Circuits Assembly Online Magazine - News

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The new WaferRepair platform addresses the technology requirements associated with the reliable, cost-effective laser fuse processing of high density DRAM and other memory devices using redundancy, as well as laser programming for device customization and repair of non-memory devices. Delivers refinements in beam placement accuracy, laser spot size and ultra-fine, ultra-stable energy control that enable the processing of extremely tight-pitch fuse structures for yield enhancement. Feature the system precision required by 90-nm and smaller design rules.

Based on the new platform, the M450 fuse processing system features a laser spot size of 1.4 µm. The M455 has a laser spot size of 0.7 µm, enabling aggressive fuse pitch shrinks below 2 µm. Both process fuses at a rate of 60,000 Hz with beam-positioning accuracy of +/- 0.150 µm.

GSI Lumonics Inc., gsilumonics.com

ITT Industries, Cannon now offers many of its switch products in lead-free versions. Many also contain no cadmium, mercury or other toxic substances, such as hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers.

Switches such as the trackball navigation switch, and KMR, KMS, TPC, TPA and KSU tact switches are completely free of all chemicals mentioned above and are completely compatible with lead-free solder processes.

ITT Industries, Cannon, ittcannon.com

Following the adoption of the PumpPrint process from DEK printing machines and the installation of DEK Infinity printers, Tianjin-based OEM HEG has made significant improvements to its adhesive application process yields.

The company uses the machines to apply SMT adhesives for their automotive and consumer electronics products, replacing their SMT dispensers.

Since the installation of the printers, overall production defect rates have dropped to 20-30 ppm, as confirmed by HEG's quality assurance measures, which include 2-D inspection, visual inspection, AOI and electrical test. The company also reports that throughput for boards that require adhesive application has increased to more than 135 PCBs/hr, and over 81,000 adhesive dots/hr.

According to HEG, a major advantage of the PumpPrint process is its ability to operate even in harsh environmental conditions, as the process can adapt to quite a range of temperature and humidity conditions and glue viscosity levels.

HEG currently operates 21 automatic insertion machines, seven fully automatic SMT lines and nine manual assembly lines, reportedly achieving 8.16 million SMD placements/day and 8.68 million insertions/day.

Board-Lok ESD-safe molded tooling is designed to support PCBs in a firm, locked position parallel to the stencil.

The customized tooling can eliminate problems seen with conventional stencil printer tooling because it does not require vacuum to support the board. If the PCB is held by vacuum cups, the solder paste can be drawn through the via holes, contaminating the board and vacuum system.

Transition Automation Inc., www.transitionautomation.com

EasyTurn is a modular ‘T'- shaped junction that will send a board, on command, in either of two different directions, depending on need. When integrated with an AOI system, it can send defective PCBs to a magazine loader or to a rework station, while failure-free boards move directly to the reflow oven. Automatically adjusts to the specific width of each incoming board to prevent dropping or damage.

CAN-Bus controlled unit with full SMEMA compatibility for easy integration into any conveyor line. Can also be used as a linking unit from two conveyor lines into one reflow oven.

MIMOT, www.mimot.com

VISULA 7.0 enterprise-wide PCB design suite now features an embedded Place and Route Editor, P.R.Editor XR, and the Hot-Stage virtual prototyping tool. The Place and

Route Editor delivers improved routing functionality for faster completion of dense and complex PCBs, while the Hot-Stage tool facilitates a constraints-driven design process where potential signal integrity, EMC and manufacturing problems can be identified and corrected early in the design flow.

Ease of use improvements include damage repair, additional INI file settings for the layout editor and the addition of switchable toolbars with on-screen tool help, as well as improved Windows font support. The library tools support Windows XP as a database server. Design Technology Editor now features pad copy enhancement and automatic removal of legacy analysis data.

Introduces Activ-45, an automated 45-degree routing function, to the suite. The embedded router eliminates the need for a separate tool. P.R.Editor XR 1.4 allows batch checks to be made in embedded mode, can check against actual copper text vectors and can locate errors by code.

The Hot-Stage constraints-driven virtual prototyping tool facilitates ‘what if' analysis of design changes at the schematic stage. It ensures that design constraints can be maintained throughout the workflow.

Zuken USA Inc., www.zuken.com

Indium 3.1 water-soluble lead-free solder paste is said to offer excellent wetting and printing for fine-pitch applications, and a long stencil life that virtually eliminates solder paste waste. Resultant sodler joints are shiny and smooth. Also claims a wide reflow window, slump resistance, low voiding and low foaming.

www.indium.com

ISCAN (Intelligent Scaleable Control Area Network) architecture is based on Field Bus technology, which transmits packets of information digitally and is the basis for today's modern telecommunications systems. When this principle is applied to printing systems, ISCAN enables machine control, translating to economic efficiency.

According to Mick Bartholomew, manager of DEK's electrical design team, "Communication with the machine is now more advanced... Instead of just turning a motor on or off, ISCAN lets us send a message to tell the motor how far to travel, at what speed, acceleration and deceleration. In turn, the motor can reply, telling us that it has reached position, how accurately the velocity profile was followed, the amount of current that was used and much, much more. We can now read power supply levels and check circuit status without even opening up the machine. And, all this information is additionally accessible remotely via the Internet using DEK's Interactiv system."

The intelligent communication allows for trend analysis, which can monitor overall machine health and predict routine maintenance

dek.com

FRANKLIN, MA, Nov. 15 - The MPM Accela screen printer has a completely new design and operator interface, and reportedly delivers raw throughput gains of 20 to 30%. This is aided by a parallel processing setup in which all axes move simultaneously. The machine is designed for applications such as cellular phones and automotive.

The new platform is said to

Reduce setup, changeover and consumable downtime (to 5 minutes from 20), and features tool-free hardware interfaces
Deliver equipment robustness, ease of operator use, and a module level design with CanOpen controls, with no tools needed to switch from pumps to blades.
Feature easy service, support, and upgrade capability, all within the same footprint as previous MPM printers.
Offer 0.0005" accuracy for alignment and repeatability, and 0.001" print accuracy.
Handle higher density, more complex boards as well as lead-free manufacturing requirements.
Board sizes handled are 2 x 2" to 20 x 20", and thickness of 0.15 mm to 12.7 mm and up to 7 kg (15 lbs.).

The printer has been awarded two U.S. patents, and nine others are patent-pending.

Speedline Technologies Inc.

ALPHA EF-8000 lead-free no-clean wave solder flux claims to provide excellent first pass yields, worry-free in-circuit testability and excellent electrical reliability in lead-free and tin/lead wave soldering applications. IPC rated ROL0, exceeds the Bellcore and JIS standards for electromigration and surface insulation resistance, as well as more stringent electromigration and bulk insulation resistance requirements from leading OEMs.

"ALPHA EF-8000 flux creates a new industry standard for broad latitude application, because it withstands the higher PWB surface temperatures required for successful lead-free soldering, but it is fully capable for use in standard tin-lead applications," said Mitch Holtzer, global product manager. "In addition, it can be qualified now for emerging lead-free requirements, and used in lead-free or tin lead production lines."

Low rosin content minimizes flux residue buildup on pallets and wave soldering equipment normally associated with high (>10%) rosin flux formulas.

Cookson Electronics Assembly Materials, alphametals.com

RFS-20 constantly recycles rinse water from stencil and batch cleaners, saving water, energy and disposal costs. The fully automatic system constantly filters the rinse water and returns it to the stencil cleaner for re-use, eliminating the need for evaporators, haulage or in-house wastewater treatment facilities. A four-stage filtration system cleans the rinse water and returns it to the cleaner.

Three-way valve allows the rinse tank fluids to be power drained when changing fluids during periodic maintenance.

Filtration system consists of an in-line solder trap, a 10-micron polypropylene filter, an activated carbon powder filter to remove organics and a 5-micron polypropylene filter for fine particulates and organics. Rinse tank water is constantly re-circulated, extending the bath life of both the wash and rinse tank fluids in the cleaner.

JNJ Industries, jnj-industries.com

The laser fan width control option provides closed-loop monitoring of the conformal coating process. Fan width is important to monitor to ensure consistent, repeatable coating patterns. The option is designed to work with the Century series conformal coating system and the patented SC-105/205 Film Coater applicator for low-viscosity coating materials.

Temperature variations and other environmental factors often affect the viscosity of coating materials, changing material flow and fluid fan width. Measures the fan width with a laser sensor and adjusts the system parameters as necessary. Can achieve edge definition of 0.76 mm (30 mil) and speeds up to 400 mm/sec (16 in/sec).

Asymtek, asymtek.com