Products
Photo Stencil aquired the AMTX E-Blade electroformed squeegee blade from Xerox. It is said to improve printdeposition, quality, uniformity and consistency. With a rigid, low-friction, hard-nickel edge, the blade provides cleaner prints, reduced stencil wear and less material waste.
"The electroformed E-Blade demonstrated the lowest squeegee pressure of any other squeegee blade I have tested for both SMT and wafer bumping printing," said Rick Lathrop, technical service manager of surface-mount materials at Heraeus. Heraeus recently completed a study on squeegee blades. "With lower print pressures come all of the benefits of reduced understencil wiping frequency and increased stencil life. The lack of paste scooping in large apertures for wafer bumping can only enhance bump coplanarity for automotive and WLCSP applications."
The blade also addresses issues caused by Pb-free printing. Pb-free solder paste requires higher squeegee pressures for a clean wipe of the stencil. The E-Blade prints at 33% of the squeegee pressure of other popular squeegee blades. High squeegee pressures result in "smear mode" printing whereas low squeegee pressure allows "sheer mode" printing.
Photo Stencil, www.photostencil.com
Almit Technology will debut a new Pb-free paste at Nepcon UK this April, created specifically for printing at up to four-times the normal printer excursion speed. LFM-48 TM HP solder paste reportedly enables increased productivity, allowing European assemblers to bid successfully against competitors in low labor cost countries.
The paste is said to exhibit good wetting, high definition printing with long screen and tack life. It is approved and adopted by major manufacturers worldwide for open blade printing and enclosed print head systems.
For through-hole assembly and rework, Almit has also introduced cored solder wire featuring 96.5%Sn-3%Ag-0.5%Cu alloy. KR-19SH RMA wire retains the benefits of the original product to deliver wetting, high reliability and low residue. It is available in diameters from 0.3 to 1.6 mm on 0.5Kg reels – and in selected sizes on anti-static Handy Reels.
Almit Technology Ltd., almit.com
Visit Stand C2 at Nepcon UK
Tyco Electronics’ Global Application Tooling Division (GATD) has collaboratively worked with Graphic Solutions International (GSI) to provide them with an RFID Inlay assembly system. This equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
Working closely with GSI, Tyco provided a reel to reel system that allows GSI to mount flip-chips, SMDs and printed batteries on a continuous web of printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ (1,800+ m) roll of 20" wide material. After conductive printing, the roll is fed into the Tyco machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip and a printed antenna. Its speed allows for production levels up to 26 million inlays per year.
The continuous web assembly system produces inlays that offer performance improvements over conventional PCBs. The system allows mounting flip chips for almost any purpose, as well as the ability to mount most standard SMDs along with GSI’s printed batteries. Can mount on paper, PET or other flexible substrates, and features a variable width capability up to 20" wide. Can accommodate printed substrates from 0.002" to 0.005" thick, mount on continuous rolls with a repeat pitch of 0.8" and position chips to micron accuracy.
Graphic Solutions International, graphicsolutionsinc.com
Tyco Electronics, tycoelectronics.com.
SFX-TAP(x)/FXT, transceivers are additional components to the JTAG/Boundary Scan hardware platform Scanflex. The TAP transceivers (SFX transceivers) were developed for integration into in-circuit testers (ICT) and optionally offer 2, 4, 6 and 8 parallel, independent TAPs as well as additional resources and special functions.
In contrast to previous Scanflex TAP transceivers, the new models’ TAP Interface Cards (TIC) type 02 are no longer integrated but are differentially coupled with an up to 2 metres long IDC or Wire Wrap cable. Even at high frequency signal transitions, a TAP signal transmission to the TIC02 modules of up to 80 MHz is guaranteed. The low-cost modules provide externally programmable input and output voltage per TAP as well as relays for the galvanic isolation from the UUT. Furthermore, there is a mechanism to adapt the interface to various driver requirements. For each TAP there is a programmable delay compensation combined with stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz.
Features include 32 voltage programmable dynamic I/O, two analog I/O channels and three statistic I/O and trigger lines.
Has a slot for coupling with Scanflex I/O modules. Alternatively, various SFX I/O modules can be connected via an SFX/LS interface. These extensions allow the configuration of almost unlimited additional analog or digital resources.
GÖPEL electronic, www.goepel.com
In contrast to previous Scanflex TAP transceivers, the new models’ TAP Interface Cards (TIC) type 02 are no longer integrated but are differentially coupled with an up to 2 metres long IDC or Wire Wrap cable. Even at high frequency signal transitions, a TAP signal transmission to the TIC02 modules of up to 80 MHz is guaranteed. The low-cost modules provide externally programmable input and output voltage per TAP as well as relays for the galvanic isolation from the UUT. Furthermore, there is a mechanism to adapt the interface to various driver requirements. For each TAP there is a programmable delay compensation combined with stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz.
Features include 32 voltage programmable dynamic I/O, two analog I/O channels and three statistic I/O and trigger lines.
Has a slot for coupling with Scanflex I/O modules. Alternatively, various SFX I/O modules can be connected via an SFX/LS interface. These extensions allow the configuration of almost unlimited additional analog or digital resources.
GÖPEL electronic, www.goepel.com
Compact Desktop System S2088 provides automated optical inspection of paste print and pre/post reflow. Suited for serial production during shift work, prototype programming, prototype laboratory development or as testing support for new assemblies.
Covers all inspection stages – paste print, pre and post reflow. Features a new high-resolution color camera. The illumination is compatible with existing Viscom systems, the software and programming environment is identical. Programs can be imported to in-line. The loading is carried out via a PCB drawer with single-button operation. PCBs up to 17.7 x 15.7” can be handled.
System processor, axis control and all other important components are integrated into the compact design. This makes external cabling unnecessary. Has precise linear drives with high resolution measuring systems. Mmachine capability tests can be carried out.
Viscom will have a booth at the SMT/Hybrid/Packaging Show, Hall 7, Stand 7-211.
Viscom, viscom.com
Covers all inspection stages – paste print, pre and post reflow. Features a new high-resolution color camera. The illumination is compatible with existing Viscom systems, the software and programming environment is identical. Programs can be imported to in-line. The loading is carried out via a PCB drawer with single-button operation. PCBs up to 17.7 x 15.7” can be handled.
System processor, axis control and all other important components are integrated into the compact design. This makes external cabling unnecessary. Has precise linear drives with high resolution measuring systems. Mmachine capability tests can be carried out.
Viscom will have a booth at the SMT/Hybrid/Packaging Show, Hall 7, Stand 7-211.
Viscom, viscom.com
Lead Eliminator uses a combination of chelating agents and other ingredients to lift and remove lead and heavy metals from a variety of surfaces such as Formica (commonly found in workbenches), stainless steel and aluminum, Lexan and other polymers, as well as materials found in and around SMT manufacturing lines, including painted surfaces and flooring. Has low toxicity.
Employs a combined proprietary chemistry and wipe technology that picks up and remediates lead and other heavy metals from work surfaces, tools, etc. Dual action remediation wipes and sprays remove heavy metals, soil and residue from affected surfaces.
Is part of the GlobalTech family of environmentally responsible products. Available in saturated wipes with one abrasive side and one smooth side in 100-count canisters of 6 x 9” wipes, or in one-pint spray bottles. Sold separately or as part of a lead remediation kit.
Employs a combined proprietary chemistry and wipe technology that picks up and remediates lead and other heavy metals from work surfaces, tools, etc. Dual action remediation wipes and sprays remove heavy metals, soil and residue from affected surfaces.
Is part of the GlobalTech family of environmentally responsible products. Available in saturated wipes with one abrasive side and one smooth side in 100-count canisters of 6 x 9” wipes, or in one-pint spray bottles. Sold separately or as part of a lead remediation kit.
JNJ Industries, Inc., jnj-industries.com
EMI Filters with optional surge suppression can be mounted with ¼” quick connect terminals; can be used wherever needed to control EMI – even multiple locations within a piece of equipment. Fully encapsulated construction complies with EN 133200 and UL 1283, while a UL94 VO plastic enclosure increases protection against electrical shock. Leakage current is reduced by eliminating the capacitor to earth ground connection. RoHS-compliant filters are ideal for appliances, medical devices, industrial equipment, motor control, lighting, recreational vehicles and more.
Available for 100 to 120 or 200 to 240 line voltages, provide high levels of EMI suppression in a convenient package. Standard models incorporate 5.0 mH common mode inductors suitable for up to 6 amp service. Options include bypass capacitors for increased differential mode noise rejection, and MOVs to protect against line transients. Custom configurations and multiple stage filters available.
Foster Transformer, foster-transformer.com
Available for 100 to 120 or 200 to 240 line voltages, provide high levels of EMI suppression in a convenient package. Standard models incorporate 5.0 mH common mode inductors suitable for up to 6 amp service. Options include bypass capacitors for increased differential mode noise rejection, and MOVs to protect against line transients. Custom configurations and multiple stage filters available.
Foster Transformer, foster-transformer.com
Checker 101E uses patterns to detect and inspect parts, for reliability. Offers the simplicity and power of the original, plus it directly accepts encoder signals, eliminating the need for a PLC when tracking and rejecting parts on variable-speed production lines.
“The simple-to-use Checker 101 sensor radically changed the way sensor users detect parts or part features, eliminating the complex wiring, mounting, ladder logic programming, and precise part handling required when using multiple photoelectric sensors,” said Brian Phillips, VP, expert sensors. “By directly accepting encoder signals, the Checker 101E eliminates the cost and complexity of a PLC for part tracking and rejection on variable-speed lines. Unlike the shift register of a PLC, which requires programming, Checker’s shift register is automatic, enabling it to accurately track up to 4,000 parts between the inspection and rejection point.”
Acquires and processes over 500 images/sec., can detect and inspect parts on fast production lines. If inspection is not required, it can detect and track parts or webs for improved process control.
Cognex Corp., cognex.com
“The simple-to-use Checker 101 sensor radically changed the way sensor users detect parts or part features, eliminating the complex wiring, mounting, ladder logic programming, and precise part handling required when using multiple photoelectric sensors,” said Brian Phillips, VP, expert sensors. “By directly accepting encoder signals, the Checker 101E eliminates the cost and complexity of a PLC for part tracking and rejection on variable-speed lines. Unlike the shift register of a PLC, which requires programming, Checker’s shift register is automatic, enabling it to accurately track up to 4,000 parts between the inspection and rejection point.”
Acquires and processes over 500 images/sec., can detect and inspect parts on fast production lines. If inspection is not required, it can detect and track parts or webs for improved process control.
Cognex Corp., cognex.com
Crysta-Apex C1600/2000 Series coordinate measuring machines (CMMs) handle measurement of large auto body and airframe assemblies and similarly sized components.
The large, bridge-type machines incorporate four-loop control to reduce cost and maintain accuracy. The low acquisition cost makes it feasible to bring CMM capabilities to inspect large workpieces used in the manufacture of heavy equipment, marine construction, automotive powertrain, etc.
The multi-sensor system uses high-speed, non-contacting digitizing probes (two- or three-axis) and a variety of scanning, vision or conventional touch probe inputs. When equipped with the SP80 long stylus (max 500 mm), it is capable of deep hole measurement. System software compensates for temperature and surface variations to ensure quality data acquisition under varying conditions.
Mitutoyo America Corp., www.mitutoyo.com
The large, bridge-type machines incorporate four-loop control to reduce cost and maintain accuracy. The low acquisition cost makes it feasible to bring CMM capabilities to inspect large workpieces used in the manufacture of heavy equipment, marine construction, automotive powertrain, etc.
The multi-sensor system uses high-speed, non-contacting digitizing probes (two- or three-axis) and a variety of scanning, vision or conventional touch probe inputs. When equipped with the SP80 long stylus (max 500 mm), it is capable of deep hole measurement. System software compensates for temperature and surface variations to ensure quality data acquisition under varying conditions.
Mitutoyo America Corp., www.mitutoyo.com
SolderStar will use Nepcon Shanghai to launch three easy-to-use thermal profiling packages, designed for the technical and budgetary requirements of low, medium and high volume Pb-free electronics manufacturing environments – SolderStar Lite, SolderStar Plus and SolderStar Pro. Visit booth 2J25-9 at the exhibit.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
Incorporating up-to-date battery technology, the instruments are said to have a higher working temperature than most alternatives, and they incorporate heat shielding, which keeps them cool even at higher processing temperatures. Measure just 20 to 25 mm thick. This makes them ideal for use in modern reflow ovens with limited tunnel height, typically used in the manufacture of miniaturised products, such as mobile phones.
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
Digitaltest GmbH will exhibit at the Nepcon Shanghai show with its distributor, Wacky International (Booth E1 B02), showing test systems and software suited for Asian electronics manufacturing needs.
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
DEK has developed processes for depositing silver epoxy and B-stage adhesives for die attach applications, for higher throughput and repeatability as well as enhanced control over deposit characteristics including total thickness variation (TTV).
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
Press Releases
- BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain
- StenTech Strengthens Precision Parts Platform with AME Acquisition
- Count On Tools Enhances Selective Soldering Precision with Expanded Nozzle Lineup
- ViTrox Presents Advanced Inspection and Smart Manufacturing Solutions at NEPCON Asia 2025