Products
SDS130 Magnetically Shielded Surface Mount Power Inductors feature a ferrite core and shield. Designed in a low-profile, compact package with maximum height of 0.118" (3.0 mm), the inductors offer low DCR with high-energy storage. Ideal for input/output of DC/DC converters, signal conditioning and filtering applications.
Offer 26 inductance values from 2.2 to 470 µH, and current ratings from 200 to 3000 mA. Operating temperature range of -40 to +85°C, available on 24 mm tape and reel with 1000 pieces per reel.API Delevan, www.delevan.com
Said to exceed the performance levels of competitive models for maximum dynamic deflection and maximum relative motion (IRDmax). Easily customized, legstands are available in two basic designs (modular rigid upgradeable supports or fully configured state-of-the-art systems) and five standard heights, with load capacities ranging from 500 to 2000 lbs. per leg.
Options include special shapes, cutouts and notches as well as a choice of core and skin materials including aluminum, nonmagnetic stainless steel and Invar. Accessories include laser ports, shelves, tabletop enclosures, retractable casters and modular splices for joining tables in "L", "U" and "T" configurations.
Kinetic Systems Inc., www.kineticsystems.com
Specially formulated for low-etch/high capacity operations, offers up to 60% reduction in consumption and waste treatment. Featuring a low copper etch factor of 0.9 - 1.1u, copper loss from fine lines and thin copper is reduced, improving performance on controlled impedance.
Other benefits include:
Reduction in consumption and waste treatment;
Increased peel strengths on High Tg dielectrics;
Less frequent bath changes with increased up-time;
Improved yields and reliability.
Enthone Inc., www.cooksonelectronics.com
Hardware capabilities include an increase in vertical travel speed from 29 in./sec. to 55 in./sec.; specialty trays in widths up to 157" (98" standard) and weight capacities up to 1100 lbs (880 lbs standard).
An integrated parts lookup table enables the operator to search for a part number and then have the module automatically retrieve the tray where the part is stored.
Other control modifications include new screen designs on the unit's touch-screen keypad. Additional software control choices are also available.
Rack-and-pinion drive allows pinpoint retrieval of item trays without adjustment. Available in heights from 10 to 50', features options such as a tilt-tray up to 45°, a lift system that adjusts the height of the pick tray and a lockable powered door.
FKI Logistex, www.fkilogistex.com
Soder-Wick Lead-Free Desoldering Braid is engineered for high-temperature, lead-free solder removal. Maximizes heat transfer to the solder joint, melting the solder faster and more efficiently than conventional desoldering braids. Designed and optimized for all lead-free solders, said ton prolong the tip life on soldering irons.
ITW Chemtronics, www.chemtronics.com
HYSCAN is based on a new hardware-independent emulation method and relieves the user from the entire handling of serial-to-parallel vectors. Test program generation and fault diagnosis can be done without knowing the type of test access. The parallel test vectors are connected with the individually configured pin electronic by means of Wrapper Modules. By exchanging these modules, the parallel vectors can be linked to the required pin electronic without re-compilating the test program. The first supported pin electronic are the parallel I/O modules PXI 5296 and PXI 52192 with 96 and 192 test channels, respectively.
The Component Explorer is a graphical tool for the interactive generation and manipulation of intelligent design data. Unknown components and complete component cluster can be defined and implemented into the database. Is directly linked with Scan Vision tools for the visualization of schematic and layout as well as the graphical library.
The Navigator tool for the interactive user guidance gives support in terms of hyperlinks, videos or topic related documents.
The new version is downwards compatible to all previous versions and supports all Boundary Scan controllers on basis of VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232 and Fast Ethernet.
GÖPEL electronic, www.goepel.com
TestXcell provides automated test equipment (ATE) programming, DFT analysis, fixture design output and schematic viewing. Also features design data importing/exporting and a component database pre-populated with 36,000 electrical models and 1,000 package models.
Allows management of the test process from intelligent graphical design data input through net adaptability checking, component testability checking and full mechanical fixture design to the generation of tester input lists and circuit description files.
Supports all major ATE systems and CAD import formats.
Aegis Industrial Software Corp., aiscorp.com
New style spray system increases wash solution impact pressure 5X over previous models. Nozzle's spray angle is decreased from 50° to 15°, and the flow rate is increased by approximately 60%.
New style spray arm doubles the quantity of spray nozzles. Uses 10 nozzles arranged to create 10 concentric spray patterns.
New oscillating board rack eliminates blind spots by creating infinite impingement angles. The stroke of the oscillating board rack is approximately equal to the nozzle spacing, creating multi-directional impingement.
New multi-stage spray pump designs provide increased pump performance and efficiency. The pumps are optimized for pump utilization, longer pump life and lower electrical costs.
Aqueous Technologies Corp., aqueoustech.com
Featured technologies include scanners and gateways, power supplies and repeaters, I/O modules, Safety at Work components, intelligent photoelectric and inductive sensors, as well as rotary encoders, accessories and cables. Visitors can request a hard copy or download PDF information at: www.am.pepperl-fuchs.com/literature/litform.asp
Pepperl+Fuchs
CATSWeb Records Management allows easy, effective compliance with corporate record retention policies. Designed to address business requirements for electronic recordkeeping and compliance, while allowing a quick ROI, compliance enforcement and lower exposure to risk.
Automates the process of archiving or purging records and documents that meet configurable criteria. Facilitates compliance with regulatory requirements and standards related to records management; improves productivity and effectiveness of administrative staff; minimizes legal liabilities by ensuring that records are kept for only as long as they are useful and needed, consistent with corporate policies; and eases location and retrieval of archived records via integration with record-level audit trail and built-in query and search engines.
AssurX Inc., assurx.com
Standard connectors feature .002" (0.05 mm) wide conductors on .004 " (0.1 mm) centers for a conductor density of 250 per inch. Despite the fine geometry of the contacts, the material is said to be strong and durable enough to withstand repeated uses and will not break or fracture.
Z-Axis Connector Co., zaxisconnector.com
Said to provide cost-effective protection without a substantial investment in process changes and redesign, while maintaining the high yield and throughput required by electronic assemblers. The reusable custom-fitted caps keep semiconductor packages below 245°C or 260°C and minimize temperature variation within packages from over 10°C down to 2-5°C, while minimizing warpage, popcorning and delamination.
Can be used in no-clean, water-soluble or RMA processes as a temporary heat sink that can be placed on components either by hand or with existing pick-and-place equipment. No adhesive is required and no residue is left on boards or components. Can be designed to cool the package body, allowing reflow underneath, or to "overcool" - preventing reflow in cases such as adjacent packages during rework.
Cookson Electronics Assembly Materials, alphametals.com
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing