Products
SolderStar will use Nepcon Shanghai to launch three easy-to-use thermal profiling packages, designed for the technical and budgetary requirements of low, medium and high volume Pb-free electronics manufacturing environments – SolderStar Lite, SolderStar Plus and SolderStar Pro. Visit booth 2J25-9 at the exhibit.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
Incorporating up-to-date battery technology, the instruments are said to have a higher working temperature than most alternatives, and they incorporate heat shielding, which keeps them cool even at higher processing temperatures. Measure just 20 to 25 mm thick. This makes them ideal for use in modern reflow ovens with limited tunnel height, typically used in the manufacture of miniaturised products, such as mobile phones.
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
Digitaltest GmbH will exhibit at the Nepcon Shanghai show with its distributor, Wacky International (Booth E1 B02), showing test systems and software suited for Asian electronics manufacturing needs.
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
DEK has developed processes for depositing silver epoxy and B-stage adhesives for die attach applications, for higher throughput and repeatability as well as enhanced control over deposit characteristics including total thickness variation (TTV).
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
M1 AOI system was developed with enhancements to satisfy high-volume manufacturing environments in the Asian market. Has a small footprint and board handling system, is designed for maximum flexibility and can adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios.
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Tapered dispense tips provide fast flow and minimize bubbles when dispensing thick or particle–filled fluids like epoxy, silicone and brazing paste.
Precision molded polyethylene tips feature a tapered hubless design to provide smooth, unrestricted application of thick fluids; reduces rework and rejects by preventing bubbles that could cause variations in the size of fluid deposits.
The color-coded tips are available in six sizes (0.060” to 0.010” ID) to handle a variety of fluids and applications. All sizes feature double-threaded SafetyLok design for secure attachment without the risk of tips blowing off, especially when using higher dispensing pressures for thick fluids.
Available in two styles: UV-blocking translucent tips for benchtop applications, and rigid opaque tips for automated applications or light-sensitive fluids. Both are packaged in lint-free, see-through boxes of 50 that are lot numbered to simplify process control.
EFD, efd-inc.com
EFD, efd-inc.com
ASYS Inc. has launced the Depaneling System ADS 01FR for maxium productivity.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
ASYS, asys-group.com
Unifilm U801 and U801NP are acrylic transfer adhesives that reportedly deliver excellent peel strength and high temperature resistance.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
Scapa Industrial, scapaindustrial.com
Model 2200-545-037 two-component Miniature Mix-Dispense Valve precisely dispenses miniature beads and small volumes of low-viscosity pourable materials and abrasive or filled materials. Ideal for low-flow applications typically found in miniature potting, doming, filling and bonding operations.
The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow.
Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting.
Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps.
Sealant Equipment & Engineering, sealantequipment.com
The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow.
Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting.
Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps.
Sealant Equipment & Engineering, sealantequipment.com
A.C.E. Production Technologies will exhibit the KISS line of selective soldering systems suitable for Pb-free solders at Nepcon East in booth #6028. A.C. E. will also introduce its Dual Head Fluxer option that facilitates quick changeover of flux types. It is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free.
Rugged, reliable and compact, the line consists of the basic KISS 101 system and programmable KISS 102. The systems feature Pb-free compatible solder pots for assembly, prototyping and rework, post-reflow offline assembly and other selective soldering applications such as odd-form devices.
Standard and custom nozzles are available for both machines. Both are bench-top models with optional carriages for stand-alone use. A dual-head fluxing system for the 102 makes it possible to change flux types quickly.
Both can accommodate PCB’s from 2 x 2” up to 18 x 24”, and connectors up to 10” long.
A.C.E. Production Technologies, ace-protech.com
Rugged, reliable and compact, the line consists of the basic KISS 101 system and programmable KISS 102. The systems feature Pb-free compatible solder pots for assembly, prototyping and rework, post-reflow offline assembly and other selective soldering applications such as odd-form devices.
Standard and custom nozzles are available for both machines. Both are bench-top models with optional carriages for stand-alone use. A dual-head fluxing system for the 102 makes it possible to change flux types quickly.
Both can accommodate PCB’s from 2 x 2” up to 18 x 24”, and connectors up to 10” long.
A.C.E. Production Technologies, ace-protech.com
TNC 320 is a full function control that incorporates the features of the iTNC 530 control, including the ability to control five axes, but at a lower cost. Has analog drive interface, good for interfacing to existing drive systems on retrofit applications. Its one-piece construction minimizes cable runs.
Features a 15” TFT color flat-panel display (1024 x 768 pixels) for programming graphics and on-screen user support. Main computer has a large number of onboard cycles to simplify machining operations, from drilling and milling to workpiece probing. Conversational programming is standard and G-code programming is now possible with an added USB keyboard. The compact flash memory card stores the PLC program, commissions information and offers more user memory for NC files. Data interfaces include RS 232 as well as USB and ETHERNET.
Based on the new NC Kernel software platform. Benefits include a powerful interface between PLC and NC, eliminating redundant operations. Detailed help can by called for each parameter by pressing a button. Has expandable I/O capabilities making it viable for more complex machine applications.
The control will make its North American debut during the WESTEC show, March 27-30.
Heidenhain Corp., heidenhain.com
Features a 15” TFT color flat-panel display (1024 x 768 pixels) for programming graphics and on-screen user support. Main computer has a large number of onboard cycles to simplify machining operations, from drilling and milling to workpiece probing. Conversational programming is standard and G-code programming is now possible with an added USB keyboard. The compact flash memory card stores the PLC program, commissions information and offers more user memory for NC files. Data interfaces include RS 232 as well as USB and ETHERNET.
Based on the new NC Kernel software platform. Benefits include a powerful interface between PLC and NC, eliminating redundant operations. Detailed help can by called for each parameter by pressing a button. Has expandable I/O capabilities making it viable for more complex machine applications.
The control will make its North American debut during the WESTEC show, March 27-30.
Heidenhain Corp., heidenhain.com
Master Bond Supreme 3HT-80 is a one-component heat curing epoxy adhesive. It reportedly exhibits high shear and high peel strength. Offers resistance to impact, thermal shock, vibration and stress fatigue cracking. No-mix compound, has an unlimited working life and cures within 30 min. at 175°F (80°C).
Said to have excellent adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics. It forms bonds that are resistant to water, oil, fuels and most organic solvents even upon prolonged exposures. Operates at -100° to +350°F. Is 100% reactive and does not contain any solvents.
Available in half-pint, pint, quart, gallon and five-gallon containers. Also available in convenient cartridge applicators.
Master Bond Inc., masterbond.com
Said to have excellent adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics. It forms bonds that are resistant to water, oil, fuels and most organic solvents even upon prolonged exposures. Operates at -100° to +350°F. Is 100% reactive and does not contain any solvents.
Available in half-pint, pint, quart, gallon and five-gallon containers. Also available in convenient cartridge applicators.
Master Bond Inc., masterbond.com
BP Microsystems will showcase the latest addition to its automated device programmer family, the Helix, in Wong Kong King (WKK)’s booth 1F15 at Nepcon China/EMT China, scheduled to take place April 4-7, in Shanghai.
With the introduction of the Helix programming system, device programming customers can get the quality of automated device handling at a lower price point than traditionally available.
The desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7th Generation programming sites with FX4 socket module capability. This technology can program up to four devices simultaneously per site. Can handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
The operational sequence of the machine picks the part from tube input, transfers the part to the programming socket, programs the part and returns the part to tube output. Integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. The tooling head requires no vision system for handling fine-pitched parts, for an overall throughput of 800 devices/hr. One computer and software interface controls both BPWin software and handler control operations.
BP Microsystems, bpmicro.com
With the introduction of the Helix programming system, device programming customers can get the quality of automated device handling at a lower price point than traditionally available.
The desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7th Generation programming sites with FX4 socket module capability. This technology can program up to four devices simultaneously per site. Can handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
The operational sequence of the machine picks the part from tube input, transfers the part to the programming socket, programs the part and returns the part to tube output. Integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. The tooling head requires no vision system for handling fine-pitched parts, for an overall throughput of 800 devices/hr. One computer and software interface controls both BPWin software and handler control operations.
BP Microsystems, bpmicro.com
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