Products
Second-generation Condor 500 is now reportedly 30 % faster - with integrated boundary scan and implemented soft landing tool. Flying prober has unique drive technology via linear motor, to ensure high speed and accuracy. The complete software allows fast test program development directly out of the CAD data and the parts-lists. Off-line simulation, panels and different versions of PCBs are also supported. Allows ICT and functional test, opens check, memory test/and programming, boundary scan and vision. Boundary-scan integration allows the heads and further pins to be driven parallel to boundary-scan.Said to improve throughput 3 to 5X over conventional flying prober systems. Software has an integrated quality management system and paperless repair, statistics and fault coverage reports.
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
Customization options are available for 300L and 400L selective soldering machines. Features include combination mini-wave and full-wave soldering, dual pot systems, xy fluxers and endoscope process cameras. Additional options include custom nozzles, rotating landing tables, stamp soldering and batch conveyors. Both are compatible with lead-free alloys. 300L is the economical solution for selective soldering of through-hole components after reflow and includes bare board or mask grippers, internal spray or drop jet fluxers, and installation of various soldering nozzles ranging from 4 to 30 mm in diameter. The high-end 400L offers a three-stage inline system for a high-speed, automated soldering process.
Juki Automation Systems Inc., jas-smt.com
Assembléon will introduces new capabilities at Productronica, from enhanced machine multifunctionality to full-functioned remote operation of multiple production lines making ‘lights-out’ manufacturing in the mid-volume sector a reality.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
Assembléon, assembleon.com
ArctiCore module technology, designed for thermal, mechanical and electrical performance, enables OEMs to cost-effectively increase available memory capacity to meet expanding application performance requirements.
Use a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core to increase the available area for mounting devices while enhancing thermal management, reliability and thinness.
Aluminum core acts as a heat sink and mechanical stiffener to provide rigid foundation support and increase the contact area for dissipating heat away from the devices. Heat reductions range from 4 to 25°C, said to minimize BGA ball stress cracking and reduce wear and tear through the use of a tapered connector edge that lessens system insertion stress.
Complements all types of standard memory devices, from DDR1 and DDR2 to dual-die, stacked or planar packages. Also has applications in mixed environments that use various chip technologies, such as DSPs, controllers and ASIC processors.
Staktek, staktek.com
IFS-X (Intelligent Feeder System - next generation) uses Cogiscan’s RFID Smart Feeder technology to provide feeder set-up validation.
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Can be retrofitted to existing machines, trolleys and feeders.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
Newport Beach, CA – Router Solutions Inc. (RSI) has released an upgrade module for its data preparation software, CAMCAD. The fixture reuse analysis module allows CAMCAD or Agilent fixture files to be checked against new revisions of boards to determine if the existing fixture can be reused or if it must be rebuilt. Anlysis time is reportedly reduced to minutes, instead of hours or days.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Router Solutions Inc., rsi-inc.com
ALPHA CoolCap was developed to cool components and semiconductor packages during high-temperature lead-free rework and reflow processes.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Ionograph SMD IV ionic contamination test system uses an ultra-pure alcohol/water extraction media to test components quickly and without destruction.
Equipped with Bluetooth to allows users to transmit data from the instrument wirelessly to the SCS PowerView software for monitoring and analysis.
“The wireless Bluetooth communication feature in the Ionograph SMD IV will provide customers with increased flexibility and range in their testing,” said Bill Boyd, SCS equipment market manager.
The system is Intertek ETL SEMKO (ETL) certified, meets National Fire Protection Association (NFPA) standards and is nitrogen-inerted for increased safety.
Equipped with Bluetooth to allows users to transmit data from the instrument wirelessly to the SCS PowerView software for monitoring and analysis.
“The wireless Bluetooth communication feature in the Ionograph SMD IV will provide customers with increased flexibility and range in their testing,” said Bill Boyd, SCS equipment market manager.
The system is Intertek ETL SEMKO (ETL) certified, meets National Fire Protection Association (NFPA) standards and is nitrogen-inerted for increased safety.
Specialty Coating Systems, scscoatings.com
DRS 24 offers selective soldering and rework of SMD components including BGAs, QFPs, flip chips, CSPs and connectors. Has solid construction on a stable platform for precise, accurate movements. A 3500 W, underboard infra-red pre-heater, used with the 1000 W top heater, minimizes the temperature delta – crucial for the additional energy and control demanded by lead-free processes.
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for repeatable results.
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied.
Zevac AG, zevac.ch
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for repeatable results.
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied.
Zevac AG, zevac.ch
microme|x is a high resolution x-ray inspection system with a large scanning area (20 x 24"), a precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. Operators can inspect large boards with mixed assemblies and acquire real-time oblique views under all angles.
Has board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the inspection software, XE², can perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. An interface for the CAD data import allows use of the original PCB layout to teach in the inspection routine. Inspection reports can be transferred to a rework station by the repair program quality. The SPC module allows statistical evaluation of the inspection results and the process supervision.
phoenix x-ray Systems + Services GmbH, phoenix-xray.com
CheckSum, announced that its combination of in-circuit test and boundary scan delivers test coverage equivalent to traditional "big iron" testers that can cost five times as much.
John VanNewkirk, president and CEO, said, "CheckSum's ICT plus boundary scan solution provides superior alignment between tester resources deployed and the actual fault spectrum of today's complex boards than traditional big-iron testers do."
CheckSum estimates that more than $250 million is wasted annually in North America alone due to the misalignment of big-iron testers with the actual faults found in today's boards. Two basic trends are converging, creating the opportunity for electronics manufacturers to use new, lower-cost approaches that provide a better alignment between test coverage and actual faults than the traditional ICT test methods used over the past two decades.
"First, component technology and the SMT assembly process itself have shifted the fault spectrum of a typical board such that big-iron ICT test capabilities are no longer aligned to it," said VanNewkirk. "For example, ICT vector testing was designed for the straightforward static logic of the devices of the 80s and early 90s. Modern ICs are not testable with conventional ICT 'backdrive' vectors because of access, speed and device complexity issues. As a result, expensive digital vector capability remains idle in virtually every big-iron ICT.
"Second, increasing density of circuit boards is significantly reducing electrical access to boards -- the lifeblood of in-circuit test. To offset loss of access, there's growing and widespread use of boundary scan-equipped devices. For CheckSum, boundary scan is a natural extension of our low-cost design philosophy because it achieves equivalent or better coverage compared to traditional backdrive vectors, but is far more usable for complex chips. Low-cost ICT and boundary scan are naturally complementary, and we believe this is the future of manufacturing test," VanNewkirk continued.
CheckSum, checksum.com
Los Angeles, CA -- MS2 Technologies, a P. Kay Metal-affiliated company, has introduced a new technology to enhance wave and selective soldering. The first of the series of products eliminates dross and oxides from the soldering process without the need for nitrogen or other exotic gases. The elimination of dross provides a substantial reduction in electronic assembly material costs especially with the advent of higher priced lead-free solders. The process entered production testing this spring and will be commercially available in November.
The company will launch a version for use with leaded solder and another for lead-free solders, including the various SAC alloys.
Larry Kay, president of P. Kay Metal and MS2 Technologies, and one of the inventors of the process, said, “The use of MS2 will reduce solder purchases for through-hole assembly by 40-75% depending on production volume.”
The company will launch a version for use with leaded solder and another for lead-free solders, including the various SAC alloys.
Larry Kay, president of P. Kay Metal and MS2 Technologies, and one of the inventors of the process, said, “The use of MS2 will reduce solder purchases for through-hole assembly by 40-75% depending on production volume.”
For information contact: sales@ms2technologies.com
Press Releases
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments
- Creation Technologies Celebrates Ribbon Cutting of Expanded Denver Product Realization Center; Patrick L. Freytag Comments