Milara Inc. will showcase its STW-1 wafer printing system in booth 9821 at the Semicon West show July 12-14, in San Francisco.

SemiTouch Wafer Printer system offers wafer stencil printing and bumping in a single system. By pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds.

Incorporates a vision system with accuracies of 12 µm that yields capabilities of ultra-fine-pitch printing. Uses patented vibration squeegee technology, employs the same technology to accomplish ultra-fine pitch-printing (down to 70 µm) with 100% printing reliability (no missed apertures on wafers with excess of 25,000 per print) in conjunction with solder brick geometry.

Capable of printing 300 mm wafers. Environmentally friendly, uses less paste than standard systems and has less waste build-up.

Milara Inc., milarasmt.com

SUN VALLEY, CA— Creative Automation Co. will highlight its automated dispensing system, Champion 6809, in booth 7531 at SEMICON West.

The servo-driven dispensing system, designed for precision processes, features proprietary software, a GUI for intuitive programming and control, and a large, bright, high-contrast color TFT display. Can be configured to match application requirements from dots to underfills with an array of options. Placement accuracy is within 3 mm.

Designed for nano dispensing, dispenses dot diameters down to 0.003" (75 mm) with bead width down to 0.003" (75 mm). Volumes are below 0.5 nanoliters (0.0000005 cc’s), and the pump is capable of firing up to 90,000 precision deposits per hour to form high-definition dots, lines, fills and builds. Volume repeatability is 1.7% at3 Sigma.Uses true positive displacement without augers and pump motors. 

Comes standard with a three-axis brushless servo motor drive; x- and y-axis linear encoders, z-axis rotary encoding; powerful Windows-style software; LCD display; rugged construction and quiet operation; a small footprint; and a one-year warranty. 

Creative Automation Co., creativedispensing.com

The 1860 Digital Megohmmeter is designed for measuring insulation resistance of components, leakage resistance measurements on capacitors and for resistivity tests on samples of insulating material.

The economical unit, with large LCD display, is said to be easy to setup and operate in all test environments. Comes standard with an RS-232 and remote control interface. Limit) Function/NO-go Display Indicator

Quick-select programming, simple controls and indicators combine for efficiency of test and productivity. Simple, intuitive front panel connection and programming. Is lightweight, portable.

Both the test voltage and resistance measuring range are readily accessible allowing an operator to make changes quickly. Provides operator programmable charge and measure times out to 999 seconds.Visual display enables a quick perception status and display of the test results as text (Digital) and bar graph (Analog).

Can be integrated into an automated manufacturing environment with remote start and GO/NO-go results output. Includes a built-in calibration function that checks the accuracy of the measuring voltage and current measure circuit.

QuadTech, quadtech.com

The Nikon ECLIPSE LV series includes the ECLIPSE LV150, LV150A (with automated nosepiece) and the ECLIPSE LV100D (episcopic/diascopic illumination) microscopes. Said to address the need for precise microscopy measuring solutions to keep up with higher performance demands in the semiconductor and medical device markets, the rapid development of new materials and the inspection requirements of components with widely varying dimensions. 

The modular design allows versatility and flexibility that enables it to cover a variety of applications, from development and quality control to manufacturing inspection. Reportedly provide superb performance when inspecting semiconductors, flat panel displays, packages, electronics substrates, materials, medical devices and other samples. Can accommodate sample heights from 47 to 82mm by inserting a column riser between the main body and arm of the microscope. This feature is useful for viewing the surface of precision molds, optical materials and other thick samples.  

Accepts industry-supplied stages handle samples up to 116.5 mm, for observation of fiber ends and other tools. Features a range of industrial stages and accessories, all are durable with a new triple plate design.

A variety of observation methods are available, including: first order compensator, UV polarizing and epi-fluorescence -- in addition to brightfield, darkfield, DIC and simple polarizing. Have a high- intensity, low-power consumption white halogen light source, and an adjustable high intensity mercury fiber light source.   

Nikon Instruments Inc., www.nikonusa.com

MYLabel keeps track of each individual reel, stick or tray used in an SMT production line. Vital production data, such as tape pitch, orientation, batch code and quantity, are stored in a central database and used for feeder loading and complete traceability. New features include easy data extraction from the supplier’s barcode label and barcode-activated functions for ergonomics.

When registering part deliveries, the software will recognize the component supplier’s barcode label, regardless of format and coding standard, and extract the part number, quantity and batch ID. Attribute parameters, such as tape pitch and orientation, are then extracted from the part database, and a new entry is created. The risk of mislabeled parts is eliminated, since no manual data entry is involved in the registration and labeling process.

Features sound signals that alert the operator about error conditions, and barcode-activated instructions for common tasks, like Print and Discard.

Integrates with other factory software using ODBC/SQL.

MYDATA automation

W. L. Gore & Assoc. has released the GORE 100 Series Connectors, the newest addition to the GORE Blindmate/Push-on Connector family. The connectors are a high-density blindmate, microwave interconnect system offering performance through 100 GHz.

An extension of the SMP and SMPM connector families, the connectors were developed for increased packaging density, low mass and increased performance at higher frequencies. Blindmate interfaces said to be robust, durable and lightweight. A socket-to-socket bullet weighs less than 0.02 g. The connectors accommodate radial and axial misalignment with negligible VSWR change.

“The 100 Series Connector is 35% smaller than the current SMPM connectors,” said Paul Czikora, microwave connector technologist. “They offer increased electrical performance and reduced mechanical footprint, enabling designers to create thinner, lighter, smaller and more cost-effective TR modules, printed circuit boards and power dividers.”

W. L. Gore & Assoc. Inc., gore.com

CR-5000 Lightning was created to meet the demands of increased electronics design complexity resulting from the growth in density, miniaturization and multi-functionality of products.

The unique technology was born from collaboration between R&D teams in  Japan, the UK and Germany. Combines PCB design and simulation for fast, efficient design that enables users to solve high-speed design issues early in the process. 

Fully integrated design environment into CR-5000 Board Designer and CR-5000 System Designer ensures a fully adopted frontloading approach, allowing users to share information through a unified database within the high-speed design environment. In-depth analysis and what-if capabilities available throughout the design process enable engineers to explore design scenarios, trading off signal integrity parameters such as crosstalk, timing or EMI requirements, against mechanical and thermal constraints.

Offers:

Unified and shared design constraints, to eliminate complexities associated with separate design and provide control for activities such as circuit design, floor plans and board design;

Unification and communication between board design and system design with high-speed constraints and analysis;

Unified Analysis Engine Sharing;

and Frontloaded Verification.

Additional features include 'Trunking', H-Tree Routing and Interactive Lengthening.

Zuken, zuken.com

Total Parts Plus’ material content database has expanded its coverage for electronic and non-electronic components to more than 2.5 million part numbers. Data coverage includes full and partial content information, Restriction of Hazardous Substances (RoHS) compliancy flags, lead-free identification, exemption tracking, compliant alternates, tin whiskering data and reflow temperature.

Total Parts Plus has been collecting material content data since the announcement of the European Directives and has added RoHS compliancy flags to its material disclosure information to help manufacturers identify compliant replacements quickly.

Libra Industries has introduced a lead-free transition services package to help manufacturers extend their internal engineering capacity to successfully comply with the RoHS directive. 

The package consists of in-house BOM review and conversion, and assistance with product redesign though Libra’s Design Service.  The company has partnered with Engent Inc. (Norcross, GA) to offer pilot assembly and reliability testing for new lead-free product designs. These services are available a la carte, or as a complete package.

Libra Industries, libraind.com

DEK will show its cost-saving, throughput-enhancing packaging technologies at  booth #7111 during Semicon West in San Francisco.

The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.

Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.

Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping. 

DEK, dek.com

Samtec has announced the addition of RF cable connectors and cable assemblies to mate with its line of MMCX, MCX and SMA connectors.

SMA subminiature RF cable assemblies are available with straight and right angle terminations and feature high durability, compact semi-precision connectors. They use .085” (2.16 mm) and .141” (3.58 mm) semi-rigid cables and standard flexible cables, including double-shielded RG-316.

Mini connector cable assemblies are available as jacks and plugs and with a choice of straight or right angle terminations. These quick connect/disconnect style connectors are for applications with limited weight and space availability.

Micro-Mini cable plugs are also available with straight and right angle terminations, and feature quick connect/disconnect style snap-on mating.  A “Ganged” variation is also offered for terminating two, four, six or eight wires simultaneously.

Samtec Inc. , samtec.com