Visiprise Manufacturing 4.1 builds on its integrated manufacturing platform rolled out earlier this year. Said to provide increased performance and scalability while improving system security.
 
New features include:
Integrated Product Dashboard: allows users to view work instructions, assembly components and data collection requirements through a single, configurable dashboard.
Device History Record Reports: for manufacturers producing items requiring compliance, displays a complete history of a product through a single view or record.
Time-based Component Traceability: includes feeder staging for faster machine changeover for electronics manufacturers.
Lightweight Directory Access Protocol (LDAP): permits authentication using secure, single sign-on when accessing the application across the Internet.
Enhanced Data Collection: enables manufacturers to require that certain data be approved and validated and supports the use of formulas.
 

Speedprint Technology Ltd., a division of Blakell Europlacer Group, is offering Novatec’s VacuNest Shape Memory Tool on its printer platforms through an OEM supply agreement.
 
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. The shape will be held until the vacuum is released, and the modules return to their original form awaiting the next version of board.
 
Will not damage a component due to the pin/printing pressure, support forces are evenly spread over the entire board, provides firm and precise support and can be simply reset when a board version changes.
 
 

 
Said to guarantee board flatness; is not sensitive to solder paste contamination.
 
VacuNest, www.novatec-eap.com
Speedprint, www.speedprint-tech.com
 

Wickgun Desoldering Braid Dispenser is a hand-held tool that allows users to dispense, position and cut-off braid using one hand while holding a soldering iron in the other.  Features a braid with no clean flux (for use with Pb-free solder), is said to eliminate handling braid, reduces waste and speeds desoldering.
 
Available in four braid sizes from 0.035” to 0.110” W, the replaceable cassettes are preloaded with 15 ft. of braid and are easy to change.  Braid is advanced and retracted using a thumbwheel can be cut-off by squeezing the trigger.
 
Xuron Corp., xuron.com

A hand-held X-Ray Fluorescence (XRF) NITON analyzer is equipped with a helium purging mechanism for direct analysis of “light elements.” The analyzers provide immediate chemical analysis of alloys, electronic materials, coatings, plastics and more.
 
NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site.
 
Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users.
 
For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
 

SCC-700 Cooling Conveyor station provides a quick PCB cool down that occupies a minimal amount of floor space.
 
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
 
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
 
A vertical lift door seals in the cold air, but provides easy access.
 
Promation, Pro-mation-Inc.com

DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
 
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
 
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
 

ETCO Mighty-T Press is a bench-top semi-automatic press and wire terminal applicator for low volume users that replaces hand crimping. Features a rigid one-piece cast iron frame, employs a 40 mm stroke with 4,450 lbs. of crimping force and includes a footswitch, safety interlock and reel arm.  Wire terminal applicator has a two-piece anvil to crimp wire and insulation ear sections in a single stroke. Eliminates hand crimping and has an open architecture for easy feed adjustment and tooling changes.
 
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling.  Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
 
 
ETCO Inc., etco.com

Building on its portfolio of high-speed backplane connectors, Tyco has introduced the Z-PACK MAX connector as a cost-effective interconnect for backplane applications where high speed, high density and high performance are needed.
 
“In listening to our customers we heard the need for a cost effective high-speed product and quickly focused significant resources in responding to that need. The result of that effort is the Z-PACK MAX product line,” said Bob Hnatuck, high-speed backplane connector product manager. “One of our goals is to offer a portfolio of products which provides our customers with options and gives them the flexibility to meet their requirements. The Z-PACK MAX backplane connector system performs at speeds up to 10 Gbps and beyond for applications including servers, storage devices, switches, routers and similar high-speed signal applications.”
 
To achieve the 10+ Gbps speed, ground contacts are positioned within each connector column and are combined with lead frame arrangements within the connector to achieve low crosstalk and high throughput. Employs a shield-less design. Dual point contact mating and compliant pin board mounting help ensure reliability. Meet Telcordia requirements and are RoHS compliant.
 
Available in a five-pair version (with 26 pairs per 10 mm, or 66 differential pairs per in.), or a four-pair version (with 21 pairs per 10 mm, or 53 differential pairs per in.). Accommodate 25.40 mm (five pair) and 20.32mm (four pair) card slot spacing. Planned product extensions include a three-pair version for narrow card pitch applications, right angle pin headers for coplanar applications, vertical receptacles for mezzanine applications and high-speed cable assemblies.

Tyco Electronics, www.tycoelectronics.com

K2000 motorized circular blade depanelizer separates prescored PCBs without dust or scrap. Available with XY table for improved board handling.
 
PCB panels are singulated by passing the scoreline between two circular blades. Front and back blade guards assure operator safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.
 
When using the XY table, the operator places the PCB onto the guide rails of the table and brings the scoreline between the top and bottom blade guards to pass it to the cutting area. The motor driven lower blade of the K2000 will pull the PCB through to separate the panels. Two cutting speeds are available for optimal PCB separation. Singulates panels up to 12.5 in. Blades are made of tool steel and can be re-sharpened.
 
The tooling plate for Simm cards allows exact placement of the PCB matrix onto the moveable base. The plate is positioned on the right side for singulating the carrier strip on the left of the panels and then moved to the other side to singulate the remaining carrier strip. Adjustable end stops for the tooling plate allow for positioning of the scoreline with the circular blades. Tooling pins and support rails for either side of the panel provide safe placement and support of the SIMM cards. The rails can be adjusted to insure that there is no contact with the components on the cards.
 
FKN Systek, Fknsystek.com

Portable Leak Finder is a troubleshooting tool to find small leaks in chambers, connections or parts.
 
Is a rechargeable container for helium gas with a spray nozzle similar to an aerosol can. Helium is sprayed onto the suspected leak location of a part or chamber and can then be observed on a mass spectrometer system that continuously measures the helium concentration in the part while under vacuum. A leak is immediately identified if helium is drawn into the part or chamber by the vacuum inside. The mass spectrometer responds to concentration change caused by new helium being drawn into the part or chamber. The timing of the response corresponds with the location of the helium being sprayed at the time of the response to accurately indicate the leak location.
 
Kit includes a recharge fitting and comes in a protective, custom-made carrying case. Valves, pressure gage and pressure relief valve allow safe recharging of the canister.
 
Cincinnati Test Systems, cincinnati-test.com

Scapa 650 is a high-temperature masking tape for low static protection of gold plated finger tabs, assembly holes and components during flux, preheat and soldering processes.  Also designed for high-temperature industrial masking in clean room environments.
 
Consists of a specially treated paper, single coated with a silicone pressure sensitive adhesive.  The masking tape reportedly delievers low electrostatic discharge at unwind, eliminating PCB degradation.  After processing, the silicone adhesive removes cleanly and easily from the surface without leaving adhesive residue.
 
During hot air leveling and wave soldering, it provides protection against chemical, solvents, solder and rinse water. Has a wide operating temperature range.
 
Scapa Industrial, scapaindustrial.com

Custom wave solder fixtures are manufactured using the same Gerber and drill files which describe the board, to speed production and improve performance.
 
Datum Wave Solder Fixtures are designed using customer supplied Gerber and drill files, which allows precise routing for component bottom-side pocketing and permits thicker, stiffer and more stable fixtures. With stepped-down openings on the solder side to prevent turbulence and component skipping, the fixtures provide a positive-locking clamp system to secure the board and for complete solder coverage.
 
Virtually eliminate the need for glue dotting, feature precise routing for component depth to prevent solder flooding and facilitate trouble shooting. Accommodate densely populated boards with tall secondary side components, can solder through-hole components directly adjacent to SMT devices. Can be supplied for boards up to 24” W.
 

Datum Dynamics USA, datumdynamics.com