The 15^th  version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
 

• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
 
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
 
WISE Software Solutions, wssi.com

Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
 

 
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
 
Universal Instruments, uic.com
Semicon West Booth 7039

Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection. 
 
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
 
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
 
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208.  The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.  
 
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers. 
 
Practical Components Inc., practicalcomponents.com

Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
 
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F.  Can be used in service temperatures from -65° to 200° F.
 
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from  -65° to 200° F.
 
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from  -65° to 200° F.
 
Devcon, devcon.com

 
Imbera is a joint venture of Aspocomp Group Oyj and Elcoteq Network Corp. that is developing a production process that integrates active components inside the PCB structure. PCB manufacturing, component packaging, and assembly are incorporated into a single manufacturing process. All interconnections between the IC and substrate are processed simultaneously.
 
The thermal properties of the new technology were challenging to define because the technology is so new and is developing very rapidly. Tight schedules limited the number of prototyping runs that could be executed. Flotherm software from Flomerics is suited to this type of complicated electronics cooling problem because it is designed for electronic cooling applications. It provides a number of thermal model libraries for existing components and tools that allow users to assemble models from libraries.
 
Imbera engineers used Flotherm to model two types of IMB structures, BGA modules and ICs embedded in motherboards, in a standard still air environment. Simulations provided fundamental information about the behavior of the structure. The simulation results made it possible for Imbera engineers to optimize the various methods afforded by IMB technology to keep the product operating temperature within specifications.
 
The simulation models were validated by performing measurements with MicReD’s “T3Ster” thermal tester. It can test up to eight components at one time and analyze the results as the test is being performed.
 

Auto-Shield Metal-In ESD Bags on a roll, primarily for use on automatic bagging machines, help increase packaging efficiency.  Bags are printed with ESD warning symbol, manufacturer name and date/lot code for traceability.  Meet MIL-PRF-81705D Type III and are testable to S20.20, S11.11 and S11.31. Are RoHS compliant. Bag film thickness is 3.1mil. Stock item 49400 is a bag size of 2.5 x 5” with 1,250 bags on the roll.
 
Custom sizes and custom printing are available.
 
Protektive Pak, protektivepak.com

Kester announces that it will highlight its Pb-free products in Hall 8, Stand 315 at the upcoming SMT/Hybrid/Packaging  exhibition.
 
Kester will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006, RoHS Directive deadline. Among them are: EnviroMark 907 and 918 Pb-free no-clean pastes, Ultrapure K100 lead-free bar solder alloy, 979 and 979VT VOC-free organic no-clean flux formulations, 959T no-clean flux, 275 no-clean wire and TSF-6592 tacky soldering fluxes, along with Kester’s technical services.
 
 
Kester, kester.com
SMT Nurnberg Hall 8, Stand 315

MicroClimate is a 3 ft³ reach-in chamber designed to simulate a full range of temperature and/or humidity conditions. The environmental chamber provides a compact chamber for testing small components and products for a variety of industries. Each chamber simulates a range of temperature and humidity conditions from -73° to 190°C and from 10% to 95% RH.


Features include:
Programmable Controller;
RS-232 Computer Interface ;
2" Access Port ;
Demineralizer filter purifies water and electronic humidity sensor provides accuracy and reliability with minimal maintenance on humidity models ;
Compact size;
Easy installation with no special electrical connections needed;
Each unit runs on a standard 115V ;
Includes a one year part and labor warranty.

 

HCT-900 Hand Held Convection Tool is a low-cost rework system with the flexibility to handle a range of thermally demanding production and rework applications, including Pb-free. Typical applications for the 300W unit include removal or replacement of QFPs, PLCCs, SOPs and TSOP devices. It can also provide heating and reflow for touch-up work as well as heat shrink and other local heating applications.
 
Closed-loop thermocouple feedback regulates output temperatures, and control temperatures can be set in the range 100º to 500ºC. The user sets the heat and airflow control dials to the required values for the application. Unit maintains the required temperature automatically, even if airflow is adjusted.
 
The low-noise pump (less than 45 db) provides precision airflow control. A power-off, cool-down function retains the airflow as the unit powers down for efficient heater cooling and reduction of thermal stress.
 
A range of nozzles are available for general purpose applications or specific SO and TSOP packages, or PLCC, BQFP and QFP devices. Also accepts many industry standard nozzles.
 
Three versions are available to suit input voltages of 115VAC (HCT-900-11), 230VAC (HCT-900-21) or 100VAC (HCT-900-10).
 

YTV F1-Series AOI system offers high-volume manufacturing environment enhancements that reportedly deliver automated PCB inspection and reduced costs, improved quality and increased throughput. Faster and more intuitive, off-line programming maximizes machine utilization with real-time SPC monitoring that is easily configurable and portable across multiple manufacturing lines.
 
YESPC software provides diagnostic and trending analysis of the manufacturing process. By providing real-time monitoring and reporting of SMT production processes, management can immediately react to critical process events. Fully compatible with every YESTech AOI and YTX-5000 combined x-ray/vision system.
 
Both the system and software were on display this week during Nepcon East.
 
 

Elektrobit will showcase the Test Handler J402-11 with embedded Digitaltest LAMBDA Tester at the upcoming SMT/Hybrid/Packaging exhibition in Nürnberg, Germany.
 
The handler construction is based on the J402-07 handler and it is fully compatible with Digitaltest Lambda and MTS300 testers.
 
Reportedly saves test cycle time, increases test coverage and quality, and uses minimal floor space. Offers high efficiency per cost and a user-friendly, robust construction with excellent usability, ergonomics, and quick and easy fixture changeover. The jointly developed handler features:
 
• Shortened test cycle time
• Increased test coverage and quality
• Minimized footprint
• Press force 3000 N (4500 N)
• Robust construction
• Easy and quick fixture change.



Elektrobit, .elektrobit.com
Digitaltest GmbH, digitaltest.net
SMT/Hybrid/Packaging Booth 414

Series 582 Vertical Flow Hardwall Modular Cleanrooms are prefabricated and easy-to-assemble. Available in a variety of sizes, shapes, materials of construction and classifications. Comply with Class 100,000 to Class 10 operating conditions.
 

 
Modular wall panels fasten together to form a shell and a NEST-TIGHT grid system attaches to the shell to create the internal clean room ceiling. The ceiling grid features interconnecting tee bars that provide strength to support filters, light fixtures and panels to comprise the clean room ceiling. Uses a HEPA-N-SEAL negative pressure safety seal to ensure that no air leaks through the ceiling grid into the clean room.
 
The components are light enough for anyone to lift and assemble using internally mounted rotary clamps and fasteners. Parts are interchangeable and easy to maneuver.
 
Clean Air Products, cleanairproducts.com