to meet the demands of increased electronics design complexity resulting from the growth in density, miniaturization and multi-functionality of products.

The unique technology was born from collaboration between R&D teams in  Japan, the UK and Germany. Combines PCB design and simulation for fast, efficient design that enables users to solve high-speed design issues early in the process. 

Fully integrated design environment into CR-5000 Board Designer and CR-5000 System Designer ensures a fully adopted frontloading approach, allowing users to share information through a unified database within the high-speed design environment. In-depth analysis and what-if capabilities available throughout the design process enable engineers to explore design scenarios, trading off signal integrity parameters such as crosstalk, timing or EMI requirements, against mechanical and thermal constraints.

Offers:

Unified and shared design constraints, to eliminate complexities associated with separate design and provide control for activities such as circuit design, floor plans and board design;

Unification and communication between board design and system design with high-speed constraints and analysis;

Unified Analysis Engine Sharing;

and Frontloaded Verification.

Additional features include 'Trunking', H-Tree Routing and Interactive Lengthening.

Zuken, zuken.com

Total Parts Plus’ material content database has expanded its coverage for electronic and non-electronic components to more than 2.5 million part numbers. Data coverage includes full and partial content information, Restriction of Hazardous Substances (RoHS) compliancy flags, lead-free identification, exemption tracking, compliant alternates, tin whiskering data and reflow temperature.

Total Parts Plus has been collecting material content data since the announcement of the European Directives and has added RoHS compliancy flags to its material disclosure information to help manufacturers identify compliant replacements quickly.

Libra Industries has introduced a lead-free transition services package to help manufacturers extend their internal engineering capacity to successfully comply with the RoHS directive. 

The package consists of in-house BOM review and conversion, and assistance with product redesign though Libra’s Design Service.  The company has partnered with Engent Inc. (Norcross, GA) to offer pilot assembly and reliability testing for new lead-free product designs. These services are available a la carte, or as a complete package.

Libra Industries, libraind.com

DEK will show its cost-saving, throughput-enhancing packaging technologies at  booth #7111 during Semicon West in San Francisco.

The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.

Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.

Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping. 

DEK, dek.com

Samtec has announced the addition of RF cable connectors and cable assemblies to mate with its line of MMCX, MCX and SMA connectors.

SMA subminiature RF cable assemblies are available with straight and right angle terminations and feature high durability, compact semi-precision connectors. They use .085” (2.16 mm) and .141” (3.58 mm) semi-rigid cables and standard flexible cables, including double-shielded RG-316.

Mini connector cable assemblies are available as jacks and plugs and with a choice of straight or right angle terminations. These quick connect/disconnect style connectors are for applications with limited weight and space availability.

Micro-Mini cable plugs are also available with straight and right angle terminations, and feature quick connect/disconnect style snap-on mating.  A “Ganged” variation is also offered for terminating two, four, six or eight wires simultaneously.

Samtec Inc. , samtec.com                 

Router Solutions Inc. (RSI), a supplier of electronic computer ided design (ECAD) data preparation and paperless repair software, announces the latest release of its CAMCAD data preparation solution.

V4.5 includes the following enhancements:

• 74 customer driven enhancements

• Bill of Materials variant support

• Multiple machine support

• In-Circuit Test (ICT) Fixture reuse analysis

• New Electrical Part Library

• Various Design For Test (DFT) improvements

• Teradyne Spectrum export module 

• Seica flying probe export module

• DigitalTest ICT export module

• MVP Paste AOI export module

• MVP Component AOI export module

The new variant support provides the ability to incorporate different variations of a single PCB within a single file without having to duplicate the boards. Users can apply the different variants to the board at any time during the data preparation process, reducing management issues of multiple files for each variant.

With support for over 34 PCB-related writers now in CAMCAD, there is also flexibility to store a specific DFT solution with each electrical test writer within CAMCAD using the multiple machine feature.

Reuse analysis module allows existing fixture information to be imported against an updated revision of a PCB and a report will be generated within minutes showing how easy it will be to use the existing fixture on the new board.

Router Solutions Inc., rsi-inc.com 

K2000 motorized circular blade depanelizer is a safe, easy way to separate prescored PCBs without dust or scrap. Now available with xy table for improved board handling. 

PCB panels are singulated by passing the scoreline between two circular blades. Front and back blade guards assure operator safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.

When using the xy table, the operator places the PCB onto the guide rails of the table and brings the scoreline between the top and bottom blade guards to pass it to the cutting area. The motor driven lower blade will pull the PCB through to separate the panels. Two cutting speeds are available for optimal PCB separation. Panels up to 12.5 in. can be singulated. Blades are made of long lasting tool steel and can be re-sharpened.  

The tooling plate for Simm cards allows exact placement of the PCB matrix onto the moveable base. The plate is positioned on the right side for singulating the carrier strip on the left of the panels and then moved to the other side to singulate the remaining carrier strip. Adjustable end stops for the tooling plate allow for exact positioning of the scoreline with the circular blades. Tooling pins and support rails for either side of the panel guarantee safe placement and support of the SIMM cards. The rails can be adjusted to insure that there is no contact with the components on the cards.

FKN Systek, Fknsystek.com

At SEMICON West booth # 9209, Adhesives Research will feature its ARclad custom PSA tape technology for the semiconductor industry, which includes several tape products for chemical mechanical polishing, as well as a heat-releasable wafer dicing tape for high-risk dies.

PSA tape technologies cover three applications within CMP, including the fabrication of stacked CMP pads, bonding CMP pads to polishing machine platens and bonding CMP textiles to stainless steel polishing heads.

ARclad 90450 is a double-faced bonding tape using one permanent adhesive chemistry for bonding to the top pad and another permanent adhesive chemistry specific to bonding to the foam sub pad.

ARclad 8904 and ARclad90334 were designed for bonding stacked pads to the platen.

Both are double-faced tapes with a permanent adhesive for bonding to the sub pad and a removable adhesive for bonding to the platen. Designed for adhesion to low surface-energy polishing tables. Contain a blue polyethylene release liner. Prevents tearing during application and improve die cutting, while promoting an easy, smooth release. 8904 employs a permanent rubber-based pressure-sensitive adhesive for bonding to the sub pad, while 90334 uses an acrylic permanent pressure-sensitive adhesive.

ARclad 90452 is a permanent/removable double-faced tape with the permanent adhesive designed to bond the polishing pad, without a sub pad, directly to the platen. The removable adhesive allows for easy, clean pad removal when polishing is completed.

ARclad 8917,a permanent/removable CMP/carrier bonding tape, provides good solvent resistance, operability in a broad functional pH range, offers a smooth adhesive surface to improve CMP yields, creates a stronger bond to CMP textiles and ensures clean removability from machine surfaces. Comes with two clear polyester liners for visual inspection of the bonding surface prior to application, has good coat weight (9.0 mils) and total thickness variation control.

Heat-releasable, pressure-sensitive adhesive tapes with a stretchable backing film and a polyester film release liner allow needle-less removal of fragile die, while reducing mechanical damage. With the application of heat, the tapes release cleanly, leaving no adhesive residue. The stretchable backing allows for easier mounting, dicing and die-removal, while enhancing visual system capabilities.

Adhesives Research Inc., www.adhesivesresearch.com

AlSiC (Aluminum Silicon Carbide) is a metal matrix composite suited for optoelectronic housings and lids.

Enables a tailored coefficient of thermal expansion, for compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

Near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and rapid prototyping. The un-restricted geometry enables inclusion of design features such as septums, walls and radial features. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Corp., www.alsic.com