Products
Textool brand BGA Open Top Test and Burn-In Socket 1.0 mm pitch, Type III is now available.
Using modular, injection-molded bodies and stamp-and-form contacts, this burn-in socket for high-end logic, programmable BGA (PBGA), MCM and system-in-package devices is designed for packages up to 47.5 x 47.5 mm, with matrices of up to 45 x 45 and lead counts to 2025. Is RoHS compliant.
Nest comb design allows full matrix array applications with minimal z-axis warp. By separating the socket nest into dual, interlocking combs, withstands the high contact force loads inherent in high lead count sockets.
Micro-Wiping contact scrubs device leads with each engage and disengage cycle, removing the oxide layer from solder balls, as well as removing contaminants from the contact surface. Contributes to improved contact resistance and reduces the need for cleaning sockets prior to the end of their rated life cycle.
Dual beam contact motion equalizes wear on the contact blades, maximizing mechanical reliability and durability. Facilitates pick-and-place operations by maintaining ball position throughout the actuation cycle. Package shift during loading and unloading is minimal.
3M, www.3M.com
DEK has developed wafer bumping and ball placement solutions for packaging applications by using efficient screen printing techniques and enabling technologies such as enclosed print head material deposition.
“Customers are looking for reduced costs on several levels,” says Richard Heimsch, president. “Manufacturers want lower initial equipment investment, long-term ownership and tooling costs. DEK has responded to these requirements by delivering a flexible platform that can deposit paste and place solder flux and solder balls, while handling devices in different input formats.”
For bumping at the wafer and substrate levels, a simple print and reflow method allows for single stroke, unlimited bump quantity with bump height targets of 80 to150 microns on pitches of 150 to 500 microns. This technique requires strict application of design rules when creating the stencil, which is generally electroformed. The design of the bond pads must allow sufficient contact area to achieve good solder joint strength for a given stand-off. The technologies that allow printing platforms to meet these semiconductor packaging requirements include automated wafer handing systems, Vortex clean-room compatible paperless cleaning systems and ProFlow enclosed print head technology which is said to deliver paste volume transfer and uniformity.
When pitch and bump size is appropriate, placing instead of forming solder bumps at the wafer and substrate levels is an alternative. DirEKt Ball Placement places solder balls as small as 0.3 mm in diameter onto substrates or wafers, with fine-pitch accuracy and first-pass yields reportedly better than 99%. Flux is deposited at each interconnect site. Then, the fully enclosed ProFlow ball transfer head guides each solder ball directly to the surface of the stencil and a controlled placement force seats each ball into the flux. Cycle time is fast and completely independent of I/O count.
DEK, www.dek.com
AVX Corp. has released an updated capability guide covering a range of RoHS-compliant, lead-free passive and interconnect components. Includes leaded radial, axial ceramic capacitors and radial tantalum capacitors.
Lead-free product offerings include multilayer ceramic capacitors, Tantalum capacitors, Niobium Oxide (OxiCap) capacitors, circuit protection, filtering, frequency control devices as well as standard and custom interconnects in addition to many other product lines.
A full RoHS compliant product listing is available at http://www.avx.com/docs/catalogs/RoHS_Status.pdf.
The 6000 Plus Series instruments can perform five 5 major electrical safety tests (AC Hipot, DC Hipot, Insulation Resistance, Ground Bond, Open/Short) with Twin-Port technology for simultaneous hipot and ground bond testing. The Guardian 6100 Plus also performs leakage current and functional run tests.
Automate the production line with CaptivATE Software; has a global database to archive data and print test reports on demand. Filter and plot test data to analyze historical trends. Achieve paperless testing and create electronic signatures.
Features include:
AC Hipot to 5000V; DC Hipot to 6000V
Insulation Resistance to 1000VDC and 50G
Ground Bond to 30A (40A with optional transformer)
Leakage Current & Functional Run Tests
Open/Short Circuit (OSC) Detection Mode
Programmable Trip Current; Ramp & Test Times
Storage & Recall of 100 Setups, 50 Steps each
RS-232 and Remote I/O Interfaces, Standard
IEEE-488 and Printer Interfaces, Optional
Built-in 8-Channel Scanner, Optional
Earth, Enclosure and Patient Leakage Tests are measured with a simulated impedance of the human body, five different models as specified by the various product standards. The Leakage Current mode has a 20A input current capability and multiple display mode (Voltage, Current, VA). Likewise, tests performed under normal conditions, reverse power line or fault conditions, open ground and open neutral are implemented automatically, without operator intervention.
To accommodate automated production lines, test sequences can be programmed to “Pause”, “Continue on Fail” or “Fail Retest.” Test results are indicated on the large front panel LCD display during test and an overall go/no-go indication is provided based on programmed limits. 6000 Plus offers password protected front panel lockout.
QuadTech, quadtech.com/6000Plus
IMS’ family of partial wrap termination resistors offers an exposed solder fillet to facilitate visual inspection of the termination joint of the flip-chip resistor.
The flip-chip resistor delivers high frequency performance to 40 GHz, from 10 Ohms to 2 KOhms. The partial wrap around termination is available in Platinum Silver, or with a SAC solder coating.
Resistors are great for high frequency radio communications, microwave and radar applications. Offer stable ohmic value well into millimeter wave frequencies. Other applications include medical devices, test instrumentation and sensors.
Available in the following package sizes: 0302, 0402, 0502, 0603 and 0805.
Version 4.2.1 of the boundary scan environment System Cascon includes integrated support for the hardware platform Scanflex, as well as new ways of handling test vectors.
In addition to the Scanflex interface, numerous software features have been implemented, including support of eight independent, parallel TAPs and a hardware configuration tool with AutoDetect functionality to automatically recognize and manage all connected hardware – SFX-Controller, SFX-Transceiver and TAP Interface Cards (TIC), and SFX I/O Modules. Supports other Scanflex features, such as the controller architecture Space II, the Fastscale principle for controller upgrades on-the-fly, the improved ADYCS II for compensation of signal propagation delay independently for each TAP, and Hyscan technology for separated but synchronized handling of parallel and serial vectors.
The project database can handle level groups for nets and pins. Level group assignments allow external I/O channels to be set up automatically with appropriate parameters to match the voltage family of pins on the UUT they are connected to.
Improvements include new commands for the integrated boundary scan programming language Caslan, capability to import IBIS models into the graphical Device Library and new functions in the Component Explorer for intelligent UUT CAD data management.
Backwards compatible to earlier versions, supports VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232, and Fast Ethernet boundary scan controllers.
GÖPEL electronic GmbH, www.goepel.com
AL Series optical inspection and defect review system delivers wafer edge and bevel inspection. Full bevel inspection allows user to see the top, side and bottom of the wafer from various angles using continuous angle adjustment. Detects particles, pits and residues that lead to hot spots on the front side, chips, cracks and scratches that cause wafer breakage, and edge bead removal issues harm the individual wafer and can result in equipment and wafer cross contamination. Defect information and images are stored in a common defect format for tracking and yield analysis.
"A 300-mm wafer has 942 mm of edge, giving you nearly one meter of edge die on every wafer," said Greg Baker, COO. "Edge die yield remains one of the big challenges in IC manufacturing with a variety of edge defects contributing to loss. If edge defects are reduced, wafer yield improves. Olympus's new edge and bevel inspection technology enables semiconductor manufacturers to detect these defects early in the manufacturing process and track them through the process."
Perform a range of inspection and defect review tasks, including macro and micro inspection, automated image capture, operator or automated defect review, and automated defect classification.
Include a variety of visible light imaging methods using Universal Infinity Systems (UIS) corrected optics. Can integrate 248-nm Deep-UV Air Gap optics for optical resolution of 80 nm.
Available with GEM and GEM300 factory automation software. A variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette) can be attached in various configurations (front, rear, or side load).
Olympus Integrated Technologies America, olympus-ita.com
Print-and-Apply Module is a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.
Using existing bar code information, it queries a facility's WMS or other control system for the data needed for label printing. The system can take product data from receiving or pick-and-pass operations and print a shipping label that routes the box through a facility to its final destination. Ideal when throughput requirements demand the automation of the print-and-apply function, operates at over 30 cartons/min.
Typically implemented using the BOSS control system, which handles the interaction of machine and transactional data from the PLC level to the WMS level on one PC.
Standard hardware components include the underlying conveyor, a bar code scanner and printer. Options include a weighing scale and verification scanner. An optional divert unit can redirect rejected product for manual handling. A second optional printer can be added for increased throughput and system redundancy. Can top-apply or side-apply labels.
FKI Logistex North America, www.fkilogistex.com
NORTH BILLERICA, MA --BTU International has announced a number of upgrades to its wafer bump reflow production line.
The addition of an integrated three-axes robot from Brooks Automation enhances wafer handling and the system's capability for 24x7 applications, helping to maximize equipment uptime.
A new, simplified control system that uses a single operator interface provides more precise and flexible control throughout the system, including the reflow oven and flux coater. The control system enables the use of 300-mm standards including E40, E84, E87, E90, E94 and standard SECSII/GEM interface.
Designed to be easily scalable for use in future 300-mm fabrication. Can be used as a 200-mm to 300-mm bridge tool with FOUP inserts; features Brooks Automation FixLOAD loadports for use with 300-mm FOUPs.
BTU International, www.btu.com
Carlsbad, CA — Machine Vision Products (MVP) will highlight the Supra M AOI system in booth 8650 at Semicon West this week in San Francisco, CA.
Modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format digital camera and a high-precision linear x/y stage. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 15 to 22 mm/pixel. Has CAD-driven, library-based programming for precise measurement of component placement and solder joint analysis.
In a 960 x 965 mm footprint, provides an acquisition speed of 20 1.4 images/sec. Can achieve up to 45 sq. cm./sec., depending on board layout and density.
Offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. Includes on-the-fly single camera acquisition, improved optics and lighting, 0201 capability and adaptable algorithms with high detectability and low PPM false accept and false reject rates.
Machine Vision Products Inc., sales@machinevisionproducts.com
IS640-333 has a nominal dielectric constant of 3.33 at 10 GHz and a dissipation factor of 0.0038 at 10 GHz. Available in standard 20, 30 and 60 mil thickness configurations. Other configurations may be available on request. Launched to target the low noise block (LNB) down converter market.
The complete family of IS640 patent-pending products are formulated to provide exceptional thickness and dielectric constant control without using inorganic fillers.
IS640-333, IS640-338, IS640-345, IS640-325, IS640-320 and IS640-300 are manufactured in Isola’s Chandler, AZ facility.
Isola Group S.A.R.L., www.isola-usa.com
Universal Instruments Corp. has designed a line that can assemble 2,000 microprocessors per hour (supposedly 60% to 80% faster than existing lines).
GSM Genesis platform features a twin beam gantry system and proprietary linear motors based on the company’s Variable Reluctance Motor (VRM) technology. Each beam can support one of three different heads: 30-spindle rotary Lightning head – a chip placement solution with VRM technology that is smaller than mechanical turret heads typically deployed to place small discrete components; a seven spindle Flexjet head with integrated cameras to handle a range of components; or a four spindle Pressure Enhanced (PE) head used in conjunction with a high resolution digital upward-looking Magellan camera to place challenging components that demand higher accuracy.
A chipshooter platform configured with two Lightning heads can assemble 32,000 to 37,000 capacitors/hr. Optimal tact time for the line is between 18 and 20 sec. A module comprising 16 to 20 capacitors can be addressed by a single chipshooter platform, while modules with 20 to 40 capacitors require a second chipshooter.
A flip chip platform features two PE heads. The machine’s motion control parameters – such as acceleration, settling band and stabilization time – are said to deliver higher accuracy. A special low-viscosity fluxer is integrated on the machine. With the flip chips fed in waffle packs, can assemble 2,000 flip chips/hr.
Universal Instruments, www.uic.com
Press Releases
- Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth
- Kurtz Ersa: New Factory Launched in Ciudad Juárez
- Bright Machines Appoints Seasoned Enterprise Technology Executive Chris Stori as CEO to Drive Next Phase of Growth
- Amtech Electrocircuits Modernizes AmtechOS with AI and Advanced Automation