IMS’ family of partial wrap termination resistors offers an exposed solder fillet to facilitate visual inspection of the termination joint of the flip-chip resistor.

The flip-chip resistor delivers high frequency performance to 40 GHz, from 10 Ohms to 2 KOhms. The partial wrap around termination is available in Platinum Silver, or with a SAC solder coating.

Resistors are great for high frequency radio communications, microwave and radar applications. Offer stable ohmic value well into millimeter wave frequencies. Other applications include medical devices, test instrumentation and sensors.

Available in the following package sizes: 0302, 0402, 0502, 0603 and 0805.

IMS; sales@ims-resistors.com

Version 4.2.1 of the boundary scan environment System Cascon includes integrated support for the hardware platform Scanflex, as well as new ways of handling test vectors.

In addition to the Scanflex interface, numerous software features have been implemented, including support of eight independent, parallel TAPs and a hardware configuration tool with AutoDetect functionality to automatically recognize and manage all connected hardware – SFX-Controller, SFX-Transceiver and TAP Interface Cards (TIC), and SFX I/O Modules. Supports other Scanflex features, such as the controller architecture Space II, the Fastscale principle for controller upgrades on-the-fly, the improved ADYCS II for compensation of signal propagation delay independently for each TAP, and Hyscan technology for separated but synchronized handling of parallel and serial vectors.

The project database can handle level groups for nets and pins. Level group assignments allow external I/O channels to be set up automatically with appropriate parameters to match the voltage family of pins on the UUT they are connected to.

Improvements include new commands for the integrated boundary scan programming language Caslan, capability to import IBIS models into the graphical Device Library and new functions in the Component Explorer for intelligent UUT CAD data management.

Backwards compatible to earlier versions, supports VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232, and Fast Ethernet boundary scan controllers.

GÖPEL electronic GmbH, www.goepel.com

AL Series optical inspection and defect review system delivers wafer edge and bevel inspection.  Full bevel inspection allows user to see the top, side and bottom of the wafer from various angles using  continuous angle adjustment.  Detects particles, pits and residues that lead to hot spots on the front side, chips, cracks and scratches that cause wafer breakage, and edge bead removal issues harm the individual wafer and can result in equipment and wafer cross contamination.  Defect information and images are stored in a common defect format for tracking and yield analysis.

"A 300-mm wafer has 942 mm of edge, giving you nearly one meter of edge die on every wafer," said Greg Baker, COO. "Edge die yield remains one of the big challenges in IC manufacturing with a variety of edge defects contributing to loss. If edge defects are reduced, wafer yield improves. Olympus's new edge and bevel inspection technology enables semiconductor manufacturers to detect these defects early in the manufacturing process and track them through the process."

Perform a range of inspection and defect review tasks, including macro and micro inspection, automated image capture, operator or automated defect review, and automated defect classification.

Include a variety of visible light imaging methods using Universal Infinity Systems (UIS) corrected optics. Can integrate 248-nm Deep-UV Air Gap optics for optical resolution of 80 nm.   

Available with GEM and GEM300 factory automation software. A variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette) can be attached in various configurations (front, rear, or side load).

Olympus Integrated Technologies America, olympus-ita.com

Print-and-Apply Module is a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.

Using existing bar code information, it queries a facility's WMS or other control system for the data needed for label printing. The system can take product data from receiving or pick-and-pass operations and print a shipping label that routes the box through a facility to its final destination. Ideal when throughput requirements demand the automation of the print-and-apply function, operates at over 30 cartons/min.

Typically implemented using the BOSS control system, which handles the interaction of machine and transactional data from the PLC level to the WMS level on one PC.

Standard hardware components include the underlying conveyor, a bar code scanner and printer. Options include a weighing scale and verification scanner. An optional divert unit can redirect rejected product for manual handling. A second optional printer can be added for increased throughput and system redundancy. Can top-apply or side-apply labels.

FKI Logistex North America, www.fkilogistex.com

NORTH BILLERICA, MA --BTU International has announced a number of upgrades to its wafer bump reflow production line.

The addition of an integrated three-axes robot from Brooks Automation enhances wafer handling and the system's capability for 24x7 applications, helping to maximize equipment uptime.

A new, simplified control system that uses a single operator interface provides more precise and flexible control throughout the system, including the reflow oven and flux coater. The control system enables the use of 300-mm standards including E40, E84, E87, E90, E94 and standard SECSII/GEM interface.

Designed to be easily scalable for use in future 300-mm fabrication. Can be used as a 200-mm to 300-mm bridge tool with FOUP inserts; features Brooks Automation FixLOAD loadports for use with 300-mm FOUPs.

 
BTU International, www.btu.com

Carlsbad, CA — Machine Vision Products (MVP) will highlight the Supra M AOI system in booth 8650 at Semicon West this week in San Francisco, CA.

Modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format digital camera and a high-precision linear x/y stage. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 15 to 22 mm/pixel. Has CAD-driven, library-based programming for precise measurement of component placement and solder joint analysis.

In a 960 x 965 mm footprint, provides an acquisition speed of 20 1.4 images/sec. Can achieve up to 45 sq. cm./sec., depending on board layout and density.

Offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. Includes on-the-fly single camera acquisition, improved optics and lighting, 0201 capability and adaptable algorithms with high detectability and low PPM false accept and false reject rates.

Machine Vision Products Inc., sales@machinevisionproducts.com

IS640-333 has a nominal dielectric constant of 3.33 at 10 GHz and  a dissipation factor of 0.0038 at 10 GHz. Available in standard 20, 30 and 60 mil thickness configurations. Other configurations may be available on request. Launched to target the low noise block (LNB) down converter market. 

The complete family of IS640 patent-pending products are formulated to provide exceptional thickness and dielectric constant control without using inorganic fillers.

IS640-333, IS640-338, IS640-345, IS640-325, IS640-320 and IS640-300 are manufactured in Isola’s Chandler, AZ facility.

Isola Group S.A.R.L., www.isola-usa.com

Universal Instruments Corp. has designed a line that can assemble 2,000 microprocessors per hour (supposedly 60% to 80% faster than existing lines).

GSM Genesis platform features a twin beam gantry system and proprietary linear motors based on the company’s Variable Reluctance Motor (VRM) technology. Each beam can support one of three different heads: 30-spindle rotary Lightning head – a chip placement solution with VRM technology that is smaller than mechanical turret heads typically deployed to place small discrete components; a seven spindle Flexjet head with integrated cameras to handle a range of components; or a four spindle Pressure Enhanced (PE) head used in conjunction with a high resolution digital upward-looking Magellan camera to place challenging components that demand higher accuracy.

A chipshooter platform configured with two Lightning heads can assemble 32,000 to 37,000 capacitors/hr. Optimal tact time for the line is between 18 and 20 sec. A module comprising 16 to 20 capacitors can be addressed by a single chipshooter platform, while modules with 20 to 40 capacitors require a second chipshooter.

A flip chip platform features two PE heads. The machine’s motion control parameters – such as acceleration, settling band and stabilization time – are said to deliver higher accuracy. A special low-viscosity fluxer is integrated on the machine. With the flip chips fed in waffle packs, can assemble 2,000 flip chips/hr.

Universal Instruments, www.uic.com

Used for tracking semiconductor wafers through the manufacturing process, In-Sight 1721 offers a slimmer package and twice the speed of its predecessors, yet maintains mounting and functional compatibility with them.

“As fabs move toward full wafer traceability, they are more dependent than ever on reliable automated wafer identification,” said Justin Testa, Senior VP of ID Products. “This newest member of Cognex’s series of industry-leading wafer readers reads faster with higher yield under difficult real world process conditions.”

Advanced image formation technology and OCR, 2-D matrix and barcode recognition algorithms deliver reliable reading performance on SEMI-standard scribes. Said to provide high read rates on wafer marks that have been affected by CMP, edge beads, copper metallization, blue or green nitride coating and other process effects.

Offers flexible mounting options for easy installation on wafer sorters, ion implanters, probers and other tools. GUI simplifies set up, automatic tuning minimizes operator intervention. Built-in network and serial communications provide connectivity to other process tools and the fab network.

Available in September.

Cognex Corp., www.cognex.com.

Profiler is a technology dedicated to post-reflow inspection. Profiler technology is fully integrated into the AOI software suite and the standard model library comes equipped with preset test parameters. A user-friendly auto-setting wizard quickens the programming time and the fine-tuning of inspection programs.

Unique algorithms analyze the grey level profile of leads and joints, eliminating the need for angled camera systems which are difficult to program and give high levels of false failures. Highly robust algorithms in combination with a custom built proprietary color lighting source, enable the detection of lifted leads, total or partial lack of solder, impurities and co-planarity defects, reportedly surpassing the test coverage of a number of multiple cameras systems.

ViTechnology, vitechnology.com

CSM7100 SMD pick-and-place fulfils the requirements of a high-mix/low-volume production. The low-cost system places components from 0402 to 33 x 33 mm QFP. The narrow built feeders are intelligent and programmable to reduce changeover time and avoid setup errors.

The large number of feeders (up to 100 x 8 mm) enables manufacturing of complex PCBs in one run and allows for a broad range of standard components. Changeover effort is minimum. High feeder variety provides a wide application range and high flexibility. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Tall components (15 mm height) can be placed.

All components are aligned "on-the-fly" with a laser centring system. With this touch-less technology components are measured exactly and no damage can occur. Furthermore, the laser alignment system is self-calibrating and requires no maintenance.

Has placement rate of 4,000 cph. Footprint is 80 x 80 cm, with a placement area of 380x250 mm. LIGHTPLACER Windows-based software features a fully graphical man-machine interface. Can be programmed online or offline. Barcode labels on feeders and components guarantee the correct, quick feeder setup using a barcode reader.

The combination of the pick-and-place with a dispenser saves the cost and floor space of additional equipment. A time/pressure or screw valve dispenser can be integrated.

ESSEMTEC AG, www.essemtec.com

SML5050RBG1K-TR is a low-profile, surface-mount, full-spectrum RGB LED. Said to provide excellent performance and terrific visibility in a compact size of 5.5 x 5.5 mm. The RGB diodes emit high-intensity light in a viewing angle of 120°. The red diode's wavelength varies between 620 and 630 nm; the green diode’s is between 520 and 535 nm; and the blue operates between 460 and 475 nm. Luminous intensities range from 150 to 500 mcd at 20 mA current. A water clear lens protects the diode array.

Use with s OptiLED Light Pipes to simplify the spatial relationship between the PCB and remote indicator illumination points. Light pipes channel the LED-generated light to the exact location where the light is required. Compatibility with infrared and vapor phase reflow soldering processes and pick-and-place automated equipment make the LED series cost effective. Broadens the illumination options available for back lighting computer panels, handheld instruments like PDAs, data- and tele-communication status indicators, etc. Solid-state design renders LEDs impervious to electrical and mechanical shock, vibration, frequent switching and environmental extremes. Average life span of 100,000-plus hours (11 years.

LEDtronics Inc., www.ledtronics.com