Lasers used in precision micromachining and manufacturing of medical devices and biomedical products such as tissue-growing scaffolds, cell sorters and microfluidics must make precise cuts, often within the micron tolerance range. CeTaQ Americas’ Machine Capability Analysis (MCA) testing is applicable to laser systems. The test methodology measures the width of the laser cut as well as beam size and consistency, comparing the actual result with the programmed pattern and process settings. Is applicable to lasers used in cutting, welding, and scribing, stencil cutting, laser marking (such as matrix labeling) and other applications such as drilling. All types of lasers, including UV (excimer and DPSS) can be evaluated. In laser processing, typically the laser head is stationary, and the product is moved under the beam via high-precision air bearing stages. The test methodology verifies the X-Y accuracy of these stages and the motion control system. MCA testing is a third-party, objective evaluation methodology in which special vision algorithms, accurate glass plates and components are utilized for independent measurement of Cp and Cpk indices on production equipment. The laser system verification process uses a transparent heat-sensitive film in conjunction with the glass plate measurement system.
Super Scopedelivers high-resolution, real-time color images, without the eye fatigue and back pain associated with long hours of microscope use. Users can easily capture images for archiving, e-mailing, etc., for reference and other uses.
Features a 14" medical grade, self-contained LCD video system combined with a high resolution/high sensitivity custom 1/2" camera; the combined elements provide clear, crisp images. Also features audio and extra video input and output ports.
Images are displayed on the system’s LCD display, and can be captured and transferred via email with voice-over to anyone over the Internet. A frame grabber and microphone are sold separately.
Images can be viewed in real-time by more than one person, offering opportunities for training, oversight or supervisor examination of questionable issues, etc. Offers a range of applications in medical, general inspection and contract assembly applications.
Has a standard magnification range of 4 - 45X, and up to 90x with an optional 2x lens.
For customers requiring a small footprint solution that can sort PASS/FAIL products after AOI, Promationhas updated its ENB-700 conveyorized station.
The inline handling solution houses a single, removable magazine. PCBs that “PASS” inspections are transferred through the ENB station to the next process through use of standard SMEMA. PCBs that “FAIL” inspection are transferred into a “50 slot” removable magazine, and stored for future inspection and/or rework.
Features include “One Touch” control panel, PCB counter, selectable pitch (10 to 50 mm) and sliding magazine platform (for ergonomic removal of full magazine).
DataMan 7500 series handheld direct part mark readers read all printed and Direct Part Mark (DPM) codes for manufacturers implementing part traceability programs in the automotive, aerospace, electronics, healthcare and defense industries. “Rapid adoption of DPM identification for part traceability has manufacturers demanding a rugged, self-contained reader that performs consistently on all types of codes and parts,” said Justin Testa, Sr. VP, ID Products. “The DataMan 7500 sets a new performance standard for handheld DPM readers, reliably reading everything from the most challenging DPM codes to the easiest printed barcodes. And the new reader is rugged enough to withstand up to 50 drops to concrete from two meters.” The handheld ID readers combine IDMax code reading software with an UltraLight illumination technology to read codes regardless of marking method, part material, shape or surface texture. The series includes the 7500 corded and 7550 cordless models. Cognex teamed with Hand Held Products on the development of the readers. Cognex Corp., cognex.com Hand Held Products, handheld.com
Promation has developed a line of 200 and 300 mm wafer handling systems for loading and unloading the line.
EWL-700 (loader) and EWU-700 (unloader) are single cassette handling systems that are 10K clean room compliant. Wafers may be safely transported from and into Fluoroware or other type magazine cassettes within a small footprint.
Visiprise Manufacturing 4.1 builds on its integrated manufacturing platform rolled out earlier this year. Said to provide increased performance and scalability while improving system security. New features include: Integrated Product Dashboard: allows users to view work instructions, assembly components and data collection requirements through a single, configurable dashboard. Device History Record Reports: for manufacturers producing items requiring compliance, displays a complete history of a product through a single view or record. Time-based Component Traceability: includes feeder staging for faster machine changeover for electronics manufacturers. Lightweight Directory Access Protocol (LDAP): permits authentication using secure, single sign-on when accessing the application across the Internet. Enhanced Data Collection: enables manufacturers to require that certain data be approved and validated and supports the use of formulas.
Speedprint Technology Ltd., a division of Blakell Europlacer Group, is offering Novatec’s VacuNest Shape Memory Tool on its printer platforms through an OEM supply agreement.
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. The shape will be held until the vacuum is released, and the modules return to their original form awaiting the next version of board.
Will not damage a component due to the pin/printing pressure, support forces are evenly spread over the entire board, provides firm and precise support and can be simply reset when a board version changes.
Eliminates the cost of a custom tooling plate as well as pin tooling. Can handle high-density boards with ease and requires little to no lead-time.
Said to guarantee board flatness; is not sensitive to solder paste contamination.
Wickgun Desoldering Braid Dispenser is a hand-held tool that allows users to dispense, position and cut-off braid using one hand while holding a soldering iron in the other. Features a braid with no clean flux (for use with Pb-free solder), is said to eliminate handling braid, reduces waste and speeds desoldering.
Available in four braid sizes from 0.035” to 0.110” W, the replaceable cassettes are preloaded with 15 ft. of braid and are easy to change. Braid is advanced and retracted using a thumbwheel can be cut-off by squeezing the trigger.
A hand-held X-Ray Fluorescence (XRF) NITON analyzer is equipped with a helium purging mechanism for direct analysis of “light elements.” The analyzers provide immediate chemical analysis of alloys, electronic materials, coatings, plastics and more. NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site. Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users. For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
SCC-700 Cooling Conveyor station provides a quick PCB cool down that occupies a minimal amount of floor space.
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine. Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr. Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
ETCO Mighty-T Press is a bench-top semi-automatic press and wire terminal applicator for low volume users that replaces hand crimping. Features a rigid one-piece cast iron frame, employs a 40 mm stroke with 4,450 lbs. of crimping force and includes a footswitch, safety interlock and reel arm. Wire terminal applicator has a two-piece anvil to crimp wire and insulation ear sections in a single stroke. Eliminates hand crimping and has an open architecture for easy feed adjustment and tooling changes.
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.