Products
ArctiCore module technology, designed for thermal, mechanical and electrical performance, enables OEMs to cost-effectively increase available memory capacity to meet expanding application performance requirements.
Use a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core to increase the available area for mounting devices while enhancing thermal management, reliability and thinness.
Aluminum core acts as a heat sink and mechanical stiffener to provide rigid foundation support and increase the contact area for dissipating heat away from the devices. Heat reductions range from 4 to 25°C, said to minimize BGA ball stress cracking and reduce wear and tear through the use of a tapered connector edge that lessens system insertion stress.
Complements all types of standard memory devices, from DDR1 and DDR2 to dual-die, stacked or planar packages. Also has applications in mixed environments that use various chip technologies, such as DSPs, controllers and ASIC processors.
Staktek, staktek.com
IFS-X (Intelligent Feeder System - next generation) uses Cogiscan’s RFID Smart Feeder technology to provide feeder set-up validation.
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Can be retrofitted to existing machines, trolleys and feeders.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
Newport Beach, CA – Router Solutions Inc. (RSI) has released an upgrade module for its data preparation software, CAMCAD. The fixture reuse analysis module allows CAMCAD or Agilent fixture files to be checked against new revisions of boards to determine if the existing fixture can be reused or if it must be rebuilt. Anlysis time is reportedly reduced to minutes, instead of hours or days.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Router Solutions Inc., rsi-inc.com
ALPHA CoolCap was developed to cool components and semiconductor packages during high-temperature lead-free rework and reflow processes.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Ionograph SMD IV ionic contamination test system uses an ultra-pure alcohol/water extraction media to test components quickly and without destruction.
Equipped with Bluetooth to allows users to transmit data from the instrument wirelessly to the SCS PowerView software for monitoring and analysis.
“The wireless Bluetooth communication feature in the Ionograph SMD IV will provide customers with increased flexibility and range in their testing,” said Bill Boyd, SCS equipment market manager.
The system is Intertek ETL SEMKO (ETL) certified, meets National Fire Protection Association (NFPA) standards and is nitrogen-inerted for increased safety.
Equipped with Bluetooth to allows users to transmit data from the instrument wirelessly to the SCS PowerView software for monitoring and analysis.
“The wireless Bluetooth communication feature in the Ionograph SMD IV will provide customers with increased flexibility and range in their testing,” said Bill Boyd, SCS equipment market manager.
The system is Intertek ETL SEMKO (ETL) certified, meets National Fire Protection Association (NFPA) standards and is nitrogen-inerted for increased safety.
Specialty Coating Systems, scscoatings.com
DRS 24 offers selective soldering and rework of SMD components including BGAs, QFPs, flip chips, CSPs and connectors. Has solid construction on a stable platform for precise, accurate movements. A 3500 W, underboard infra-red pre-heater, used with the 1000 W top heater, minimizes the temperature delta – crucial for the additional energy and control demanded by lead-free processes.
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for repeatable results.
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied.
Zevac AG, zevac.ch
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for repeatable results.
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied.
Zevac AG, zevac.ch
microme|x is a high resolution x-ray inspection system with a large scanning area (20 x 24"), a precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. Operators can inspect large boards with mixed assemblies and acquire real-time oblique views under all angles.
Has board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the inspection software, XE², can perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. An interface for the CAD data import allows use of the original PCB layout to teach in the inspection routine. Inspection reports can be transferred to a rework station by the repair program quality. The SPC module allows statistical evaluation of the inspection results and the process supervision.
phoenix x-ray Systems + Services GmbH, phoenix-xray.com
CheckSum, announced that its combination of in-circuit test and boundary scan delivers test coverage equivalent to traditional "big iron" testers that can cost five times as much.
John VanNewkirk, president and CEO, said, "CheckSum's ICT plus boundary scan solution provides superior alignment between tester resources deployed and the actual fault spectrum of today's complex boards than traditional big-iron testers do."
CheckSum estimates that more than $250 million is wasted annually in North America alone due to the misalignment of big-iron testers with the actual faults found in today's boards. Two basic trends are converging, creating the opportunity for electronics manufacturers to use new, lower-cost approaches that provide a better alignment between test coverage and actual faults than the traditional ICT test methods used over the past two decades.
"First, component technology and the SMT assembly process itself have shifted the fault spectrum of a typical board such that big-iron ICT test capabilities are no longer aligned to it," said VanNewkirk. "For example, ICT vector testing was designed for the straightforward static logic of the devices of the 80s and early 90s. Modern ICs are not testable with conventional ICT 'backdrive' vectors because of access, speed and device complexity issues. As a result, expensive digital vector capability remains idle in virtually every big-iron ICT.
"Second, increasing density of circuit boards is significantly reducing electrical access to boards -- the lifeblood of in-circuit test. To offset loss of access, there's growing and widespread use of boundary scan-equipped devices. For CheckSum, boundary scan is a natural extension of our low-cost design philosophy because it achieves equivalent or better coverage compared to traditional backdrive vectors, but is far more usable for complex chips. Low-cost ICT and boundary scan are naturally complementary, and we believe this is the future of manufacturing test," VanNewkirk continued.
CheckSum, checksum.com
Los Angeles, CA -- MS2 Technologies, a P. Kay Metal-affiliated company, has introduced a new technology to enhance wave and selective soldering. The first of the series of products eliminates dross and oxides from the soldering process without the need for nitrogen or other exotic gases. The elimination of dross provides a substantial reduction in electronic assembly material costs especially with the advent of higher priced lead-free solders. The process entered production testing this spring and will be commercially available in November.
The company will launch a version for use with leaded solder and another for lead-free solders, including the various SAC alloys.
Larry Kay, president of P. Kay Metal and MS2 Technologies, and one of the inventors of the process, said, “The use of MS2 will reduce solder purchases for through-hole assembly by 40-75% depending on production volume.”
The company will launch a version for use with leaded solder and another for lead-free solders, including the various SAC alloys.
Larry Kay, president of P. Kay Metal and MS2 Technologies, and one of the inventors of the process, said, “The use of MS2 will reduce solder purchases for through-hole assembly by 40-75% depending on production volume.”
For information contact: sales@ms2technologies.com
AIM will highlight its lead-free soldering materials, including the SN100C lead-free alloy, in booth 5434 at AT Expo in Rosemont, IL. In addition, a live lead-free selective soldering demonstration with the alloy is in booth 5437.
SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel.
SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel.
The small amount of nickel modifies its behavior so that in wave soldering it exhibits fluidity comparable with tin-lead solder. Excess solder drains easily off the joint, so bridges and icicles are avoided. Provides smooth, bright, well-formed fillets which make inspection easy.
Does not contain silver or phosphorus, is less aggressive towards the copper of tracks and pads or the stainless steel components of soldering equipment. Has a low dross rate.
AIM, aimsolder.com
Polyonics introduces 1 and 2 mil color polyimide labels. The labels are
coated with a permanent pressure-sensitive acrylic adhesive and a high
opacity, medium gloss topcoat available in six tinted colors ¾ pink,
yellow, orange, blue, green and violet. They are thermal transfer
printable and scan with both visible and IR scanners. Barcode labels
made from the materials reportedly demonstrate excellent performance in
lead-free wave solder environments, which range from 260º to 290ºC.
Designed for barcode or alphanumeric identification of PCBs or electronic components, can withstand mixed circuit board processes, on either the top or bottom side of the board. Said to have excellent resistance to harsh fluxes, cleaning agents, saponifiers and wave solder environments, and resist common methods of cleaning.
Polyonics developed the labels, which will survive both standard and lead-free processes on top or bottom side of the board, for manufacturers looking to color code production/process lines. Some companies choose to use the plain white polyimide labels for standard “non-compliant” subassemblies, and a color-coded label (e.g., pink, yellow, orange, blue, green or violet) for the compliant products.
Polyonics Asia Ltd., polyonics.com
Designed for barcode or alphanumeric identification of PCBs or electronic components, can withstand mixed circuit board processes, on either the top or bottom side of the board. Said to have excellent resistance to harsh fluxes, cleaning agents, saponifiers and wave solder environments, and resist common methods of cleaning.
Polyonics developed the labels, which will survive both standard and lead-free processes on top or bottom side of the board, for manufacturers looking to color code production/process lines. Some companies choose to use the plain white polyimide labels for standard “non-compliant” subassemblies, and a color-coded label (e.g., pink, yellow, orange, blue, green or violet) for the compliant products.
Polyonics Asia Ltd., polyonics.com
Rochester, NY and Bromont (Quebec), Canada -- Hover-Davis will offer Cogiscan RFID hardware and software applications compatible with its range of component feeders, including tape feeders, label feeders, and Direct Die feeders.
By combining the Cogiscan Smart Material Control technology with its component feeders, Hover-Davis will be able to provide a one-stop shop for Intelligent Feeding Solutions.
Features of intelligent feeders include:
Identify and track components and feeders with barcode and RFID
Provide real-time visibility of all materials on the shop floor
Reduce waste of time and materials
Eliminate human errors and improve productivity
Generate complete component traceability reports
Standardize data acquisition across multi-vendor lines
Enable communication between feeders, machines and systems
Hover-Davis, hoverdavis.com
Cogiscan, cogiscan.com
Press Releases
- AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
- STI Electronics, Inc. Achieves ISO 13485:2016 Certification, Demonstrating Commitment to Quality in Medical Device Manufacturing
- Indium Corporation to Showcase Solder Products, New Flux-Cored Wire Formula at SMTA International
- Saki Strengthens Presence in India