Feinfocus Tiger X-Ray inspection system with Automated Defect Recognition (ADR) features a faster, more precise sample manipulator with x-y speeds of 100 mm/s and accuracy to 200 μm, plus greater magnification capability. ADR greatly reduces analysis time on the production floor with fast, accurate recognition of solder voids and other abnormalities.
The 2-D x-ray inspection system offers a view into the third dimension via oblique viewing at virtually any desired angle using Auto Isocentric Motion (AIM) technology. The high-precision detector manipulator rotates 360° and tilts up to 70° to view complex assemblies at oblique angles. Offers an additional two-axis (x and y) manipulation of the sample and a third axis (z) manipulation of the x-ray tube, with normal positional accuracy down to 100 μm. Open tube x-ray technology allows for feature recognition below 1 μm.
Designed to meet the needs of computer, automotive, telecom, military/aerospace, medical device and information storage markets, it offers a geometric magnification of up to 727X (total magnification up to 2800X), True X-Ray Intensity (TXI) control for consistent image quality and a sample tray area of up to 24 x 24” (610 x 610 mm) to accommodate larger boards and multi-up flip chip assemblies.
Christopher Associates and Mason Electronics have introduced the MU-2000S-QD quad density universal grid electrical test system. Developed for high-density testing to the highest standards, it will test substrates up to 12.8 x 16”.
Developed originally for the massive Asian high-density interconnect market, it is based on technology in over 400 installations worldwide. Using the latest robust design standards, including advanced switch card design, it tests at up to 8,000+ points/sec.
Kyzen Corp. will display Aquanox A4520T Aqueous Chemistry for Flush-Mounted and Fine-Pitch Components at the SMT/Hybrid/Packaging exhibition and conference in Nürnberg, Germany.
Designed to clean under low standoffs and in the tight spaces caused by smaller and more heavily populated devices, the eighth-generation chemistry has reportedly proven effective on Pb-free, no-clean and eutectic materials, while providing low cost of ownership.
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, effective without the use of sump side additives and provides brilliant joints. Features a long bath life and is RoHS compliant.
Can clean numerous soils including Pb-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites in addition to precious metals. Is biodegradable and contains no CFCs or HAPs. Is non-flammable and non-corrosive.
Available commercially in one-, five- and 55-gallon containers.
Quick Image QI-2017RL and QI-3017RL Series 2-D vision measuring systems employ a bilateral telecentric lens train capable of focusing on multiple surface levels at the same time. The result is reduced focusing effort, translating into error suppression and increased speed for higher measuring throughput.
With its wide field of view (32 x 24 mm) and great depth of field, the systems can, in one view, completely capture images of workpieces with varying thickness and levels. Can simultaneously image features found on items such as tool edges, connectors, PCBs, cylinder forms and other solids with difficult level transitions. Continual refocusing is unnecessary.
High-precision, mega-pixel CCD color camera captures elevations and contours with accuracy and clarity for viewing, inspection or analysis on a PC or laptop.
XY travel ranges of 200 x 170 mm (QI-2017) and 300 x 170 mm (QI-3017), high maximum workpiece load and high-efficiency optics enable productivity across a range of low- to high-volume inspection applications.
Comes with QIPAK software enabling pattern matching inspection via a CAD user template. With the optional MeasurLink module, measurements can be subjected to multiple statistical analyses.
ARLINGTON, VA – The Electronic Components, Assemblies & Materials Association (ECA) presented awards at CARTS USA 2006, held April 3-6 in FL, for the best technical papers from the 2005 conference. The awards are based on a vote of conference attendees.
Steve Weir, Steve Weir Design & Teraspeed Consulting Group, received the John D. Moynihan Award for best paper. "Considerations for Capacitor Selection in FPGA Designs" explores the advantages of low-inductance capacitors.
The outstanding paper award went to Alan and Lambert Devoe of Presidio Components for "A New Feedback Filter Adhesive Which Produces Robust CTE Performance." The paper provides information on a new conductive epoxy material that eliminates cracks in feed-through capacitor assemblies.
Both papers are available for purchase at ECA's Digital Library: ec-central.org.
CARTS USA is a regional symposium for the passive electronic components industry. CARTS Europe will be held Sept. 25-28 in Bad Homburg, Germany, and CARTS Asia will take place Oct. 9-11 in Taipei, Taiwan.
EDAConnect offers electronic design engineers an intuitive, easy-to-use connection from their EDA environment to their enterprise PLM system.
Provides an out-of-the-box software solution that protects the user from changes in either their EDA environment or enterprise PLM system. Its initial release provides integration for Mentor Graphics DxDesigner, Cadence Allegro and Agile. Additional EDA clients and PLM systems will be released as developed. Provides engineering with integrated library synchronization, design check-in and check-out, BOM extraction and comparison,
template driven design publishing and archiving, as well as an integrated view of the ECO process.
Offered in both site and enterprise licensing models to serve the needs of large and small organizations.
A.C.E. Production Technologies introduces its KPH Series infrared (IR) preheat modules for the KISS102 Series Selective Soldering machine. KPH-10 and KPH-20 are simple to set up and use, and feature thermocouple ports to facilitate thermal profiling. KPH-10 offers a 10 x 24” heating area divided into two 10 x 12” individually-controllable zones of 750-watts each. KPH-20 offers a 20 x 24” heating area divided into four 10 x 12” zones.
Preheating drives out volatiles or moisture from the circuit board, minimizing the potential for delamination; it raises the overall temperature of the assembly and prevents thermal shock to the board, allows for faster processing, and reduces the potential for thermal shock and stress to the PCB.
Can operate in two separate modes: ‘Timer’ (times out at a specific setpoint) or ‘Ramp and hold’ (ramps to setpoint and holds that temperature). Following the preheat cycle, the operator manually advances the circuit board through the preheater into the KISS machine, where fluxing and soldering proceeds on a pre-heated board.
Available in benchtop or stand-alone configuration, product support rails line up with the rails of the solder wave.
LPKF Laser & Electronics has installed an LPKF UV laser processing system at Fine Line Stencil/A-Laser in Beaverton, OR.
LPKF MicroLine 600Dis a next-generation UV laser capable of addressing a variety of tasks, including: cutting of flex circuits, cover layer cutting and skiving. It is also used for the machining of micro mechanical parts made of organic materials, such as polyimide and polyester.
Dual Rail Conveyor J204-53 optimizes manufacturing process equipment utilization, especially pick-and-place machines and high-volume, low- or medium-mix production. Production planning flexibility increases when the same process equipment can be used for both sides in double-sided SMD assembly or when two different products can be produced in single-sided production. Transports and buffers PCBs between process machines, offers multiple-drive technology, eliminates contact between boards during transfer and features a safe, clean design with no visible motors or wiring. Sturdy structure offers reliable operation in demanding production conditions, and easy mechanical connection to other equipment. Features steel frame construction, up to four individually driven conveyor segments on both conveyor rails, automatic indexing and inspection modes, Pb-free process compatible, PLC controller, start/stop/reset/emergency stop/inspection/send switches in membrane terminal, four standard frame lengths: 500, 1000, 1500, 2000 mm, SMEMA electrical interface, ESD-safe design and CE-safety compliant.
Photo Stencil announces the results of Universal SMT Laboratories’ independent, extensive study, conducted in February 2006. The print-process study isolated the stencil alone to determine performance differences among a group of stencils manufactured by other stencil suppliers. Photo Stencil’s AMTX E-FABstencil performed the best out of 12 stencils tested, provided by five different stencil manufacturers. The Xerox-authorized stencil manufacturer usse the AMTX Electroform stencil technology, licensed under U. S. Patents owned by Xerox and acquired by Photo Stencil in 1998. The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer. The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second.
BEST Inc. has developed a simpler process for reworking or hand-placing high lead count connectors. The StencilQuik polyimide stay-in-place stencil helps rework high-density connectors by preventing bridging of neighboring solder joints while allowing technicians to “fit” connector contacts into the stencil.
The process of placing or reworking the connector has been simplified. After preparing the site, the stencil is peeled from its release liner. It is then aligned on the circuit board. Solder paste is then squeegeed into the apertures of the stencil with the remaining material wiped away with a lint-free cloth. The connector is “fitted” into the loaded apertures and then reflowed. Any mask damage ensuing from device removal is repaired by placing the device onto the board.
“Repair depots and rework operations of electronic assemblers are raving about the time that they save and the quality of the rework using StencilQuik™ on hard to rework 50 plus pin connectors. In addition, hardware developers like the fact that to can easily place the more complex connectors on their development board on their own.” said Bob Wettermann of BEST Inc.
Available in both 4 and 8 mil (0.10 to 0.20 mm) thickness. The stay-in-place feature means no compromising in solder paste volume. Each stencil is custom engineered to the application at hand. Deliveries are five business days with 24 to 48 hr. expedites available.
Business Electronics Soldering Technologies (BEST), www.solder.net
ENDICOTT, NY— Endicott Interconnect Technologies has been awarded several new contracts for fabrication of wire bond PBGA substrates resulting from alliances with Silicon Valley-based companies Singulated Technology and CORWIL Technology Corp.
EI will provide wire bond PBGA substrates per Singulated Technology’s design specifications and CORWIL will provide the module assembly. End customers for these semiconductor modules use them in military, commercial and wireless electronics applications.
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”