GÖPEL electronic and Scorpion Technologies have developed a JTAG/Boundary Scan option for the Scorpion Flying Probe Tester (FPT).
Is based on the integration of the Cascon Galaxy software and Scanflex hardware into the FPT with up to 24 probes that can be freely positioned and used as virtual Boundary Scan pins.
Bettina Becker, marketing and international sales manager for GÖPEL, said: “The direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each probe acting as additional virtual scan pin in a Boundary Scan test. The user is now able to achieve a significant increase in test coverage for digital as well as mixed signal ICs, whereby Boundary Scan procedures already utilized in the lab can be completely reused without modifications.”
The integration is based on PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT is realized using a transceiver model SFX-TAP4/C, which provides four parallel TAP and up to eight programmable interface parameters for adaptation to the UUT. The UUT is connected by means of the standard FPT interface. The reliable TAP-Transceiver with CION-Interface enables direct control of UUTs up to 1.5 m. No additional electronics are required. 32 dynamic I/O pins are available on the hardware.
Novatec, a French research laboratory, announces an new tool for board support ¾ VacuNest Shape Memory Tooling.
Board support is critical in printers, dispensers and pick-and-place machines to run a repeatable process.
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules.
Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will hold for weeks/days/months until the vacuum is released. The modules return to their original form, awaiting the next version of board.
Cuts risk of damage to a component due to the pin/printing pressure; supports forces evenly spread over the entire board. Can handle high-density boards and requires little to no lead-time.
Guarantees board flatness and is not sensitive to solder paste contamination.
AirMax VS high-speed connector system includes mezzanine, co-planar, high-power, I/O and backplane header versions. Said to offer scalability, flexibility, high density and performance headroom through its use of air as the dielectric and its Insert Molded Leadframe Assembly (IMLA).
Uses edge-coupling technology and an air dielectric between adjacent conductors, delivering high signal density with low insertion loss and low crosstalk, without metal shields.
Dual-beam receptacle contact provides two points of contact, one on each side of the header blade. Vertical header features a robust housing providing generous “lead in.” Comes with protective cover that also serves as press-in block during connector installation.
Comprised of a full set of building blocks for backplane, co-planar, mezzanine and cable-to-board applications. Are scaleable to the number of columns; available with housings in various IMLA counts.
Allow for custom pin assignments (differential or single-ended signals as well as power), so system data rates can grow from 2.5 Gb/s to over 12 Gb/s without re-design of the basic platform.
Owens Design partnered with Questar Products International to develop a line of automatic wire bonders built on Kulicke and Soffa’s former Hybrid bonder platforms. Capabilities include fine pitch, large table travel and ball bumping, with user friendly, customizable software. The Questar Q2100 series bonders are designed for a range of complex devices.
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
Speedline Technologies will unveil several new options for its MPM Accela printer as well as an upgrade of its MPM UltraPrint 2000 printer at Apex 2006.
Speedline will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions in booth #1207.
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce: · A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making. · An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software. Provides data management down to the board (within the panel) level in the printer. · An option for closed loop control of the printer using external inspection information.
Speedline Technologies will unveil several new options for its MPM Accela printer as well as an upgrade of its MPM UltraPrint 2000 printer . The company will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions .
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce: · A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making. · An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software. Provides data management down to the board (within the panel) level in the printer. · An option for closed loop control of the printer using external inspection information.
IS640-280 has a nominal dielectric constant of 2.80 at 10 GHz and a dissipation factor of 0.0028 at 10 GHz. Available in 20, 30 and 60 mil thickness configurations. Other configurations available on request.
IS640-280, IS640-333, IS640-338, IS640-345, IS640-325, IS640-320 and IS640-300 are manufactured in Isola’s Chandler, AZ, facility. Data sheets for each are available for download on the Website.
RVSI Inspection will showcase the WS-2800 Wafer Inspection System in HTL Co.’s booth, #10A-101, at the Semicon Japan show, taking place Dec. 7-9.
WS-2800 is said to provide superior yield management for defect inspection throughout post-fab processes for both standard and flip chip wafers up to 200 mm in diameter.
Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact production yields and time-to-market. The inspection system locates wafer defects and classifies them to reduce process costs and improve yield.
Benefits include: high-speed surface defect inspection, 100% inspection that ensures no escapes and an integrated inspection tool for fast response to process variations.
ASSET InterTech announced a new online service that validates the accuracy of boundary scan description language (BSDL) files. These files describe the boundary-scan characteristics of semiconductor devices.
ASSET collaborated with Agilent Technologies on the development of the service. ASSET will host and support the Website on an ongoing basis. Agilent previously offered an email-based BSDL checker, which has been used over 90,000 times by chip suppliers. The new BSDL Validation Service expands on its predecessor's capabilities and is available in an easy-to-use Web browser interface.
BSDL files perform boundary scan tests or programming operations on electronic circuit boards and systems. The files are used to build a model of the unit under test to apply test patterns or programming algorithms to it. An inaccurate BSDL file can cause faulty results when boundary scan operations take place.
“Before JTAG tests can be automatically generated, the engineer has to have BSDL files for all of the devices on a scan chain,” said Alan Sguigna, VP of sales and marketing for ASSET. “So the whole process begins with BSDL files. Anything we can do to help chip suppliers verify the accuracy of BSDL files will greatly improve the testability of printed circuit boards and systems for hardware manufacturers.”
The free service is available at www.asset-intertech.com/bsdl_service.
After creating a user account and password, a BSDL file can be submitted to the tool immediately. The tool retains a history of each user's submissions and, for a limited time, it will store the results of a syntax check and any test patterns that are generated. These outputs from can be downloaded at any time.
Uni-form epoxy preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent batch viscosity ensure uniform results.
Can be dispensed at 200 to 600 parts/min. with little or no operator training. Said to eliminate pot-life concerns and costly cleanup procedures. Available in a range of shapes, sizes and materials for diverse applications.
A 1 mm centerline Card Edge Connector meets the high performance point-to-point full duplex I/O Bus standard for PCI Express Architecture. The PCI Express standard allows customers to reach the high bandwidth required by modern equipment. Applications include graphics cards in serial bus applications, I/O client cards for applications requiring higher speeds than the popular PCI Bus, computers (both desktop and server) and telecommunications switches and routers. Available for all standard PCI Express slot sizes (x1, x4, x8 and x16); comes with plastic locating posts or metal hold-downs. Available in straddle-mount or right angle configurations and with three different tail lengths (2.3, 3.1 and 3.56 mm).
Quadrus Verifier is designed for Department of Defense (DoD) suppliers to verify the compliance of their Data Matrix codes as specified by MIL STD 130 L Change 1. The fully integrated unit measures the quality of a Data Matrix symbol against the criteria for symbol quality established in ISO/IEC 15415 and AS9132 standards.
Is the only ISO/IEC 15426-2 certified Data Matrix verifier, a significant breakthrough for DoD suppliers as well as automotive, electronics and aerospace manufacturers required to verify Data Matrix codes applied to parts and components.
Unlike most bench-top verifiers that are mounted on stands designed for the lab environment, the Quadrus is a fully-contained, compact device that is easy to integrate into the production environment.
To ensure consistent results on the manufacturing floor, it has preset focus and illumination. Fully-enclosed illumination chamber is engineered to produce the illumination angles required by ISO/IEC 15415. Features compact, lightweight design and flexible mounting. No optical or lighting engineering experience is needed because no on-site calibration of optics or lighting is required. Factory-calibrated illumination and optics to ISO/IEC 15426-2 guarantees accurate verification results of every Data Matrix code.