Products
CXInsight for Electronics, a project content management system, allows internal and external collaboration between project members across OEM and manufacturing sites with the latest web security.
Is a product-oriented content management and e-collaboration toolset for use in electronics design, NPI and production environments that require management of structured and unstructured content. Flexible, Web-based server/client system operates independent of OS or application software, and is developed specifically for OEMs and manufacturers working together on projects, regardless of geographic location, language or time zone.
Manages and supports distributed development and NPI across global supply chains via secure (SSL) Internet communication. Handles four key areas:
Development product data management system (PDM Light)
Product oriented, single point of data access for internal/external project members
Graphical product and project file browser
Full project flow control and event logging/tracking system (development and engineering)
Positioned as a PDM-light application, views and controls the complete project flow from project management, task and workload management, through to ECO modification processes, full traceability and event logging.
Adeon Technologies, adeon.nl or cxinsight.com
Is a product-oriented content management and e-collaboration toolset for use in electronics design, NPI and production environments that require management of structured and unstructured content. Flexible, Web-based server/client system operates independent of OS or application software, and is developed specifically for OEMs and manufacturers working together on projects, regardless of geographic location, language or time zone.
Manages and supports distributed development and NPI across global supply chains via secure (SSL) Internet communication. Handles four key areas:
Development product data management system (PDM Light)
Product oriented, single point of data access for internal/external project members
Graphical product and project file browser
Full project flow control and event logging/tracking system (development and engineering)
Positioned as a PDM-light application, views and controls the complete project flow from project management, task and workload management, through to ECO modification processes, full traceability and event logging.
Adeon Technologies, adeon.nl or cxinsight.com
CDS6250 can dispense up to 150 drops per second (540,000 drops/hr.). The Microjet dispensing valve produces dots of down to 2 nl. The three-axes dispensing system is said to be easily programmable.
Dispenses adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist or conformal coating. Almost all media with a viscosity between 50 and 200.000 mPas can be dispensed.
Unlike other needle based dispensing systems, the gap between the jet valve and the substrate can vary. Dispenser can travel at a fixed height while the substrate’s height changes.
The volume of a single drop can be as small as 2 nl. Very thin ropes can be dispensed by jetting one drop next to the other or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) and at high temperatures (up to 100 °C).
ESSEMTEC AG,essemtec.com
The Di-Series family of C‑size VXI-based digital test instruments builds upon the M9‑Series by increasing performance and adding key new features for emerging applications. Features highly configurable, independently programmed channels to address a test requirements from board through subassembly test.
Four key attributes:
Compatibility with the M9-Series and other instruments is preserved ;
Flexibility is well suited to the highest levels of assembly, such as box-level LRU (Line Replaceable Units) or WRA (Weapons Replaceable Assemblies). In addition, Di-Series cards can be partitioned to form multiple autonomous “virtual” instruments, each of which can simultaneously address different portions of the test problem while interacting with the UUT;
Performance enhancements include the ability to directly test differential logic, including high-speed LVDS (Low Voltage Differential Signaling).
Usability is enhanced by the per-channel programming of signal timing and levels and by iStudio development and debugging software.
Teradyne, teradyne.com
Four key attributes:
Compatibility with the M9-Series and other instruments is preserved ;
Flexibility is well suited to the highest levels of assembly, such as box-level LRU (Line Replaceable Units) or WRA (Weapons Replaceable Assemblies). In addition, Di-Series cards can be partitioned to form multiple autonomous “virtual” instruments, each of which can simultaneously address different portions of the test problem while interacting with the UUT;
Performance enhancements include the ability to directly test differential logic, including high-speed LVDS (Low Voltage Differential Signaling).
Usability is enhanced by the per-channel programming of signal timing and levels and by iStudio development and debugging software.
Teradyne, teradyne.com
Series 7000 Adaptable Workbench System for electronic test and repair applications offers flexibility to accommodate changing and future needs. Is certified cleanroom compliant. Can be tailored to suit the requirements of both the user and the application.
Available as a stationary and mobile workbench, can be configured with legs or cabinet pedestals. Users can custom configure their bench by adding a Vertical Space Integrator which can service one or two benches in a back-to-back configuration. Accessories include storage, shelving, lights, power beams and more. The power beam is offered in single- and double-sided configurations; each side has eight receptacles, a lighted power switch, and a 15 or 20 amp breaker.
Available with a dove-gray static dissipative laminate worksurface with a grounding kit. Other worksurface options include plastic laminate, butcher block, stainless steel and satin coat steel.
Cabinet drawers provide storage for parts, tools, components and accessories. A selection of dividing and partitioning accessories for drawer interiors is available.
Can support 1000 lbs. (454 kg), evenly distributed.
Available as a stationary and mobile workbench, can be configured with legs or cabinet pedestals. Users can custom configure their bench by adding a Vertical Space Integrator which can service one or two benches in a back-to-back configuration. Accessories include storage, shelving, lights, power beams and more. The power beam is offered in single- and double-sided configurations; each side has eight receptacles, a lighted power switch, and a 15 or 20 amp breaker.
Available with a dove-gray static dissipative laminate worksurface with a grounding kit. Other worksurface options include plastic laminate, butcher block, stainless steel and satin coat steel.
Cabinet drawers provide storage for parts, tools, components and accessories. A selection of dividing and partitioning accessories for drawer interiors is available.
Can support 1000 lbs. (454 kg), evenly distributed.
Arlink, arlink.com
Goepel electronic has developed a boundary scan option for the Digitaltest In-Circuit Tester series MTS 180, MTS 300 and MTS 888. The solution integrates the recently launched hardware architecture Scanflex in combination with the boundary scan system software Cascon Galaxy, and also involves the ICT digital pin electronics.
“The result of the development cooperation is a completely integrated solution with interaction of the test resources of both systems,” said Bettina Becker, marketing and international sales manager for Goepel. “In particular, the direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each nail acting as additional virtual scan pin in a Boundary Scan test. Applying our philosophy of ‘Extended Boundary Scan’, the user now is able to dramatically increase the test coverage.”
The hardware is based on the Scanflex PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT uses transceiver model SFX-TAP4/C, which provides four programmable TAP for the optimal adaptation to the UUT. The UUT is contacted by means of the standard interface of the ICT. Also, 32 dynamic I/O are available on the hardware.
In terms of software, the complete Cascon Galaxy development and execution environment was integrated into the CITE operating system by Digitaltest via the CAPI interface. All Cascon software editions can run on the ICT.
The ICT pin electronics' control is managed with Hyscan technology implemented in the software. It enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, debugging and fault diagnostic are executed by the native JTAG/Boundary Scan tools, whereby each ICT channel acts as a bi-directional Boundary Scan pin at the contacted net, completely transparent to the user.
GÖPEL electronic, goepel.com
“The result of the development cooperation is a completely integrated solution with interaction of the test resources of both systems,” said Bettina Becker, marketing and international sales manager for Goepel. “In particular, the direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each nail acting as additional virtual scan pin in a Boundary Scan test. Applying our philosophy of ‘Extended Boundary Scan’, the user now is able to dramatically increase the test coverage.”
The hardware is based on the Scanflex PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT uses transceiver model SFX-TAP4/C, which provides four programmable TAP for the optimal adaptation to the UUT. The UUT is contacted by means of the standard interface of the ICT. Also, 32 dynamic I/O are available on the hardware.
In terms of software, the complete Cascon Galaxy development and execution environment was integrated into the CITE operating system by Digitaltest via the CAPI interface. All Cascon software editions can run on the ICT.
The ICT pin electronics' control is managed with Hyscan technology implemented in the software. It enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, debugging and fault diagnostic are executed by the native JTAG/Boundary Scan tools, whereby each ICT channel acts as a bi-directional Boundary Scan pin at the contacted net, completely transparent to the user.
GÖPEL electronic, goepel.com
Second-generation Condor 500 is now reportedly 30 % faster - with integrated boundary scan and implemented soft landing tool. Flying prober has unique drive technology via linear motor, to ensure high speed and accuracy. The complete software allows fast test program development directly out of the CAD data and the parts-lists. Off-line simulation, panels and different versions of PCBs are also supported. Allows ICT and functional test, opens check, memory test/and programming, boundary scan and vision. Boundary-scan integration allows the heads and further pins to be driven parallel to boundary-scan.Said to improve throughput 3 to 5X over conventional flying prober systems. Software has an integrated quality management system and paperless repair, statistics and fault coverage reports.
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
Customization options are available for 300L and 400L selective soldering machines. Features include combination mini-wave and full-wave soldering, dual pot systems, xy fluxers and endoscope process cameras. Additional options include custom nozzles, rotating landing tables, stamp soldering and batch conveyors. Both are compatible with lead-free alloys. 300L is the economical solution for selective soldering of through-hole components after reflow and includes bare board or mask grippers, internal spray or drop jet fluxers, and installation of various soldering nozzles ranging from 4 to 30 mm in diameter. The high-end 400L offers a three-stage inline system for a high-speed, automated soldering process.
Juki Automation Systems Inc., jas-smt.com
Assembléon will introduces new capabilities at Productronica, from enhanced machine multifunctionality to full-functioned remote operation of multiple production lines making ‘lights-out’ manufacturing in the mid-volume sector a reality.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
Assembléon, assembleon.com
ArctiCore module technology, designed for thermal, mechanical and electrical performance, enables OEMs to cost-effectively increase available memory capacity to meet expanding application performance requirements.
Use a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core to increase the available area for mounting devices while enhancing thermal management, reliability and thinness.
Aluminum core acts as a heat sink and mechanical stiffener to provide rigid foundation support and increase the contact area for dissipating heat away from the devices. Heat reductions range from 4 to 25°C, said to minimize BGA ball stress cracking and reduce wear and tear through the use of a tapered connector edge that lessens system insertion stress.
Complements all types of standard memory devices, from DDR1 and DDR2 to dual-die, stacked or planar packages. Also has applications in mixed environments that use various chip technologies, such as DSPs, controllers and ASIC processors.
Staktek, staktek.com
IFS-X (Intelligent Feeder System - next generation) uses Cogiscan’s RFID Smart Feeder technology to provide feeder set-up validation.
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Can be retrofitted to existing machines, trolleys and feeders.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
Newport Beach, CA – Router Solutions Inc. (RSI) has released an upgrade module for its data preparation software, CAMCAD. The fixture reuse analysis module allows CAMCAD or Agilent fixture files to be checked against new revisions of boards to determine if the existing fixture can be reused or if it must be rebuilt. Anlysis time is reportedly reduced to minutes, instead of hours or days.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Router Solutions Inc., rsi-inc.com
ALPHA CoolCap was developed to cool components and semiconductor packages during high-temperature lead-free rework and reflow processes.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Press Releases
- KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
- ECIA Executive Conference Announces Session on eCrime Tradecraft
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing