Cobar 396-FTA VOC-free flux for Pb-free wave soldering applications has less than 2% solids, yielding clean post solder surfaces even on difficult solder resists. Said to deliver excellent soldering performance on most types of circuit boards. Eliminates solder balls as well as wetting and wicking issues, even on OSP assemblies.
Self-cleaning Wash Tank has no horizontal floor surfaces,
preventing solder paste from building up on the tank’s floor. Is
equipped with multiple funnels mounted on the tank floor. The end of
the funnels feeds into a small diameter metal tube. Water is pumped
through the tube at 15 ft/ sec., sweeping solder paste into a filter
housing.
Neither an operator nor a maintenance technician is
required to scrape solder paste from the bottom of a wash tank.
Prevents solder paste from entering a waste stream, eliminates direct
contact between an operator and the paste.
Available in SonicOne G3 automatic stencil cleaning systems and will be introduced on semi-automatic models throughout 2006. Aqueous Technologies Corp., aqueoustech.com
2-D vision inspection option on the 4710 detects lead defects. Is compatible with a high-speed camera, verifies all leads are within some tolerance before the chips are shipped to the customer. Detects edge pitch, which identifies skewed leads at 0.02 mm and trend edge position, which identifies lifted leads at 0.04 mm.
Used on automated programming systems, the vision system mounts onto a tape loader and integrates with BP Win and Jobmaster.
The 4710 is designed for high density devices and longer programming times, for programming Flash, as well as Microcontrollers, FPGAs, PLDs and other device types. Can program devices with densities up to 4 Gbits. Incorporates USB 2.0 standard bus for communications.
FLX2010-LCV flexible pick-and-place system is designed for high-mix/low-volume production. The company claims to feature the largest board size and feeder capacity in the industry while also taking up one of the smallest footprints.
FLX series offers changeover without downtime, via intelligent feeders, large feeder capacity and offline programming and job planning. Start at 5,000 CPH with 150 feeders inline and can expand to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Offline setup gives the ability to produce without downtime. Requires only 110 V of power.
Can accept nearly any kind of feeding system, even an independent unit such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. Equipped with laser and vision alignment systems.
PRO 1S and PRO 1Sm are single nozzle, selective soldering stations that solder components individually or in groups. The nozzle is surrounded by a nitrogen blanket.
The 30-lb. solder pot is Pb-free compliant and comes with a solder replenishment system and automatic spray fluxer system. PCBs or pallets enter the work cell on an in-line conveyor system. Programs may be set up through a data management system or overhead laser pointer. Once the x/y parameters are established, the z motion can maneuver around bottom-side components.
PRO-8b Selective Laser Soldering system provides an economical means to selective solder tin/lead and Pb-free alloys within minimal startup costs and ongoing maintenance, lower power consumption, and reduced environmental impact.
60-W Diode Laser Cell in-line soldering station combines easy-to-use software and precision movement to selective solder most bottom-side applications. Offers over 10,000 hours of useful soldering life and does not require that the solder remain preheated during non-soldering times. Equipped with a precision four-axis Cartesian robot with enhanced Adept motion and vision guidance (with fiducial recognition system and dynamic compensation). End effector allows the soldering head and automatic solder feeder to be independently adjustable. Variable beam selection ranges from 0.7 to 2.5 mm. Approach and angle are controlled through software.
Pin-to-pin acceleration can be as aggressive as 0.1 sec. Can move 1.2 meter/sec. at 1G acceleration; however, most soldering is accomplished at 50% of this level. The vision system may be programmed to look for known fiducial points, analyze them and automatically center to that point. Variable beam size allows operators to program in desired size (from 0.7 to 2.5 mm.
SMT USC400 is a portable ultrasonic contact type stencil cleaning system.
The operator moves the hand tool over the stencil after spraying with cleaning fluid. The tranducer vibrates the contamination through even small stencil apertures. Residues are collected on disposable wipe material under the stencil. Removes difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame.
An optional ultrasonic mini-bath is available to clean machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Is lightweight, has rugged industrial construction and is suitable for all stencil materials, even plastic. Suitable for all printable materials, including paste, inks, resists and SMD adhesives. Advanced Transducer Autotuning system results in optimum cleaning performance.
FLIP Solder Bath for Pb-free reflow soldering features Linear Induction Pumping, in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, which moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in reflow and selective solder systems.
Uses 300 kg of solder, instead of 450 kg, and generates less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. Offers open space to access inside side bath and easy nozzle cleaning and maintenance. Does not have motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types.
Model 1800A adds a motor-controlled board support table to facilitate automated, hands-free site scavenging on the Summit 1800 rework system. Supports automated alignment and reduces operator intervention. Options include component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
Has Windows-based SierraMate 7.0 software with Advanced Auto Profile for rules-based process development.
Automatic prism shuttle facilitates accurate and repeatable component alignment. Simultaneously looks up at the component and down at the board, providing a composite alignment view. Digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a click on the GUI.
Incorporates independent, programmable motions for pick-up and top heater height. Pick-up motion allows placement force control and zero force removal. Component pick-up tube features 360° Theta control and automatic alignment height. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board.
Features standard board handling of 18 x 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40X.
Champion 6809 is a servo-driven, automated dispensing system for precision processes. Has easy-to-use proprietary software and GUI that allows for intuitive programming and control. Includes a large, bright, high-contrast color TFT display. Can be configured to match application requirements from dots to underfills. Placement accuarcy is within 3 µm.
Dispenses dot diameters to 0.003" with bead width down to 0.003". Volumes are below 0.5 nanoliters. Dispense area is 5.5 x 12.0", with resolution and repeatability of ±0.00008" (2 μm) for all axes.
True Volume Piston Positive Displacement Pump can fire up to 90,000 precision deposits/hr. to form high-definition dots, lines, fills and builds. Volume repeatability is 1.7%, 3 Sigma. Uses true positive displacement without the use of augers and pump motors to prevent maintenance problems. Good for placing Pb-free material.
Everett Charles Technologies and atg Test Systems will display a “disruptive” fixtureless technology for testing bare PCB panels.
A pre-screener for industry-accepted flying probe test (FPT) systems, Eliminator 6 eliminates test points to be tested by FPT. Leverages FPT advantages of fixtureless, quick test preparation and programming, adding faster test times per PCB to be suitable for all volumes of production . Panel test application niches include rigid PCB, I/C package and PCB inner layers.
Scans PCB panels at a rate of 76.2 mm (3")/sec. regardless of PCB density, test pad size and pitch, or number of PCB images per panel. Resulting elimination rates of 85-92% per panel permits FPT test times of less than 2 min./panel.
Eliminates expensive test tooling and fixturing.
Everett Charles Technologies, a Dover company, ectinfo.com Booth 2009
HawkEye inspection and RTC (Rapid Transit Conveyor) technologies now provide 100% board verification at a cycle time of 4 sec.
HawkEye isolates faults through rapid good/bad verification instead of performing data-rich inspection during high-speed manufacturing. Can verify 100% of printed boards within the line beat rate by analyzing streamed images instead of successive still images. To quickly isolate bad boards, the system records pass/fail per board against preset thresholds instead of capturing quantitative data.
The speed at which boards can be delivered and removed from the printing phase is increased through RTC’s board handling technology. Instead of the traditional, slow, belt-type transport that relies on friction to move the board, RTC grips the board, adapts to its dimensions and transports it into printing position.