Features an Easy Test Case generation with GUI and does not require programming. It integrates easily through COM interface. It also supports a range of Firewire (IEEE-1394) and USB 2.0 cameras. Run-time version with calibration features is also available.
 
Features include unlimited maximum resolution, support for up to 254 cameras, test cases controllable with separate customer-specific applications and image processing in a computer with no extra hardware. No third-party low-level image processing libraries are needed.
 
Has tools for display location and alignment as well as for pixel defect and contrast identification. It performs the measurements for pattern matching, colour and greyscale illumination and keypad backlight. Inspects the icon presence and measures the keypad distance and size. The calibration tool uses pixel grid or checkerboard pattern method. Focus analysis tool extends usage to camera module testing.
 

Europlacer will display the Xpress 25 flexible, high-volume SMT placement system in booth 1F01 at the upcoming Nepcon China/EMT China  trade show and exhibition.
 
Claims to bring new vision to modular placement ¾ combining high-speed and fine-pitch capabilities in a compact footprint. Twin heads can place an array of devices from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec. (25,000 cph). Equipped with “smart nozzles” and on-the-fly vision.
 
Benefits include intelligent feeder technology, “smart” nozzles and more.
 
Has feeder capacity of 92 x 8 mm and an accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (with an 0.3 mm optional) and a tape size range of 8 to 88 mm.
 
Available options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
 
Europlacer, europlacer.com

At SMT/Hybrid/Packaging on May 30-June 1, in Nuremberg, Germany, GÖPEL will exhibit products for AOI and JTAG/Boundary Scan.  Visitors can see the OptiCon AOI platform, the JTAG/Boundary Scan hardware architecture Scanflex and the latest version of the Integrated Boundary Scan Development Environment  System Cascon in stand 339, hall 4.
 
The OptiCon system’s core element is a modularly extendable camera. This camera allows the alternative selection between a one- and four- MegaPixel camera module. For even higher test coverage, the user can install additional camera options for THT components, color inspection or 3-D measurement as well as angled view inspection. The platform is said to offer high test speed, reduced debug times, minimal false call rate and high fault coverage.
 

SPRINTavi automatic in-line printer accepts the standard 29" (737 mm) stencil frame. Using Speedprint's "look down, look down" vision alignment technology, the printer facilitates "pase on stencil" inspection. The camera ensures 6 sigma repeatability.

Options include 2-D paste inspection, programmable paste dispenser, SPC data collection and tooling options such as a laser-guided tooling system and the Vacunest tooling package.

Designed for flexibility, easy changeover and long-term reliability. 

A-Tek, atekllc.com

Magnet Wire Stripping Pot strips film insulations from wires of all sizes and configurations. The wires are dipped into the stripping solution to quickly remove the insulation. This stripping method will not cause mechanical stress or abrasion to the conductor. Units are available in two models: DSP1 has basic temperature control and DSP2 has a programmable temperature control for selecting and maintaining an exact temperature. Both are available in 115V 60Hz or 220/240V 50/60Hz. Custom sizes can be quoted.

The Eraser Co. Inc., eraser.com

Finetech will highlight the Fineplacer Pico system in booth E1A02 during Nepcon China/EMT China on April 4-7.
 
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
 
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
 
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
 
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
 
Features "WinCOMISS" software that controls bond force during placement and soldering.
 
 
Finetech, finetechusa.com

DEK will attend the Nepcon UK show, held May 9-11 at the National Exhibition Centre, Birmingham. Sop by stand C30 to find information and exhibits of the HawkEye print verification system operating on a Europa high-accuracy SMT printer equipped with Instinctiv; VectorGuard stencil technologies; and consumables.
 
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap. 
 
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
 
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
 
DEK, dek.com

Stackable PCB Transport and Storage Racks are made of conductive material for safe, convenient handling of printed circuit cards during assembly. Can hold up to 50 PCBs from 2” to 9.8” (5 to 25 cm) wide. Are made of conductive plastic temperature rated to 176^OF, Surface resistance <10 ⁶.


The width of the rack can be quickly adjusted for different PCB sizes by unlocking the stop latches on the top panel, pushing the side plate to the correct position and resetting the position holders. A chain and sprocket mechanism assures that the sides of the panel will be held parallel during adjustment. Adjusting the rack for new PCB size takes less than 20 sec.
 

Zuken and PCB Libraries Inc. have launched a CADSTAR-compatible land pattern generator, IPC-7351A LP Wizard. The tool reportedly reduces the time it takes to build library parts and ensures compatibility with the latest IPC standard for surface-mount design.

The tool consists of land pattern viewers, calculators and generators
for the creation of CAD land patterns in SMT parts libraries. The time to build a standard SMT library part (previously on average 30 min.) has been reduced. The generated library parts comply with the latest land pattern and surface-mount design requirements as defined by the IPC. Using data based on the IPC-7351 Land Pattern Standard, users can generate accurate manufacturing compliant PCBs while cutting costs.

The LP Wizard dovetails with the free library documentation and the Viewer, both provided by the IPC with the needed standard. The data entered by a PCB designer can also be shared with engineers throughout the organization with the Viewer on a project by project basis.

Available for purchase direct from PCB Libraries; all licenses come with one year of maintenance; pcblibraries.com/store/detail.aspx?ID=54

 

Protocase Designer version 113 is now available for download at protocase.com/www/designer.

Upgrades inclulde:
Flat panel: a simple flat panel template compliments standard enclosure templates.
Exclusion zone: eliminates any user concern from placing cutouts or components in inappropriate areas.
Flanges: appropriate flanges result in realistic template models
Information bar:  more information regarding origins, exclusion zones, library component nomenclature, etc.
Coordinate origin:  more detail regarding face editor origins.
Open/Save functions:  cleaned up issues related to opening and saving files.

A new tutorial emphasizes proper enclosure design for mounting your PCBs; it can be found at protocase.com/www/designer/tutorial/.

LeadCheck swabs (2515-N) are a fast method of testing components and solder joints for lead solder. Incoming components and boards, in addition to existing inventories, can be checked for RoHS compliance. This avoids mixed lead and Pb-free inventories, lead contamination in RoHS compliant work areas and potential penalties for shipping noncompliant products. Swab kits are packaged in eight-packs so every station can be equipped to prevent lead contamination from incoming and in-stock boards and components.


All Techspray branded products are RoHS compliant.