Auto-Focus software automatically selects the best reflow oven recipe for new products without running a profile by evaluating a database of previously setup products and extrapolating a new oven recipe based on product and oven characteristics. Instead of relying on a technician’s guess, the user enters the product’s length, width and weight. After a dozen products that cover the required range have been set up properly, the accuracy and quality of the oven recipes developed is so high that most users may no longer find it necessary to run a verification profile.
 
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
 
KIC, kicthermal.com
Booth 363

The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system. 
 
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
 
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
 
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
 
Finetech Inc., finetechusa.com
Booth 1481

MS2 molten solder surfactant eliminates dross in wave soldering. Available for both leaded and lead-free processes, does not mix with the metal but forms a thin floating layer that covers the entire solder surface except the wave, which it does not disturb. Prevents dross from forming on the surface and immediately converts any dross generated by the wave back into usable metal. Said to reduce solder usage by as much as 40 to 75% and result in other dross-related cost savings.
 
P. Kay Metal, pkaymetal.com
Apex booth 2635

The easy-wire CH2 high-voltage wiring harness/backplane tester offers test voltages to 1500VDC and 1000VAC in a modular system. Can be ordered with as few as 160 test points and expanded to 20,000.  Future capability to 100,000 points is expected.
 
Runs on Windows-based easy-wire software. 
 
Can self-learn the wiring pattern from a sample assembly. Can be programmed through its onboard wirelist editor, or test programs can be imported from CAD/CAE generated data files. Measures resistance from .1 to 1MW in standard two-wire mode, and as low as .001W in four-wire mode. Detect sshorts in <1 sec. and checks for opens, shorts, mis-wires and high-resistance errors, as well as testing components in the assembly.  High voltage tests verify insulation up to 1GW.
 
Can also be used as a zero-defect wiring assembly aid, guiding the operator through the assembly process with on-screen connector graphics and red/green LED indicators.
 
Cirris Systems Corp., cirris.com

Concept FX II high-resolution x-ray inspection system features configuration flexibility. Has six axes of motion control, ergonomic design and a no-clamp sample tray for fast load and unloading.  The x-ray source and detector tilt off-axis in relation to the sample for oblique object viewing of PCBs up to 20x24”. 
 
VIPx is offers advanced image processing and failure analysis for manual and semi-automated x-ray inspection. Said to provide robust analytical measurement tools and image enhancement filters suitable for upgrading almost any x-ray inspection system, manual or semi-automated, with PC-based functionality. 
 
FocalSpot, focalspot.com
Booth 843

 
The option allows for leads to be inspected during the insertion process and has been adapted to the company’s odd form assembly systems.
 
A camera has been mounted to a programmable X-Y stage below the board and inspects the leads once they have been inserted. The programmable stage allows the camera to move with the robot to each new location on the board as well as to multiple locations on the board for each insertion required for large parts.
 
"Driven by our customer demands to trap defects of Odd Form thru-hole components during the board assembly and not at a distant test station, Chad Industries developed a new vision tool and process to meet these needs," said Scott Klimczak, president of Chad Industries. "With this new design we are inspecting the component leads where it matters, after the part has been inserted."
 
The tool uses Adept Vision sAVI.
 
Chad Industries, chadindustries.net

 

Booth 1363

Neither an operator nor a maintenance technician is required to scrape solder paste from the bottom of a wash tank. Prevents solder paste from entering a waste stream, eliminates direct contact between an operator and the paste. 

Available in SonicOne G3 automatic stencil cleaning systems and will be introduced on semi-automatic models throughout 2006.

Aqueous Technologies Corp., aqueoustech.com

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2-D vision inspection option on the 4710 detects lead defects. Is compatible with a high-speed camera, verifies all leads are within some tolerance before the chips are shipped to the customer. Detects edge pitch, which identifies skewed leads at 0.02 mm and trend edge position, which identifies lifted leads at 0.04 mm.

Used on automated programming systems, the vision system mounts onto a tape loader and integrates with BP Win and Jobmaster.
 

FLX2010-LCV flexible pick-and-place system is designed for high-mix/low-volume production. The company claims to feature the largest board size and feeder capacity in the industry while also taking up one of the smallest footprints.
 
FLX series offers changeover without downtime, via intelligent feeders, large feeder capacity and offline programming and job planning. Start at 5,000 CPH with 150 feeders inline and can expand to 15,000 CPH with over 470 feeders.
 

Can accept nearly any kind of feeding system, even an independent unit such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. Equipped with laser and vision alignment systems. 
 

 

 

Booth 915