Micro-Meter 2 Servo is a positive-displacement, two-component meter-mix dispensing system designed to apply small precision beads and small metered shots of precisely mixed resins. Servo-motor design provides consistent, repeatable bead profiles and variable-flow-rate metered shot volumes. Said to improve production rates and product quality, and reduce manufacturing costs.

Provides a variety of preset material-dispensing profiles and dispense results. Can dispense precisely mixed materials for different part configurations. It can be preset to vary the flow rate during dispensing—to change the bead profile in gasketing or fill rate in potting applications—in automated, indexing, xyz-motion and robotic processes. The control will also accept commands from the automation.

Snuf-Bak or No-Drip dispense valve is provided with seals matched to each dispense fluid and designed for long life in high-cycle dispensing applications. Dispense valve may be remote mounted. Disposable No-Flush mixers mix and dispense virtually all two-component materials including epoxies, polyurethanes and silicones. 

Sealant Equipment & Engineering Inc., www.SealantEquipment.com

 

Integrated Reliability Test Systems (IRTS) Inc. announced that Rockwell Collins has purchased a Highly Accelerated Thermal Shock (HATS) System.
 
The system, scheduled to be installed in September, will service Rockwell Collins' in-house thermal shock testing requirements. Two HATS systems were previously installed at Intel Corp. and the Hong Kong Productivity Council last year.
 
The system, which has been in use by the IPC PCQR² Database for reliability testing of via daisy-chain structures since October 2003, offers:
 
Built on existing air-to-air thermal shock standards (IPC-TM-650, Method 2.6.7.2B)
Reduced operating cost over dual chamber systems
Reduced cycle times by 50 to 70%
36-coupon capacity with 4 nets per coupon
Temperature cycles ranging from -60 to +160°C
20 4-wire precision resistance readings per second
 
Integrated Reliability Test Systems, www.hats-tester.com

 

EM4D-100L is a 2 mm square, 8-pin DFN package, 4-line low pass filter array with integrated TVS diodes. Designed to suppress unwanted EMI/RFI signals and provide ESD protection for high-speed data interfaces such as color LCD displays, camera imagers in mobile phones and PDAs.
 
With a desired cutoff frequency of 150 MHz, provides EMI/RFI attenuation better than 35 dB in the 800 MHz - 3GHz bandwidth. This blocks RF noises from GSM, DCS or Bluetooth, which affect the baseband chipset and other blocks. Meets the immunity test standard IEC 61000-4-2 at all levels, providing ESD protection.
 
In standby mode, integrated TVS filter has a very low leakage current (less than 100 µA) - an essential feature for battery powered handheld devices.  In addition, the low profile durable 8-pin DFN package is useful in many applications.
 
ProTek Devices, www.protekdevices.com

 

For design engineers facing thermal cycling issues with power components in high-temperature environments, IRC has developed a "capped" version of its cylindrical power resistor that delivers thermal compliance and thermal isolation from circuit boards.  The SMC Series Metal Glaze resistors are available in ratings up to 2 watts.
 
Designed to solve the problem of thermal mismatch between FR4 PC boards and ceramic components. 
 
Applications include high power-density applications, such as underhood automotive control units, GFI control circuits, as well as any application where high thermal stress is present. Can be a potential cost saving replacement for bulky surface-mount wirewound devices.
 
Rated for 1 W at 70ºC, with resistance values from 0.1Ω to 1MΩ, in standard tolerances of ±1%, ±2% and ±5%, with TCRs as low as ±25ppm/ºC.  SMC2 Series resistors are rated for 2W at 25ºC, with resistance values from 0..2Ω to 2.2MΩ, in standard tolerances of ±1%, ±2% and ±5%, with TCRs as low as ±25ppm/ºC.   Operating temperature range is from -55° to +150°C.  All are RoHS compliant and suitable for high-temperature soldering processes.
 
Feature a MetalGlaze thick film element fired at 1,000ºC to a solid ceramic substrate and a high temperature dielectric coating that is impervious to degradation in high-moisture environments. 
 
IRC Wirewound and Film Technologies Division, www.irctt.com
           

KIC has expanded its library of solder paste process windows within the KIC 2000 software to 788. This number includes reflow and cure specs, as well as a host of new lead-free solder paste process windows.

 
The library is scheduled to be updated with new pastes every quarter, and is available for download to KIC 2000 platform users free of charge. With the addition of solder pastes to the library, the following dialog will be displayed on the Web site when a user clicks to download the file: "This release of the KIC 2000 Solder Paste Specs Library contains updated information for the following manufacturers: Almit, Avantec, Cobar, Indium, Kester, Koki, Loctite and Multicore." For paste manufacturers that are not listed above, KIC will attempt to provide updated information in the next release. If a solder paste is being used that is not listed in the Library, users can select the "Define Your Own Spec" option and manually enter the data that is given on the technical data sheet provided by that paste's manufacturer.
 
Each future update will contain the list of any manufacturer whose data has been changed/updated. This allows the user to know ahead of time whether they need download the file or not.
 
 
KIC, www.kic-thermal.com
 

Macromelt is a low-pressure moulding solution for packaging of vehicle sensors. By replacing conventional sensor enclosures that require potting, it reduces the complexity, time and cost to assemble the large number of sensors required by modern vehicles.

Simultaneously encapsulates the sensor's circuitry and forms the outer shell of the component to enable a self-contained and highly integrated component. The composition of the moulding material, a polyamide hotmelt, is available in a variety of formulations.

Compatible with a range of vehicle sensors and highly miniaturised door-handle electronics as well as new technologies such as intelligent battery sensors and screen-mounted antennas with integral cable stress relief. Pre-moulded connectors and sealed units plus grommets and strain relief components can also be manufactured.

Available in translucent amber or black, standard, with a variety of colors available to special order. Resistant to fluids commonly found in automotive environment such as antifreeze, petrol or diesel and hydraulic fluid. Can operate from -40 to +150 ºC.

Henkel, www.electronics.henkel.com
 

TT Electronics BI Technologies Electronic Component Division recently developed RoHS-compliant thin film resistor networks. The networks are comprised of a matte tin finish over copper lead frame.  

"We are pleased to offer RoHS-compliant thin film resistor networks that are both backward compatible with existing leaded solder profiles and forward compatible with lead free solder profiles," said Mike Torres, applications engineer and product marketing manager.

To distinguish from existing products, a suffix "LF" is added to existing part numbers. The packing labels will also identify the products as RoHS-compliant.  BI will continue to support the original lead-bearing thin film resistor networks as well.

Packaged in all-plastic molded packages, are fully compliant to RoHS Directive 2002/95/EC, with no exemptions. The devices undergo a process of anneal baking after tin-plating to reduce tin whisker growth.  

Network series available include 6XX Nichrome on ceramic and SXX Nichrome on silicon families. 
 
BI Technologies, www.bitechnologies.com

LSM-544 Series Laser Scan Micrometers offer accuracy and versatility.  Multi-face polygonal mirrors and high-speed motors make the instruments to perform up to 1,600 scans per second.  Ideal for measuring items moving on-line at high speed such as fiber extrusions or for measuring vibrating workpieces.

Available in a variety of models for use in applications ranging from measurement of ultra-fine wires (0.005 mm diameter) at very high resolution (0.01 µm) to cylindrical workpieces as large as 120 mm.  Other applications include: x- and y-axis measurement of electric cables and fibers, unevenness measurement of film and sheet, sheet thickness measurement, interval measurement of IC chip leads, gap measurement, measurement of laser disk and magnetic disk read/write head movement, pin-and-plug gage measurement and numerous similar tasks.

Available with integrated or remote displays depending upon model, accessories include adjustable workstages and fixturing blocks, calibration gage sets and air blow covers. A standard RS-232C interface and SPC output are provided on most models.  Dust- and splash-proof IP64-rated models also available.

Mitutoyo America Corp., www.mitutoyo.com 

 

 

The AirMax VS family now includes a low-profile 3-pair connector. Contains fewer pins per column than other connectors and has a slot spacing of 16.7 mm.
 
"The low profile of the AirMax VS 3-pair makes it ideal for use in blade servers and storage devices," said John Burkett, product manager. "The small slot spacing creates an open box that allows more airflow and cools the system, reducing the chances of overheating in systems such as servers."
 
VS System uses air as the dielectric between adjacent conductors, providing high signal density while exhibiting low insertion loss and crosstalk, without the use of metal shields.
 
The design of Insert Molded Leadframe Assembly (IMLA) enables the same connector to be used for Differential Pair signals, Single Ended signals or power. Combining EMI optimization with the use of air as a dielectric, designers can freely mix Differential Pair, Single Ended signals and power in one connector. Allows for any allocation of signals within one connector, so  systems can grow from 2.5Gb/s to 25Gb/s without requiring redesign of the basic platform.
 
Available in 6 IMLA or 54 positions, 8 IMLA or 72 positions and 10 IMLA or 90 positions.
 
FCI, www.fciconnect.com

 

The assembly of bare die in complex package configurations and/or with unique assembly processes is becoming more commonplace. Bare die are also being assembled together with a variety of other components and mechanical parts. Key applications driving this trend include remote sensing, distributed control, identification and 3-D assemblies.

To address the needs of these applications, Hover-Davis and Alphasem have agreed to work closely together to offer customers complete flexible die/component assembly solutions. For feeding bare die and flip chips, Hover-Davis will be providing Direct Die Feeders for integration into the Alphasem Flexline. The Flexline is an adaptable assembly platform capable of a handling a variety of components and processes. 

Hover-Davis, www.hoverdavis.com

 

 

Gage Applied Technologies has introduced optional on-board Signal Averaging FPGA Technology in its high-resolution digitizers. Allows users to detect very small signals in noisy environments.

 

Signal Averaging capability takes advantage of the on-board FPGA technology on select Gage 12 and 14-bit digitizers and allows rapid signal averaging with no CPU-loading on the host PC. The process consists of making multiple acquisitions of a repetitive waveform and averaging all acquisitions together. Any random noise is subsequently averaged to near zero, while the amplitude of the underlying repetitive signal remains unchanged.

 

Since the signal averaging is performed on-board using the intelligent processing of the FPGA, the amount of data that needs to be transferred via the PCI bus to the PC may be reduced by a factor of 1000. In fact, waveforms can be signal-averaged at a rate of greater than 100,000 waveforms/sec. or a data processing rate of 800 MB/s.

 

Signal averaging improves the fidelity of noisy repetitive signals. Small signals can be extracted from a background of high amplitude noise, which may even be larger than the actual signal itself. Applications include: ultrasonic, radar or lidar testing, optical fiber testing, stimulus-response systems and network analysis.

Gage Applied Technologies, gage-applied.com

 

TT electronics IRC Advanced Film Division developed a technique to produce custom thick film circuits and assemblies that allow high current-carrying traces (up to 100 amps) to be printed onto ceramic substrates for power hybrids or solid state relay substrates.

"By using these custom thick film circuits, design engineers can integrate current sense resistors with values as low as to 2 milliohms directly into the power hybrid substrate, which is not a possibility with direct bonded copper," said Tom Morris, applications engineering manager. "With this design, the circuits can be printed directly on a heat sink, eliminating the additional costs and processes of connecting a heatsink to a power substrate."

According to Morris, the copper fired thick films allow different types of circuits, including thermistors and temperature sensors, high voltage and pulse withstanding circuits to be combined on one board.

Typical applications are solid state relay substrates, power amplifiers and power supplies, thermo-electric coolers, water level sensors and high-brightness LED circuits.

 

TT electronics IRC Advanced Film Division, www.irctt.com