B2 Benchtop automated optical inspection system for post-reflow PCBs is said to offer up to a three times improvement in inspection speed and improved fusion lighting to provide defect coverage. Features large board handling in a compact package, and complete software/board setup compatibility with the inline F1 series.
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
YESPC software provides real-time process monitoring. Continuously monitors inspection results, so users can immediately react to critical process events. In a networked environment, user defined charts and alarms can be accessed remotely via Web browsers. It can also provide email alerts.
Provides diagnostic and trending analysis of the manufacturing process.
Features a package of SPC charts, including X-bar range, X- moving range, histogram, Pareto analysis, scatter plot, Cp, CpK and other reports that provide real-time alarms for out-of-tolerance conditions. Compatible with YESTech AOI and YTX-5000 combined x-ray/vision system.
MEP 6T servo electric press specializes in the application of compliant pin connectors to PCBs.
Uses a PC-controlled servo drive to control and monitor force, position and speed throughout the press cycle. By monitoring the entire press cycle, it can determine if a connector is being applied incorrectly and stop the process to avoid scrap and rework. Complete press cycle data can be stored for each connector applied to provide full traceability for the entire PCB.
Programming is provided through a Windows interface with database-driven software. Each connector can be pressed to a different level of force or distance without any operator setup.
Connectors can be terminated on force or distance while providing control of the speed of the press cycle, including the ability to dwell for a specified time. Can be used in applications other than press-fit connectors such as PEM nuts, rivets and heat sinks.
Provides up to 6 tons of pressing capacity, can accommodate PCBs up to 24 x 36". The 10" wide press ram allows for the mass-termination of more than one connector (of the same type) in a single press stroke. Options include an air table to allow for easy PCB movement and tooling stack up, tool-in-place sensor to ensure proper tool location and complete turnkey solutions including insertion tooling and PCB fixtures.
The Commercial Products division of Branson introduces support racks for the bottom of the ultrasonic tank. Parts baskets are required to suspend items in the solution, however they are not practical for all ultrasonic cleaning applications. Support racks provide a stable, flat surface upon which parts, fixtures, or containers may be placed. Open design with integral rubberized “feet” will not inhibit chemistry circulation or ultrasonic energy.
Also useful as countertop support racks following cleaning or processing. Hold containers or components off the table to facilitate air circulation and drying. A range of sizes is provided to access the full volume of your tank. Have stainless construction for chemical compatibility, electro-welded design for durability, bright electro polished finish for cleanliness. For use with .5 to 5.5 gal units.
Until now, optical chips have been cut out of a silicon wafer and then placed individually into housings. However, the dimensions of these casings are several times the size of the chip itself. Schott’s Thin-Glass Wafer-Level-Package with BGA on the backside concept aims to manufacture miniature opto-housings. Instead of packaging individual chips, the technique “packs“ the more than 1000 chips that the entire wafer yields at the same time. Production started at the Electronic Packaging business unit in Singapore last October. The company aims to manufacture approx. 3 million chips per month with its staff of 65 employees. SCHOTT North America, us.schott.com
CSM 200 Connector Seating Machine is a semiautomatic machine for the application of compliant pin connectors. A BMEP servo electric press allows for the monitoring and control of force, distance and speed during the press process.
Operators manually load a PCB and connectors onto fixtures and tooling. The CSM automatically positions the connectors on the PCB and then an X/Y table with PCB fixture locates the PCB (up to 8 x 11") under the servo press head for processing the connector. Automatically sequentially presses each connector on the PCB to the required specifications. Each press cycle is monitored and can be stopped if an error occurs. Each press cycle can be recorded to provide real-time feedback with full traceability for every connector applied.
Specializes in processing right-angle board edge connectors with non-overmolded pins. Uses “comb” tooling to ensure proper location of the pin legs to the hole pattern in the PCB ¾ allowingr faster processing, less scrap and lower applied cost.
LSM-500S Series Laser Scan Micrometers use high speed scanning to deliver a high data sampling rate.
Offers 3,200 scans per second at a repeatability of ±0.03µm (LSM-500S) to inspect rapidly moving or vibrating workpieces such as optical fiber, fine wire, micro shafts, films, ferrules and similar items.
Incorporates an edge-detection circuit, which simplifies finding and aligning on workpiece edges. Said to feature easy operation, robust construction and a wide measuring range.
Data can be output via a standard RS-232C and I/O analog interface for use in multiple statistical analyses.
Chassis Carts are ideal for 19" chassis handling for box build. Offer fully adjustable rails to fit all chassis sizes. Open-top cart design accommodates vacuum lift heads to place chassis in and out of the cart. Also available: ESD Softsurface material on the top, bottom and side of the rails, and front vertical post edges of the cart. This protects the chassis from scratches and dents during handling. The cart can hold up to 1,000 lb.
Kester’s Apex booth will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Featured products include: EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure K100 lead-free bar solder alloy, along with technical services to help manufacturers assemble Pb-free. An interconnecting materials catalog will be debuted.
VectraElite soldering system will make its North American debut at Apex. It expands on the core subsystems of the Vectra wave soldering system. In addition to improved system wide access, a new rollout solder pot design and an advanced control system, it features UltraFill nozzles, upper High Velocity Convection (HVC) preheat module and a ServoJet fluxing system.
The company will also preview its Post Wave Cooling (PWC) module and the Optima ultrasonic spray fluxing system featuring Ultra-Spray technology.
Speedline will also preview new options for its MPM Accela printing system as well as spotlight an array of its MPM printing, Camalot dispensing, and Electrovert soldering and cleaning solutions.
SFX-TAP4/CR is the newest member of ScanflexTAP transceivers, developed for integration in Flying Probe Testers (FPT) offering four parallel independent TAP.
This seventh TAP transceiver can be freely combined with all Scanflex controllers on PCI, PXI, USB or LAN basis, with distances up to five meters. Each TAP offers programmable input and output impedance, stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz, programmable delay compensation, read-back of output signals and a relay controlled power signal. This enables an optimal UUT configuration over distances up to 1.5 m. Feature captive CION interface chips (ASIC) and additional safety measures. Features 32 voltage-programmable dynamic I/O, two analog I/O channels, three statistic I/O and trigger lines.
All TAP signals and PIO channels are galvanically isolated from the UUT, and can be tested for operation directly in the system by means of an integrated Built-In-Test (BIT).
The transceiver has a particular slot for coupling with Scanflex I/O modules; or various SFX I/O modules can be connected via an SFX/LS interface.
Supported by software System Cascon from version 4.2.1 on and is compliant with standards IEEE 1149.1, IEEE 1149.4, IEEE 1149.6, IEEE 1532 and JESD71. The software automatically recognizes the transceiver by the AutoDetect Feature.
Aegis introduces the "MCAD" system to support box and mechanical product documentation, tracking, quality and materials management. Customers may now support any discrete assembly processes—from circuit boards to full system level assembly—in a single information system.
MCAD functionality is inherently incorporated within the Web-centric manufacturing execution system (MES). Shop-floor operators can step through and drill into iView's existing sequential assembly process feature with intelligent cross-reference to the mechanical components.
MES also supports multi-level assemblies and material setup validation at any work station, and these assemblies are now better depicted in the visual aids.
Features include:
·Support for common mechanical CAD vector file formats;
·Simple digitizing for 2-D capture from a 3-D drawing with the desired user-controlled perspective;
·A mechanical Shape Library permits re-use of commonly used items and components;
·A color-coded parts list display for easy cross-referencing to the drawing.
The module is a cost option available in the upcoming 6.1 release; existing customers have been offered this option at no charge.