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Fineplacer CRS 10 compact rework system is designed for customers needing a fixed configuration. Said to have quick set up and easy operation. Most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large SMD boards. Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip-chip rework as well as customized applications.
 
Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating.
 
High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics.
 
Finetech, finetechusa.com
Nepcon East booth 2001

A-Tek has added the Drytech range of controlled humidity storage systems for electronics packages and sensitive devices.  Drytech manufactures systems for all components and sensitive devices storage demands. A large range of standard products are available, customization is available. Meet IPC/JEDEC Standard J-STD-033A. Sizes vary from 100 to 1700 L in capacity. 
 
During packing, shipping and storage, parts are often exposed to many fluctuations in temperature and humidity; an ideal environment for the hygroscopic nature of plastic encapsulants to take effect, and moisture to be absorbed into the device. Moisture will directly impact product quality, final product reliability, customer satisfaction and manufacturing costs. The smallest amount of moisture, when subject to elevated temperatures, creates vapor pressure that can induce stress cracks and fractures in devices. These may show as failures in test or in a worse case, as field failures. Storing sensitive devices in an environment of less than 5% relative humidity will protect the parts and assist in stabilizing the devices prior to manufacture.
 
A-Tek, atekllc.com
SEFAR PCF is a pre-coated mesh engineered for the stencil parameters and frame sizes of the CD/DVD market segment. Said to provide consistent coating tolerances, stencil durability, wide exposure window and optimal emulsion thickness (EOM) to surface roughness (Rz) combination.
 
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
 
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.
 
Sefar Printing Solutions, sefar.us
Aqueous Technologies will exhibit StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal at the upcoming Nepcon East exhibition and conference on May 10-11 in Boston.
 
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils. 
 
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
 
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
 
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
 
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
 
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.
 
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
 
IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.

 
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC. 
 
Available with optional SQL database connectivity.  Typical applications include tracking of process data by part number. 
 
JPSA, www.jpsalaser.com
 
The high-performance RC7M robot controller has a program processing speed five times faster than the previous RC5 model. Features user-friendly operation, light weight and compact size. Weighs under 50 lbs. and measures 440 x 425. x 157.5 mm.
 
Features an expanded range of communications interfaces, including 100 Base-T Ethernet, USB, RS-232C and Mini Parallel I/O. DeviceNet, Profibus and Parallel I/O ports are optional. The 3.25 MB memory (expandable to 5.5 MB) can hold up to 10,000 programming steps and 30,000 teach points. Fully compliant with the latest ISO, ANSI and CE safety standards.
 
Options include a new, improved teaching pendant with a large 7.5 in. color touchscreen and a lower-cost, high-functionality minipendant with a 128 x 64 pixel LCD display, as well as  WINCAPS II 3-D simulation software, which allows offline programming and remote, real-time monitoring of robot operation.
 
DENSO Corp., densorobotics.com
Juki Automation Systems will highlight the FX-1R High-speed Chip Shooter at the upcoming Nepcon East show in Boston.
 
Focusing on high throughput and precise component centering, it is equipped with a double head system driven by two independent linear motors that create high speed and positional accuracy. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser developed for Juki’s assembly systems. This technology simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time.
 
Has a placement rate of 27,000 cph  (IPC 9850), and a component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Has a placement accuracy of  ±40µm (3 Sigma).
 
Juki Automation Systems, jas-smt.com
Nepcon East Booth 4009
The Ultra TT Automation Series is an easily implemented dispensing robot system that reportedly improves productivity when making repetitive deposits of adhesives, epoxies, sealants, solder pastes and other assembly fluids.
 
The robot combines precision dispensing technology, closed-loop servo controls and powerful drive motors to make uniform dots, fill cavities or small containers with consistent volumes, and trace even lines over complicated part geometries—all with positioning accuracy of +/- 25 microns.
 
Integrates both the fluid dispensing hardware and software with a precision XYZ positioning platform. This approach saves workspace by eliminating the need for a separate computer or external dispenser controller.
 
Available with either 325 x 325 mm or 525 x 525 mm work envelopes. Both configurations can store 100 programs containing up to10 different dot and line styles, and are fully compatible with EFD’s precision dispense valves, syringe barrels and dispense tips.
 
EFD Inc., efd-inc.com

Aegis Europe will exhibit Mechanical CAD Module (MCAD) for CircuitCAM at Nepcon NEC, Birmingham at stand #H70. This system enhancement answers the increasing demand for an end-to-end NPI through MES solution supporting electronics assembly, system integration and box build. MCAD supports box and mechanical product documentation, tracking, quality and materials management as well as circuit card product launch and manufacturing execution. Customers may now support any discrete assembly processes—from circuit boards to full system level assembly—in a single information system.

 
MCAD functionality is inherently incorporated within Aegis’ Web-centric manufacturing execution system. Shop-floor operators can step through and drill into iView's existing sequential assembly process feature with intelligent cross-reference to the mechanical components. Supports multi-level assemblies and material setup validation at any work station; these assemblies are now better depicted in the visual aids.
 
Features and benefits include:
 
Support for common mechanical CAD vector file formats.
Simple digitizing allows 2-D capture from a 3-D drawing with the desired user-controlled    perspective.
A mechanical Shape Library permits re-use of commonly used items and components.
A color-coded parts list display provides easy cross-referencing to the drawing in the same manner used for circuit board visual aids.
 
Aegis Industrial Software Corp., aiscorp.com
HawkEye will be displayed on DEK’s flexible Horizon 01i screen printing platform. This system delivers high-speed performance for any manufacturing requirement – from high-mix to high-volume advanced assemblies, including 0201 and CSP packages. Equipped with the Instinctiv user interface for user-friendly operator control, the ISCAN control area network to support advanced features and an optimized frame for mechanical and thermal stability, the Horizon 01i delivers a 10 sec. cycle time, process capability of 2.0 Cpk @ ± 25µm and a low cost of ownership.
 
When HawkEye print verification is combined with the Hoizon 01i, the system becomes even more versatile. Isolates errors through good/bad verification set against user-defined, pre-set thresholds. Streamed images, instead of successive still images, are analyzed and any defective boards are identified and removed in real-time. Has 100% post-print verification at line beat rate with no programming required.
 
DEK, www.dek.com
Booth 2045
The iFlux is a magnetically controlled, air-driven spray fluxer. Its clean design makes it easy to use and maintain. Can handle most fluxes, including the new fluxes optimized for lead-free soldering.
 
Triple layer design features an air-driven, high precision Titanium nozzle with adjustable cone. The motion of the nozzle spray angle and the volume of flux are computer controlled with a password-protected touchpad. The nozzle is 30 mm from the board surface.
 
The air driven nozzle reportedly sprays a uniform, well defined flux deposit with excellent wicking. Has the velocity and volume control necessary to penetrate through-hole assemblies. Operates within tight parameters, leaving little overspray. Stores all the parameters for each job in its computerized control box so the operator can easily call up the correct settings for each production run
 
Can fit internally into most soldering machines with the control box either incorporated into the
existing machine or mounted externally. Or the entire spray fluxer and control box can be external.
 
Technical Devices Co., TechnicalDev.com

Fluid Dispenser Pen increases precision in fluid dispensing and eliminates the mess associated with dispensing bottles. The chisel point, spring-loaded tip allows users to determine the amount of liquid to be dispensed, thus reducing waste and chemical exposure.
 
While primarily used for flux dispensing, can also be used to dispense solvents, lubricants, masking, RMA chemistries, adhesives and water-based liquids. Prevents evaporation of material and conforms to current regulations for controlling substances capable of evaporation hazard. A dispensing valve prevents flooding and spattering, and releases liquid in controlled amounts to the nib.
 
The two parts (cap and reservoir) are easily assembled. The reservoir should be filled with material to within 19 mm (0.75”) of the top; this air chamber allows for the valve cap to be pressed securely in position. Priming is achieved by depressing the nib while the pen is vertical.
 
Can be used for rework and touch up soldering, as well asdistribution of solvents, lubricants, masking, RMA chemistries, adhesives and water-based liquids.
 
Fluid Dispenser with Brush Tip consists of a polypropylene cartridge with a fine nylon brush tip, and has a capacity of 7 cc. The fine brush tip allows users to reach small areas with increased accuracy.  The transparent cartridge allows the user to view the level of remaining material, and as applying light pressure to either side of the barrel dispenses the fluid, the user has complete control over the amount of fluid being dispensed. 

QTEK, qtek.com

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