The next-generation constraint editor system (CES) to Expedition Series and Board Station RE PCB design flows is now available. Enables definition, adherence and verification of physical constraints throughout the entire PCB systems design process for complex designs. Tightly integrates with the design flow from schematic entry through physical layout, facilitating multi-disciplined communication of high-speed design rules ad constraints between engineers, designers and their tools.

Povides a unified interface for design engineers and layout designers to specify and verify constraints. Constraints can be entered in terms familiar to team members through a common GUI and then automatically accessed by individual tools in their native formats. Features automatic differential pair identification and constraint templates. Advanced automatic topology and an interactive tuning meter are enabled when used in the design flow. 

Design rules and constraints can be developed and modified throughout the design process. These rules and constraints then become intellectual property (IP) that is available to designers and engineers for their current and future designs.

Supports bi-directional cross probing, which highlights and selects between a spreadsheet-based constraint interface and the schematic capture and layout tools, enabling designers to view nets and constraints in their native environment.  Constraint values are fully synchronized during the forward and backward annotation process with intelligent handling of connectivity changes. Nets can be constrained by one rule at the class level, significantly reducing the number of constraints manually entered in the design. Supports user- and pre-defined automatic topologies.

Mentor Graphics Corp., mentor.com

GTI-5000 x-ray image processing software upgrade includes two new features: Video Recorder and Image Analysis Workstation.

Video Recorder allows streaming of full-sized (640 x 480) grayscale x-ray images to disk at up to 30 frames/sec. Images are captured and written to disk in real-time, saved as an AVI video file. Can be played back later for analysis, releasing the x-ray inspection system for immediate inspection of other samples.

The Image Analysis Workstation can analyze (or confirm) x-ray inspections at a remote location. Allows viewing of saved x-ray images in the form of still images or video clips.

Designed for manufacturers using x-ray inspection to monitor assembled components in laboratory and production environments, said to provide accurate measurement and analysis for rapid, reliable x-ray inspection of BGA components and PCBs.

Glenbrook Technologies, www.glenbrooktech.com

EASYpick Trak3 components are said offer increased functionality, improved ergonomic features and advanced diagnostic tools. Hardware developments enable higher productivity and accuracy in order fulfillment operations, compared to conventional pick-to-light systems.

 

Snap into the track at the pick face with a cable-less connection, for easy reconfiguration. The standard 4" wide pick-to-display and 2" pick-to-light components are compact and permit dense placement and precise alignment with the pick location.

 

Acknowledgement buttons on the devices are designed for durability and easy response to finger pressure. Pressed buttons will make a connection if any of four touch actuators are engaged. An elastomer keypad design provides reliability and eliminates the possibility of keycaps falling off

 

Replace the single incandescent gumball picking direction light used in conventional picking units with six small, bright and easily readable LEDs. Depending on function, devices can display red, amber or green lights, and can be set for static illumination or intermittent flash.

 

Has self-diagnostic tools that can be run at the device and/or the network level, reducing the time required to isolate faulty hardware. Feature embedded device-level software that automatically checks and self-corrects common problems caused by power fluctuations or severed power connections.

The pick-to-light version uses pick lights to indicate bin location and bay displays to indicate picking quantities. Pick-to-light devices, like pick-to-display pick lights, can function in a dual mode controlling an upper and lower location. Also available for left/right location for pallet picking.

FKI Logistex North America, www.fkilogistex.com

 

The Micro thermal imaging system for microscopic applications consists of the Infrasight thermal imaging camera, microscopic 20 μm lens, optical mounting table, vertical focusing stage, locking xy stage with micrometers, adjustable cooling fan, Dell tower PC with LCD multimedia monitor, required cables and Thermalyze image analysis software.
 
Optional accessories include a thermal stage and controller, I/O module with eight relay outputs and wide-angle lens (resolution 100 μm to ∞). 
 
The camera obtains the temperature at 19,200 individual points on each image with temperature sensitivity of 0.2˚C for the microscopic lens and 0.1˚C with wide angle lens. 
 
The software provide real-time (30 frames/sec) viewing, automatic emissivity correction  and analysis tools to obtain the temperature information needed. 
 
Useful in R&D, design, and troubleshooting applications. 
 
 
OptoTherm Inc., www.optotherm.com

 

High-speed, continuous screen printing in the lead-free era will be the focus of DEK's presence at SMT 2005 in Nuremberg, Germany, April 19-21. DEK sees the Internet as a key tool in delivering information and services to support these objectives, and will be displaying its latest Internet platforms at its exhibition booth.
 
The company will also showcase its printing platforms for SMT applications, including the Europa as well as the new Horizon variants that integrate the new Instinctiv user interface.
 
The company will also demonstrate VectorGuard versions of its stencil technologies, including PumpPrint stencils and new electroformed stencils, as well as stainless steel laser cut stencils. VectorGuard stencils are easy and safe to use on the factory floor, store conveniently in a space-efficient filing system and are easily disassembled at end of life.
 
Güler Basol, the new Product Manager for  European Distributed Products (Consumables) division, will also present the regionalised strategy for its consumables business.
 
DEK, dek.com

EASYLINE 8088 is a die bonder for sensor assembly. Applications include pressure sensors, accelerometers, gyroscopes and other components related to the automotive, biomedical and IT markets. Offers high-volume die bond technology at an attractive price - performance ratio for the sensor and micro assembly market.

Features high-speed air bearing pick-and-place system, closed-loop linear motor pick tool for unbeaten bond line thickness control and fully automatic wafer handling system. To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.

Can handle substrates like lead frames, premolded lead frames and ceramics up to 4.5 x 4.5", great for sensor-related die bonding. Allows exact dispensing of epoxies and solder pastes. The closed-lopped linear motor pick tool provides active control of the placement height, for stable bond line thickness. An "open interface" (SMEMA) allows fast adaptation to third party systems or integration into a production line.

Front access to all major systems simplifies the operation. Footprint is 1m².

Alphasem, alphasem.com