Products
Has 51 x 51" footprint, 20 x 20 x 8" working envelope that provides ample room for the prototype short runs typical of electronic R&D companies. Smaller bed size facilitates use of a solid slab of granite for the machining table that provides increased rigidity to minimize vibration.
Features a 60,000 RPM spindle with a 0.125" collet, a three-tool automatic tool management system, Windows-based control software, a PC with 256 MB RAM and 40 GB part/program storage, CD-ROM drive, 3.5" drive, USB port, 15" monitor, keyboard, hand-held controller, Ethernet networking capability, remote monitoring capability, a removable chip disposal tray and a full machining-area enclosure with an industrial-grade door safety interlock system.
Options include a 600W, 60,000 RPM spindle with 0.250" collet, a ten-tool automatic tool management system, a flat screen LED monitor, a Z-Correction Probe that recognizes irregular work piece topology and a 3-D probe extension that locates and compensates for material irregularities in x, y and z coordinates and facilitates reverse engineering.
Datron Dynamics, www.DatronDynamics.com
Nepcon East Booth 7005
General Purpose Powder heavy-duty ultrasonic cleaning powder is said to be fast-acting and long lasting. Two pounds of concentrated powder make up to 75 gallons of cleaning solution. Each scoop generates 1 gallon of general purpose cleaning solution (scoop provided).
Easy to handle and store, mild to operator hands and biodegradable -- no acid, caustic or fuming problems. Odorless, ammonia-free and non-flammable.
Applications include removal general oils, fingerprints, dust, packaging particulates, light oils and greases from components and products. Safe on all metals including aluminum and magnesium (when rinsed promptly), plastic and rubber components, and glass.
Branson Ultrasonics Corp., www.bransonic.com
PG0255NL series of low profile SMT flat coil inductors feature saturation current rating up to 30 Amps (A) and heating current rating up to 38A. Designed for the multiphase voltage regulator modules (VRM) supporting the increasing current needs of Vcore power in PC notebooks and other DC/DC applications.
PG0255.201NL, PG0255.401NL, PG0255.601NL and PG0255.222NL have inductance values from 0.2 to 2.2 microhenries. VRM designers can tailor their designs for faster transient response with the lower inductance values or lower switching losses using lower switching frequencies with the higher inductance values.
Low direct current resistance (DCR) of 0.55 to 7.0 milliohms and low alternating current loss result in lower copper losses. Inductor windings are made of rectangular copper (flat wire) wound helically, similar to a spring. Has a larger surface area than round wire for reduced skin effect loss. Also provides a self-terminating lead.
RoHS-compliant, standard footprint is 11.5 x 10.3 mm with a low profile of 4.0 mm maximum and operating temperature from -40 to +125°C.
Pulse, a Technitrol Co., www.pulseeng.com
IMD 2297 Quadrature 3dB hybrid coupler is ideal for RF/Microwave and telecom applications. Compact, low profile and surface-mountable, the thick film product on an aluminum nitride substrate operates at 6 GHz with a bandwidth of 10%. Its typical VSWR in matched 50-Ohm alumina system is 1.25:1 or better, with an input isolation of 18 dB or better. Insertion Loss is .6 dB; phase split +/- 3 degrees; and amplitude split +/-.5 dB.
Part dimensions are .322 x .322 in., with a thickness of .025. Other sizes and thicknesses available. Terminal spacing is .205". Input Power is up to 20W depending on base plate temperature.
IMS, ims-resistors.com
B1500A is a Windows-based semiconductor device analyzer that integrates capacitance versus voltage (CV) and current versus voltage (IV) measurements. Provides a complete, self-contained and expandable solution for parametric characterization and analysis capable of handling 65 nm lithographies and beyond. Has a 10-slot configuration and supports EasyEXPERT software.
Supports three SMU types:
o High-resolution SMU (HRSMU)
o Medium-power SMU (MPSMU)
o High-power SMU (HPSMU)
A multi-frequency capacitance measurement unit is also available, and a 4.2 amp ground unit is included.
Besides integrating CV measurement into the device analyzer mainframe, the MFCMU can measure capacitance at up to 5 MHz and provide ± 25 V of DC bias. The combination of the MFCMU and SMUs within the same instrument enables these measurement resources to be more tightly coupled. When joined using the SMU CMU Unify Unit, supports capacitance measurement with ± 100 V of DC bias.
SCUU connects the two SMUs and the MFCMU together and can switch between the measurement resources without using a separate external switching matrix. Software handles all of the IV-CV switching, compensation and return path issues.
Can be used for a range of characterization needs for semiconductor devices and emerging materials, including nanotechnology devices.
Agilent Technologies Inc., www.agilent.com
Visual 3-D Engineering is a computer-based visualization method allows customers to see engineered solutions in full 3-D, including their product or tool in the cart.
The manufacturing solution allows customers to work with Bliss' engineers to share ideas instead of having to build expensive prototypes. Virtually all interference problems faced in new product development are eliminated.
"It is like looking at a photograph of a product that has not even been built yet," said Ken L. Bliss, president and CEO.
Bliss Industries, blissindustries.com
HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.
Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.
Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.Mydata Automation
Zestron Asia Pacific will exhibit solutions for PCB/ceramic hybrids, chip packaging and stencil/misprint cleaning applications at Nepcon Shanghai on April 12 - 15. The Asian technical and sales team can answer your latest questions on lead-free cleaning at booth 2H15.
The high-throughput IX-3000 is a Class 1 UV Excimer-based laser step and scan ablation system for micro-machining, drilling and laser processing.
The high-accuracy mask imaging system for large field of view (FOV) processing applications is also surrounded by a cleanroom enclosure with HEPA filtration.
Operates at 248 or 193nm UV wavelengths primarily; however, customer can choose different lasers, including: large-area patterning, microvia drilling, microelectronics micro-machining; general drilling; manufacture of inkjet nozzle arrays; flat panel displays, wafer-scale processing; sensors; microfluidics; and other applications, all with resolution down to 1 micron.
Optical resolution, repeatability and structural accuracies are sub-micron with 0.2 to 0.3 micron repeatability. Granite-based, vibration and thermal dampened for optimum stability.
Available with cassette-to-cassette wafer handling, panel-handling, robotics handling or tape and reel systems as options. Readily integrates with high-volume part handling systems.
J P Sercel Associates (JPSA), www.jpsalaser.com
The x-ray tube-based XLt is the first handheld x-ray fluorescence (XRF) instrument.
A proprietary calibration algorithm said to effectively, accurately covers the range of plastic samples used in manufacturing, while eliminating any need for user interaction or calibrations. Unlike benchtop systems, can be used on the assembly line, in the warehouse or as a benchtop instrument operated via wireless connection to a PC or PocketPC device.
Provides fast, accurate confirmation analysis of lead-free solder and electronic components, insuring compliance with European Union directives slated to go into effect in July 2006.
Automatically encrypts analysis results against unauthorized editing.
Calibrated for the quantification of Cadmium (Cd), Lead (Pb), Chromium (Cr),
Antimony (Sb), Tin (Sn), Mercury (Hg), Bromine (Br) and other toxic metals.
Niton, www.nitom.com
A variety of accessories for P2010 multi-stage ejector vacuum pump are available. Designed to save energy costs, space and time, they create more versatility in functions for electronic manufacturing applications requiring light and reliable pick-ups.
Can be accompanied by one type of Blow-off, four types of Quick-Release and one DIN-rail mounting bracket. The accessories are mounted by pressing the two stems of either aluminum housing into the push-in connections of the housing. The DIN-rail mounting bracket is fastened by screws to the four connection holes on the underside of the pump.
Quick-Release can be redesigned to suit a variety of applications, as the user can add any desired number of tanks. The units can all be complemented with a vacuum switch in M5 thread, PNP or NPN design. The vacuum switches can be connected either directly to the M5 thread of the housing or to the M5 thread of the Blow-off unit.
The pump stands 1.08" high and weighs 0.54 ounces. Driven by compressed air, does not require motor and oils.
PIAB Vacuum Products, www.piab.com
The next-generation constraint editor system (CES) to Expedition Series and Board Station RE PCB design flows is now available. Enables definition, adherence and verification of physical constraints throughout the entire PCB systems design process for complex designs. Tightly integrates with the design flow from schematic entry through physical layout, facilitating multi-disciplined communication of high-speed design rules ad constraints between engineers, designers and their tools.
Povides a unified interface for design engineers and layout designers to specify and verify constraints. Constraints can be entered in terms familiar to team members through a common GUI and then automatically accessed by individual tools in their native formats. Features automatic differential pair identification and constraint templates. Advanced automatic topology and an interactive tuning meter are enabled when used in the design flow.
Design rules and constraints can be developed and modified throughout the design process. These rules and constraints then become intellectual property (IP) that is available to designers and engineers for their current and future designs.
Supports bi-directional cross probing, which highlights and selects between a spreadsheet-based constraint interface and the schematic capture and layout tools, enabling designers to view nets and constraints in their native environment. Constraint values are fully synchronized during the forward and backward annotation process with intelligent handling of connectivity changes. Nets can be constrained by one rule at the class level, significantly reducing the number of constraints manually entered in the design. Supports user- and pre-defined automatic topologies.
Mentor Graphics Corp., mentor.com
Press Releases
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