caLogo

Products

Aqueous Technologies will exhibit StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal at the upcoming Nepcon East exhibition and conference on May 10-11 in Boston.
 
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils. 
 
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
 
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
 
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
 
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
 
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.
 
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
 
IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.

 
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC. 
 
Available with optional SQL database connectivity.  Typical applications include tracking of process data by part number. 
 
JPSA, www.jpsalaser.com
 
The high-performance RC7M robot controller has a program processing speed five times faster than the previous RC5 model. Features user-friendly operation, light weight and compact size. Weighs under 50 lbs. and measures 440 x 425. x 157.5 mm.
 
Features an expanded range of communications interfaces, including 100 Base-T Ethernet, USB, RS-232C and Mini Parallel I/O. DeviceNet, Profibus and Parallel I/O ports are optional. The 3.25 MB memory (expandable to 5.5 MB) can hold up to 10,000 programming steps and 30,000 teach points. Fully compliant with the latest ISO, ANSI and CE safety standards.
 
Options include a new, improved teaching pendant with a large 7.5 in. color touchscreen and a lower-cost, high-functionality minipendant with a 128 x 64 pixel LCD display, as well as  WINCAPS II 3-D simulation software, which allows offline programming and remote, real-time monitoring of robot operation.
 
DENSO Corp., densorobotics.com
Juki Automation Systems will highlight the FX-1R High-speed Chip Shooter at the upcoming Nepcon East show in Boston.
 
Focusing on high throughput and precise component centering, it is equipped with a double head system driven by two independent linear motors that create high speed and positional accuracy. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser developed for Juki’s assembly systems. This technology simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time.
 
Has a placement rate of 27,000 cph  (IPC 9850), and a component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Has a placement accuracy of  ±40µm (3 Sigma).
 
Juki Automation Systems, jas-smt.com
Nepcon East Booth 4009
The Ultra TT Automation Series is an easily implemented dispensing robot system that reportedly improves productivity when making repetitive deposits of adhesives, epoxies, sealants, solder pastes and other assembly fluids.
 
The robot combines precision dispensing technology, closed-loop servo controls and powerful drive motors to make uniform dots, fill cavities or small containers with consistent volumes, and trace even lines over complicated part geometries—all with positioning accuracy of +/- 25 microns.
 
Integrates both the fluid dispensing hardware and software with a precision XYZ positioning platform. This approach saves workspace by eliminating the need for a separate computer or external dispenser controller.
 
Available with either 325 x 325 mm or 525 x 525 mm work envelopes. Both configurations can store 100 programs containing up to10 different dot and line styles, and are fully compatible with EFD’s precision dispense valves, syringe barrels and dispense tips.
 
EFD Inc., efd-inc.com

Aegis Europe will exhibit Mechanical CAD Module (MCAD) for CircuitCAM at Nepcon NEC, Birmingham at stand #H70. This system enhancement answers the increasing demand for an end-to-end NPI through MES solution supporting electronics assembly, system integration and box build. MCAD supports box and mechanical product documentation, tracking, quality and materials management as well as circuit card product launch and manufacturing execution. Customers may now support any discrete assembly processes—from circuit boards to full system level assembly—in a single information system.

 
MCAD functionality is inherently incorporated within Aegis’ Web-centric manufacturing execution system. Shop-floor operators can step through and drill into iView's existing sequential assembly process feature with intelligent cross-reference to the mechanical components. Supports multi-level assemblies and material setup validation at any work station; these assemblies are now better depicted in the visual aids.
 
Features and benefits include:
 
Support for common mechanical CAD vector file formats.
Simple digitizing allows 2-D capture from a 3-D drawing with the desired user-controlled    perspective.
A mechanical Shape Library permits re-use of commonly used items and components.
A color-coded parts list display provides easy cross-referencing to the drawing in the same manner used for circuit board visual aids.
 
Aegis Industrial Software Corp., aiscorp.com
HawkEye will be displayed on DEK’s flexible Horizon 01i screen printing platform. This system delivers high-speed performance for any manufacturing requirement – from high-mix to high-volume advanced assemblies, including 0201 and CSP packages. Equipped with the Instinctiv user interface for user-friendly operator control, the ISCAN control area network to support advanced features and an optimized frame for mechanical and thermal stability, the Horizon 01i delivers a 10 sec. cycle time, process capability of 2.0 Cpk @ ± 25µm and a low cost of ownership.
 
When HawkEye print verification is combined with the Hoizon 01i, the system becomes even more versatile. Isolates errors through good/bad verification set against user-defined, pre-set thresholds. Streamed images, instead of successive still images, are analyzed and any defective boards are identified and removed in real-time. Has 100% post-print verification at line beat rate with no programming required.
 
DEK, www.dek.com
Booth 2045
The iFlux is a magnetically controlled, air-driven spray fluxer. Its clean design makes it easy to use and maintain. Can handle most fluxes, including the new fluxes optimized for lead-free soldering.
 
Triple layer design features an air-driven, high precision Titanium nozzle with adjustable cone. The motion of the nozzle spray angle and the volume of flux are computer controlled with a password-protected touchpad. The nozzle is 30 mm from the board surface.
 
The air driven nozzle reportedly sprays a uniform, well defined flux deposit with excellent wicking. Has the velocity and volume control necessary to penetrate through-hole assemblies. Operates within tight parameters, leaving little overspray. Stores all the parameters for each job in its computerized control box so the operator can easily call up the correct settings for each production run
 
Can fit internally into most soldering machines with the control box either incorporated into the
existing machine or mounted externally. Or the entire spray fluxer and control box can be external.
 
Technical Devices Co., TechnicalDev.com

Fluid Dispenser Pen increases precision in fluid dispensing and eliminates the mess associated with dispensing bottles. The chisel point, spring-loaded tip allows users to determine the amount of liquid to be dispensed, thus reducing waste and chemical exposure.
 
While primarily used for flux dispensing, can also be used to dispense solvents, lubricants, masking, RMA chemistries, adhesives and water-based liquids. Prevents evaporation of material and conforms to current regulations for controlling substances capable of evaporation hazard. A dispensing valve prevents flooding and spattering, and releases liquid in controlled amounts to the nib.
 
The two parts (cap and reservoir) are easily assembled. The reservoir should be filled with material to within 19 mm (0.75”) of the top; this air chamber allows for the valve cap to be pressed securely in position. Priming is achieved by depressing the nib while the pen is vertical.
 
Can be used for rework and touch up soldering, as well asdistribution of solvents, lubricants, masking, RMA chemistries, adhesives and water-based liquids.
 
Fluid Dispenser with Brush Tip consists of a polypropylene cartridge with a fine nylon brush tip, and has a capacity of 7 cc. The fine brush tip allows users to reach small areas with increased accuracy.  The transparent cartridge allows the user to view the level of remaining material, and as applying light pressure to either side of the barrel dispenses the fluid, the user has complete control over the amount of fluid being dispensed. 

QTEK, qtek.com
Non-Silicone Heat Transfer Compound (HTC) provides efficient thermal coupling of electrical and electronic components. Provides non-creep characteristics and thermal conductivity even at high temperatures: 0.9 W/m.K. Has a broad operating temperature range (-50º to +130º) and offers low toxicity.  HTC Plus (HTCP) provides even higher thermal conductivity at 2.8 W/m.K with superior heat transfer characteristics.
 
Silicone Heat Transfer Compound (HTSP) is a thermally conductive paste for special applications where thermal management is critical. Operates from -50º to +200º, is a metal oxide filled silicone oil providing thermal conductivity at 3.0W/m.K.
 
The flame retardant ER 2074 epoxy resin exhibits thermal conductivity and is free of abrasive fillers such as alumina. Ensures less wear on mix and dispense and other processing equipment. Shows low viscosity when mixed and the exotherm temperature rise on curing is low.
 
Aquacoat Plus eliminates the need for extraction and other precautions normally required for the application of conventional solvent-based conformal coatings. The aqueous conformal coating is non-flammable, contains low levels of VOCs and no isocyan­ates, so it can be soldered through without fear of highly toxic gases being produced. Is phenol-free, so is non-corrosive to cadmium and zinc plate. Based on polymeric materials, offers adhesion on a variety of substrates and a wide operating temperature range. Available in two formulations: WBP is the standard product and WBPS (Sprayable) is for use in selective film coating equipment. Is DEF-STAN, MIL and IPC-CC-830 and RoHS compliant.
 
Flexible Lead-Free Conformal Coating (LFCC) is transparent and fast drying. Designed to protect electronic circuitry processed with lead-free soldering products, it provides adhesion to lead-free flux and fluoresces under UV light for ease of inspection. Can be soldered through without highly toxic gases being produced and is non-corrosive to cadmium and zinc plate.
 
Electrolube, electrolube.com
Ovation Products has released the Quik-Lok PCB clamping system for MPM UP2000 and AP25-27 series printers. The device eliminates the conventional vacuum chamber board fixture common on most MPM printers and is field retrofitted in approx. one hour. 
The clamp provides secure, “over the top” PCB clamping as well as a tool-less, hands-off product changeover. 
 
Installation of this product enables the use of Ovation’s Grid-Lok automatic support tooling.

 Ovation Products, grid-lok.com
Sonoscan was granted US Patent #6,895,820 covering the  Virtual Rescanning Module (VRM).
 
The VRM technique permits engineers to acquire and save acoustic echo data from the entire volume of a part such as an integrated circuit package. The saved digital file can later be rescanned to make acoustic images as though the file were the physical IC package.
 
VRM is widely used to preserve data about parts before they go into production or into testing.  After a part has been altered by heat, testing or other factors, it is no longer too late to examine the part in its original condition.
 
In advanced flip-chip production, VRM is used with the patented Sonoscan method for Frequency Domain Imaging (FDI) to perform high-resolution non-destructive analysis of critical flip-chip interfaces.
                                                                       
Sonoscan Inc., sonoscan.com

Page 448 of 510

Don't have an account yet? Register Now!

Sign in to your account