Products
Go-Trace electronic assembly component verification and material traceability system enables materials management, part verification and exact material traceability.
Benefits include:
Real-time tracking of material location and quantity;
Automatic component cycle counting through real-time interfaces with pick-and-place machines;
Automatic feedback to the ERP system for on-hand inventory adjustments;
Capabilities for capturing traceability data and creating reports that assign correct material ID, date code, lot code, manufacturing part number and vendor to each reference designator on each board;
Supermarket management to minimize storage space on the floor and issue timely and accurate material replenishment signals;
Designed for lean manufacturing;
Duty Cycle based feeder maintenance to maximize reliability and minimize maintenance;
Moisture-sensitive material management;
Advance component outage warning;
Elimination of non-value added activities such as material chasing and manual cycle counting.
Optimal Electronics Corp., optelco.com
Zestron America will exhibit at the SMTA Upper Midwest Vendor Show on Wednesday, June 8, 2005 at the 3M Corporate Campus in St. Paul, MN.
The one day show will feature over 50 exhibitors and several technical sessions.
Zestron will showcase solutions for PCB, Stencil/Misprint and Maintenance cleaning applications. The technical and sales teams will be available at the booth to answer the latest questions on lead-free cleaning.
Zestron, zestronusa.com
Machine Capability Analysis (MCA) testing helps improve yields and reduce soldering and missing-component defects by improving dispense accuracy. By running a capability test, the basic settings and functions of the dispenser are checked (clamping, sensors, nozzles, camera, robot, etc.) so that the dispenser is once again operating within the manufacturer’s specifications.
Machine capability for an automated dispenser of adhesives or solder pastes is measured by dispensing dots of material onto a patterned glass test plate and then evaluating it in CeTaQ’s CmController5, which measures the positional accuracy of the dots. The glass plate minimizes the dimensional errors associated with an FR-4 board, for accurate, relevant measurements.
The controller measures the positioning accuracy (x,y) of the dispense gantry, and evaluates deposit accuracy as well as diameter consistency. Measurements are calculated, taking into consideration the impact of placement order, type of head, single dot versus double dot, needle configuration and other parameters.
Provides measurement technology for equipment and process capability analysis for dispensers and other production equipment; the data and measurement results obtained provide the base for stable and controlled dispensing and processing. Special vision algorithms, accurate glass plates and components allow for independent measurement of Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are validated. Certification reports validate performance. Does not require a controlled cleanroom environment.
CeTaQ Americas, www.cetaq.com
‘Plug’n Spray’ spray fluxer is a drop-in replacement for foam, wave and first-generation spray fluxers. Reportedly gives the operator control over critical parameters in the fluxing process to achieve a uniform, well-defined flux deposit and excellent wicking in through-holes. Works with no-clean, alcohol or water-based (VOC-free) flux. Claims to save up to 40% more flux than comparable fluxing systems.
Designed for the specific physical and chemical properties of no-clean flux technology, such as the typical range for surface tension and capillary viscosity of water-based fluxes. Design eliminates over- and under- spraying.
Features an air-driven, high-precision nozzle with an adjustable cone. Has computer-controlled movement, defined spray angle, short distance (30 mm) to the board surface and adjustable pressure setting of the nozzle. Nozzle is mounted on a table that is driven by magnetic force.
The field retrofit system includes a fluxing unit, a control cabinet and an exhaust hood. Generally fits into the position of the fluxer unit of virtually any type of soldering equipment; may also be installed at the input end of a soldering machine.
Cobar Solder Products, www.cobar.com
Tyco Electronics has launched an integrated system to address the Unique Identification Program (UID) recently instituted by the Department of Defense (DOD).
The system encompasses all aspects of the UID protocol as defined by the DOD and makes the user fully compliant when using specific printing and verification techniques. Includes the five elements necessary for a thorough UID specific implementation: design, printability, validation, verification (grading) and readability.
The PrintEasy label design software is capable of designing and creating a valid UID specific 2-D data matrix mark on labels, rating plates, asset tags and wire markers in addition to regular features like graphics, serialization and bar codes.
With the appropriate T Series thermal transfer printer, users can print the 2-D Data Matrix codes created with labeling software on a plethora of materials and identification products.
Once printed, users apply the label or wire marker to the package, component, equipment or a wire bundle.
The system is complemented by a range of validation imagers and verifiers (including software and precision mounted hardware) for validating, error-proofing and grading of the 2-D Data Matrix codes generated specifically for UID applications. The Verifiers also generate comprehensive electronic report cards comprising the various elements and parameters of a 2-D Data Matrix to further optimize the printing and application process.
Tyco Electronics, www.tycoelectronics.com
HOUSTON — BP Microsystems, a supplier of device programming systems, announced the release of its BP Win 4.52 and BP Dos 3.89, which offer additional support for the MAX II CPLD family from Altera.
MAX II devices enable designers to use MAX II devices in place of higher-cost or higher-power ASSPs and standard logic devices. The device family is supported on BP Microsystems' full line of device programmers in the 100 TQFP, 144 TQFP and 256 FBGA package styles. Support for the 324 FBGA package style is scheduled for release this week.
BP Microsystems, www.bpmicro.com
The TCJ Series low-profile tantalum solid electrolytic chip capacitor with a conductive polymer electrode meets the lead-free 3 x 260°C reflow requirements. Said to offer lower ESR, safer non-ignition failure mode and better capacitance retention compared to other polymer devices and conventional MnO2 electrode capacitors, all in a low-profile size (1.2 mm height) for use in portable and handheld devices (cellular phones, PDAs and digital cameras).
Suitable for power management systems with operating temperatures up to 125°C. Offer a capacitance range of 10mF to 100mF.
AVX Corp., www.avx.com
"We are pleased to bring together FCI's expertise in high speed connector design with Gore's high data rate cable technology to offer a data link that can provide an aggregate bandwidth of 1.0 Terabit per second using only 50 linear millimeters of backplane space," said David Gioconda, global data communications market segment leader for Gore. "This technology is ideal for large scale servers, telecom switches and other data intensive hardware."
The cable assembly uses cable with expanded polytetrafluoroethylene (ePTFE) as the dielectric core. The helically wrapped core ensures constant impedance throughout the length of the cables with stability with temperature cycling or flexing. Their smaller diameter and minimum bend radius reportedly allows more signal lines per area and delivers higher bandwidth performance than comparable cable configurations.
Offer low signal loss, low crosstalk, low skew, controlled capacitance and controlled impedance.
The connectors are offered in multiple configurations: 5, 4 and 3 pair per column versions and in a variety of column counts including 10, 8 and 6.
W. L. Gore & Associates, www.gore.com
Service Pack 2 for P-CAD 2004 (a PCB design system for layout professionals) includes over 130 new features and enhancements to give greater power and control over the PCB design process. Available as a free download to existing P-CAD 2004 customers.
Productivity enhancements include Variants, which can now be defined in both schematic and PCB with full ECO support in both directions. Variants can be created and edited by renaming, modifying the description, adding or removing components, and modifying the attributes of components to be placed with the Variant.
Can run multiple instances of all P-CAD applications- PCB, Schematic, and Library Manager/Executive. Provides backwards compatibility support that facilitates staggered upgrades and more trouble-free interaction between internal and external organizations. Efficiency has been improved with layer ordering for printing, andimprovements to copper pours. Comes with increased routing power due to improvements to glossing and hugging performance and the Specctra/Situs Exporter.
Enhancements were made to Bonus Technologies, including Altium Designer's Situs Topological Autorouter, which now recognizes and utilizes class-to-class rules and handles layer names with spaces in them. Clearance rules are interpreted correctly, with pad and via rules broken out into separate rules when necessary. Free Pads are no longer converted to vias. There is support for pad styles with zero height and width on top and bottom layers, layer rules from P-CAD and pre-routed fanouts in components. Split plane nets are now also handled and assigned correctly.
Available for free download at: http://www.altium.com/pcad/resources/downloads/spDownloads.
Altium Ltd, www.altium.com
Ashburn, VA - Sanmina SCI recently replaced IPA in their existing underside cleaning process with Zestron SW. The switch was prompted by the New Product Introduction Center to reduce the number of solder balls per board to comply with the IPC-610 standard. Various process optimizations with IPA failed which led to the search for a new cleaning agent. Process advantages achieved with the switch include the prevention of solder balls on the boards, a reduction in the consumption of the cleaner, a shorter process time and a higher flash point which led to increased operational safety.
Zestron, zestron.com
As the deadline for lead-free compliance looms, Grayline Inc. has announced that their manufactured flexible tubing products meet these standards. The EU directives apply to a wide range of products, including electrical and electronic equipment in which much of the tubing Grayline manufactures is used.
Grayline uses non-hazardous compounds to produce its PVC flexible tubing and can supply customers with certification of compliance if needed to verify that the compounds used in the manufacturing process are free of hazardous chemicals banned in the standards.
"Companies seeking to give their product the CE mark can feel confident that Grayline manufactured tubing will meet these standards," said Michael A. Mason, president.
Grayline Inc., graylineinc.com
FRANKLIN, MA -- Speedline Technologies will showcase various solutions and technologies in Booth 4D29 at Nepcon Thailand on June 16-19 in Bangkok.
Exhibits and demonstrations include:
The MPM AccuFlex stencil printer, suited for moderate volume high-mix printing. Combines accuracy and flexibility in a compact footprint. Offers a full range of options for future expansion. Designed for production of 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3 x 2" to 23 x 20" and is capable of printing 12-mil pitch devices with consistent accuracy.
The accurate, flexible and configurable Camalot XyflexPro dispensing system features a calibration-free linear gantry drive system, small footprint and ability to meet any application need through easy-to-add options. Whether dispensing micro dots of silver epoxy, solder paste for high-frequency devices and wafer-level packages, adhesive for 0201 components, or underfill for flip-chip packages or flip- chip-on-board, the system provides the accuracy to maintain process control.The MPM Gel-Flex Tooling System is a cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, is a true conformal board-support system.
Compressible gel provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. Available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.
Speedline Technologies, http://www.speedlinetech.com
Press Releases
- Altus Reports Growing Demand for Guidance on Convection Reflow Oven Specification
- Coherix Opens New Adhesive-Dispensing Vision Center in Europe
- Pan Pacific Strategic Electronics Symposium Program Finalized
- The Most Critical 2 Inches in SMT Manufacturing – When a Splice Fails, the Line Fails, Full Stop. Throughput and Yield Depend on One Overlooked Moment