JPSA’s large-format laser beam switching module can quickly, accurately switch the entire beam from one path to another (i.e., between two different experiments, or between two separate processes). Has 50 x 50 mm clear aperture for passage of a larger-diameter homogenized beam without beam corner clipping. A vacuum UV (VUV) product, can be used with short-wavelength UV excimer beams including 157, 193 and 248 nm. There is no grease or oil VUV beam delivery designs, and all organic materials have been removed to prevent degradation by UV radiation and contamination of the optics and interior chamber. This switching module can be purged with high-purity gases such as nitrogen.
The industrial-grade product is designed for 24/7 service. Designed for integration into a laser beam delivery system and can deflect the beam out of production when desired to perform beam diagnostics, check beam homogeneity, pulse width or other beam characteristics, since an excimer laser beam changes characteristics over time and usage. Remote control allows the user to insert or remove a beam splitter; is magnetically pre-mounted so the beam splitter will be accurately located. It has a true gimbal design and allows either a 90-degree turn or straight-through beam path. Switching is mechanical and the unit holds accurate tolerance swing when switching from one path to the next.
Electrolock-ESD material is RoHS-compliant to meet regulatory demands for lead-free manufacturing.
Rich Reed, business unit manager, said: "When the 2006 lead-free requirements go into effect, high-temperature performance will become a more critical issue for electronic contract manufacturers. Our Electrolock-ESD material was designed to deliver consistent performance at temperatures in excess of 550°F, without deflection, which ensures a rigid, even surface and optimum machinability."
Unlike conventional material solutions, the compound reportedly yields a smooth surface without the need for sanding. Durable surface is impervious to chemical reactions and eliminates glass blooming associated with traditional solder pallet materials.
Comes in a variety of sizes to accommodate a range of applications.
Aquacoat Plus is a water-based conformal coating formulated to protect electronic circuitry. Eliminates the need for extraction and other precautions normally required to apply solvent-based conformal coatings. Is non-flammable, contains low levels of VOCs. It contains no isocyanates, so it can be soldered through without fear of highly toxic gases, and is phenol-free (non-corrosive to cadmium and zinc plates)
Based on polymeric materials, said to offer adhesion on a variety of substrates and a wide operating temperature range. Available in two formulations: WBP and WBPS (Sprayable) for use in selective film coating equipment. Meets the requirements of DEF-STAN, MIL and IPC-CC-830 and is RoHS compliant. Electrolube, electrolube.com
U.S. Distributor: Christopher Associates, christopherweb.com
Engineering Data Management (EDM) suite helps engineering teams create RoHS/WEEE compliant products. The database management system enables detailed control over all product design data with emphasis on environmental compliance material content. Supports various versions of RoHS data including RoHS 5 (NIE exemption) and the general RoHS 6 requirements. Can manage all relevant product design data including ECAD (electrical) and MCAD (mechanical) with the capability to create RoHS/WEEE reporting documentation. Functions include BOM versioning, ECO generation, full library and workflow management, and document archival for the engineering work group.
Symbion S36 post-reflow automated optical inspection system provides inspection for high productivity and first-pass yield. Wizard & Go operation features a user-friendly graphic wizard interface that reduces set-up time and operator requirements. DPIX detection technology, based on specialized 3-D image acquisition and image processing techniques, reportedly ensures high accuracy detection with minimized false calls and without compromising speed. Produces measurement and attribute data for statistical process control (SPC). Integrated ADVISOR software allows users real-time access to data for continual process analysis and improvement.
Green Monster! ESD stencil wiping rolls prevent static buildup and do not use weak paper or tissue fibers. Paper or tissue is typically only held together by weak hydrogen bonds which are quickly destroyed when wet. Instead, they use thicker and coarser rayon fibers that absorb solvents.
With coarse fibers, the porosity is higher, more vacuum can be used to clean solder paste from the apertures, and they are conducive to an aggressive cleaning surface.
32K443-800 connector has a four-hole flange mounting structure, with a separate center contact pin soldered to the signal via the board. The connector is reusable, extra center contact pins are available. Said to have excellent electrical performance up to 18 GHz.
SMCC (surface mount coaxial connector) products provide an impedance match if the signal trace or signal via on the board is 50 Ohm.
Rosenberger provides custom footprints to its customers, developed based on the connector and board models that optimize RF performance.
GÖPEL electronic and Scorpion Technologies have developed a JTAG/Boundary Scan option for the Scorpion Flying Probe Tester (FPT).
Is based on the integration of the Cascon Galaxy software and Scanflex hardware into the FPT with up to 24 probes that can be freely positioned and used as virtual Boundary Scan pins.
Bettina Becker, marketing and international sales manager for GÖPEL, said: “The direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each probe acting as additional virtual scan pin in a Boundary Scan test. The user is now able to achieve a significant increase in test coverage for digital as well as mixed signal ICs, whereby Boundary Scan procedures already utilized in the lab can be completely reused without modifications.”
The integration is based on PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT is realized using a transceiver model SFX-TAP4/C, which provides four parallel TAP and up to eight programmable interface parameters for adaptation to the UUT. The UUT is connected by means of the standard FPT interface. The reliable TAP-Transceiver with CION-Interface enables direct control of UUTs up to 1.5 m. No additional electronics are required. 32 dynamic I/O pins are available on the hardware.
Novatec, a French research laboratory, announces an new tool for board support ¾ VacuNest Shape Memory Tooling.
Board support is critical in printers, dispensers and pick-and-place machines to run a repeatable process.
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules.
Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will hold for weeks/days/months until the vacuum is released. The modules return to their original form, awaiting the next version of board.
Cuts risk of damage to a component due to the pin/printing pressure; supports forces evenly spread over the entire board. Can handle high-density boards and requires little to no lead-time.
Guarantees board flatness and is not sensitive to solder paste contamination.
AirMax VS high-speed connector system includes mezzanine, co-planar, high-power, I/O and backplane header versions. Said to offer scalability, flexibility, high density and performance headroom through its use of air as the dielectric and its Insert Molded Leadframe Assembly (IMLA).
Uses edge-coupling technology and an air dielectric between adjacent conductors, delivering high signal density with low insertion loss and low crosstalk, without metal shields.
Dual-beam receptacle contact provides two points of contact, one on each side of the header blade. Vertical header features a robust housing providing generous “lead in.” Comes with protective cover that also serves as press-in block during connector installation.
Comprised of a full set of building blocks for backplane, co-planar, mezzanine and cable-to-board applications. Are scaleable to the number of columns; available with housings in various IMLA counts.
Allow for custom pin assignments (differential or single-ended signals as well as power), so system data rates can grow from 2.5 Gb/s to over 12 Gb/s without re-design of the basic platform.
Owens Design partnered with Questar Products International to develop a line of automatic wire bonders built on Kulicke and Soffa’s former Hybrid bonder platforms. Capabilities include fine pitch, large table travel and ball bumping, with user friendly, customizable software. The Questar Q2100 series bonders are designed for a range of complex devices.
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
Speedline Technologies will unveil several new options for its MPM Accela printer as well as an upgrade of its MPM UltraPrint 2000 printer at Apex 2006.
Speedline will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions in booth #1207.
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce: · A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making. · An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software. Provides data management down to the board (within the panel) level in the printer. · An option for closed loop control of the printer using external inspection information.