Products
JNJ Industries’ AquaSonic AQP Solder Paste & Flux Remover has been certified by the South Coast Air Quality Management District (SCAQMD) as a Clean Air Solvent, meeting their new, more stringent requirements of 25 grams per liter or less of VOC.
JNJ Industries Inc., jnj-industries.com
It removes solder paste and flux from stencils, PCBs, tools and other surfaces quickly, effectively and safely. It is non- hazardous, non-flammable, virtually odor free, works well in ultrasonic cleaning machines and is available in concentrate form, or pre-mixed with water and ready to use.
Is more than 90% water based and all ingredients are 100% active. Removes the toughest no-clean and lead-free solder pastes, SMT epoxies and flux residues from all types of surfaces in electronic manufacturing environments and machinery.
JNJ Industries Inc., jnj-industries.com
Bishop and Associates recently released the 2006 edition of the Connector Market Handbook. The comprehensive seven-chapter report analyzes all aspects of the world electronic connector market, providing detailed connector statistics by equipment sector and product category for North America, Europe, Japan, China, Asia Pacific and the ROW.
Includes a chapter on worldwide connector industry results by region, equipment sector and product category. Data is provided for 1999-2005, with projections for 2010 (including five-year CAGRs). Includes 2004/2005 results by country for the European and Asia Pacific regions, as well as a 2010 forecast.
Bishop & Associates Inc., connectorindustry.com
Includes a chapter on worldwide connector industry results by region, equipment sector and product category. Data is provided for 1999-2005, with projections for 2010 (including five-year CAGRs). Includes 2004/2005 results by country for the European and Asia Pacific regions, as well as a 2010 forecast.
Bishop & Associates Inc., connectorindustry.com
Aqueous Technologies will showcase Model SMT1000-CL Aqueous Cleaning/Defluxing System in Altus Group Ltd.’s booth, G20, at the upcoming Nepcon UK show.
Can remove water-soluble flux residues. Is equipped with a built-in closed-loop recycler, directing all process water through a filtration and de-ionization system. No water is sent to drain.
All SMT-Series cleaning systems feature an Intel X-Scale computer controller operating under Windows CE. A 10.4” (26.4 cm) touchscreen interface provides for intuitive programming. Real-time graphic displays allow an operator to monitor all program functions from a highly visible screen while multi-level password protection prevents unauthorized program changes. Optional features include multi-language support and SPC data-viewing via a built-in web server.
Focus-Wash spray system directs cleaning solution to all areas of the boards, including between and under components. The oscillating board rack and asymmetrical spray nozzle design produce millions of overlapping spray patterns, to eliminate shadowing. Produces more than five times the impact pressure of former models. Designed for fine-pitch, high-density SMT assemblies.
An onboard cleanliness testing system automatically monitors cleanliness and continues the cleaning cycle until the desired cleanliness level has been achieved. Access to historical cleanliness results is available via the built-in SPC data Web server.
A 1,500 CFM blower directs heated air into the wash/dry chamber.
Aqueous Technologies Corp., aqueoustech.com
Can remove water-soluble flux residues. Is equipped with a built-in closed-loop recycler, directing all process water through a filtration and de-ionization system. No water is sent to drain.
All SMT-Series cleaning systems feature an Intel X-Scale computer controller operating under Windows CE. A 10.4” (26.4 cm) touchscreen interface provides for intuitive programming. Real-time graphic displays allow an operator to monitor all program functions from a highly visible screen while multi-level password protection prevents unauthorized program changes. Optional features include multi-language support and SPC data-viewing via a built-in web server.
Focus-Wash spray system directs cleaning solution to all areas of the boards, including between and under components. The oscillating board rack and asymmetrical spray nozzle design produce millions of overlapping spray patterns, to eliminate shadowing. Produces more than five times the impact pressure of former models. Designed for fine-pitch, high-density SMT assemblies.
An onboard cleanliness testing system automatically monitors cleanliness and continues the cleaning cycle until the desired cleanliness level has been achieved. Access to historical cleanliness results is available via the built-in SPC data Web server.
A 1,500 CFM blower directs heated air into the wash/dry chamber.
Aqueous Technologies Corp., aqueoustech.com
Booth G20
Aquanox product family consists of aqueous chemistries for cleaning electronics assemblies. Superior solvency, mild pH and robustness make them suitable in a range of cleaning applications. Safely clean under low standoffs to remove tough surface-mount residues. Said to be easy to use, biodegradable, completely water-soluble and residue-free.
All products are RoHS compliant and designed with the environment in mind.
A4630 cleans Pb-free materials while providing low cost of ownership. This 6th-generation product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. Typically used in aqueous spray-in-air equipment at 10 to 20%, from ambient temperatures. Said to provides brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
A4520T aqueous chemistry for flush mounted and fine-pitch components cleans under low standoffs and in the tight spaces caused by smaller and more heavily populated devices. The 8th generation chemistry has proven effective on Pb-free, no-clean and eutectic materials. Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety.
A4520, a cleaning agent designed for reflowed no-clean flux residues, has been tested on more than 100 leading solder pastes, tacky fluxes and wave solder fluxes. Is effective on reflowed solder paste as well as uncured SMD solder adhesives. The concentrated cleaning solvent for aqueous batch or in-line spray machines is subjected to thorough screening of leading solder pastes prior to release. Is aqueous, non-hazardous, non-regulated and environmentally safe.
Kyzen Corp., kyzen.com
Booth G62
All products are RoHS compliant and designed with the environment in mind.
A4630 cleans Pb-free materials while providing low cost of ownership. This 6th-generation product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. Typically used in aqueous spray-in-air equipment at 10 to 20%, from ambient temperatures. Said to provides brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
A4520T aqueous chemistry for flush mounted and fine-pitch components cleans under low standoffs and in the tight spaces caused by smaller and more heavily populated devices. The 8th generation chemistry has proven effective on Pb-free, no-clean and eutectic materials. Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety.
A4520, a cleaning agent designed for reflowed no-clean flux residues, has been tested on more than 100 leading solder pastes, tacky fluxes and wave solder fluxes. Is effective on reflowed solder paste as well as uncured SMD solder adhesives. The concentrated cleaning solvent for aqueous batch or in-line spray machines is subjected to thorough screening of leading solder pastes prior to release. Is aqueous, non-hazardous, non-regulated and environmentally safe.
Kyzen Corp., kyzen.com
Booth G62
BP Microsystems will display the 4710 automated programming system, in Adaptsys’ booth at Nepcon UK .
Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
BP Microsystems, www.bpmicro.com
Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
BP Microsystems, www.bpmicro.com
Booth G30
Zestron, a supplier of high precision cleaning processes and services, will be exhibiting at Nepcon East on May 10 – 11.
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
Zestron America
Nepcon East Booth 2040
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
Zestron America
Nepcon East Booth 2040
Huntsman Advanced Materials has introduced two halogen-free laminating resins that comply with regulatory requirements for PCB manufacturing.
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations. This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion and low shrinkage.
Huntsman, huntsman.com/electronics
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations. This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion and low shrinkage.
Huntsman, huntsman.com/electronics
Surclean, a division of SMT, will showcase SMT USC400 at the upcoming Nepcon show and in Birmingham, U.K.
The portable ultrasonic contact type stencil cleaning system can remove difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame. Can be easily moved between work areas or printers.
An optional ultrasonic mini-bath cleans machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
The portable ultrasonic contact type stencil cleaning system can remove difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame. Can be easily moved between work areas or printers.
An optional ultrasonic mini-bath cleans machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Is lightweight for portability, has rugged industrial construction for long service life and is suitable for all stencil materials, even plastic. Suitable for cleaning all printable materials, including paste, inks, resists and SMD adhesives.
Surclean,surclean.co.uk
Nepcon UK, Booth J73
Surclean,surclean.co.uk
Nepcon UK, Booth J73
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, at the upcoming Nepcon U.K. show.
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
ESSEMTEC AG, www.essemtec.com
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
ESSEMTEC AG, www.essemtec.com
Nepcon UK Booth D20
Xpress 25 SMT placement system combines high-speed and fine-pitch capabilities within a compact footprint. The twin headed system can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec (25,000 cph equivalent, IPC: 18,900 cph). Equipped with “smart nozzles” and on the fly vision.
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.
Options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Nepcon UK Booth C10
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.
Options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Nepcon UK Booth C10
The EVS 3000 and EVS 6000 systems are part of the EVS Series.
Offering capacities of 10 kg/20 lbs (EVS 3000) up to 20 kg/44 lbs (EVS 6000), the machines have (in most cases) the facility for single operation dedrossing of even large wave soldering machines. Large integrated hopper makes rapid transfer of dross simpler and safer, and reportedly speeds dedrossing times by up to 50%.
In the enclosed automated system, hot dross is loaded into the large hopper and sealed into the machine. The process recovers the solder into a solder tray in the form of ingots that are easily placed back into the solder pot and deposits the spent dross automatically through a chute to a covered dross bin. Air is extracted via a standalone, four-part filtration system.
A Hopper Extraction System prevents the escape of any fumes and dust that may be generated when loading. An automatic air-knife cools the molten solder ingots until they are safe to handle. Premature removal of the ingot tray is prevented by a safety lock. Handling and moving of dross is reduced to a minimum as it is contained until it is automatically ejected into the dross bucket.
Safety features are built into the machine to protect against misuse and abuse.
EVS International, solderrecovery.com
Nepcon UK Booth G5
Offering capacities of 10 kg/20 lbs (EVS 3000) up to 20 kg/44 lbs (EVS 6000), the machines have (in most cases) the facility for single operation dedrossing of even large wave soldering machines. Large integrated hopper makes rapid transfer of dross simpler and safer, and reportedly speeds dedrossing times by up to 50%.
In the enclosed automated system, hot dross is loaded into the large hopper and sealed into the machine. The process recovers the solder into a solder tray in the form of ingots that are easily placed back into the solder pot and deposits the spent dross automatically through a chute to a covered dross bin. Air is extracted via a standalone, four-part filtration system.
A Hopper Extraction System prevents the escape of any fumes and dust that may be generated when loading. An automatic air-knife cools the molten solder ingots until they are safe to handle. Premature removal of the ingot tray is prevented by a safety lock. Handling and moving of dross is reduced to a minimum as it is contained until it is automatically ejected into the dross bucket.
Safety features are built into the machine to protect against misuse and abuse.
EVS International, solderrecovery.com
Nepcon UK Booth G5
Speedprint Technology, a division of Blakell Europlacer Group, will display SP200avi inline stencil printer at the upcoming Nepcon trade show in Birmingham, U.K.
Designed for medium- and high-throughput, high-mix applications, the 23" inline stencil printer uses a patented “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure precision alignment using fiducial marks or PCB/stencil features. The vision system facilitates a “paste on stencil” inspection feature that helps determine if there is adequate paste on the stencil before running the print cycle.
Selective Auto-Paste Dispense technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits it accordingly. This reportedly guarantees consistent solder paste deposition onto PCBs.
The user interface runs under a menu-driven Windows XP application. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation.
Data stored on the machine may be accessed remotely via a PC modem connection, allowing for “on the fly” troubleshooting. Automatic rail width adjust is standard to help with quick changeovers in a high-mix manufacturing environment. Stencil loading is automatic; it does not require adaptors for varying sizes of stencil frames.
Speedprint Technology, speedprint-tech.com
Nepcon Birmingham Stand No. C10
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