Hysol QMI536NB non-conductive PTFE-filled paste is for stacked die applications that require extremely low stress and robust mechanical properties. Can be used on all levels of a stacked die, enabling the qualification of a single material. Is said to eliminate provide very low resin bleed and very fast cure. Can be used on solder resist, bare silicon and multiple die passivations. Is lead-free compatible, showing no reliability issues or material deterioration even when processed in higher temperature environments. shows high resistance to delamination and popcorning after multiple exposures to 260°C reflow temperatures.

Henkel, www.electronics.henkel.com 

PRO 2 Tdp is a tabletop assembly cell that may be used for low- to mid-volume manufacturing operations that require an LED component be picked, placed and soldered onto a PCB or substrate. The onboard dispensing head also can place a dot of thermal paste or silicon adhesive between the PCB and LED prior to attach. The robot selectively solders with twin irons attaching each side of the LED simultaneously. Dual automatic solder feeders, pre-heat plate and thermal loop feedback are standard.
 

 
Bench length and height depends on the specific process, but standard floor-to-tabletop height is 30 in. Standard widths are 2-1/2 in. over nominal 3, 4, 5, 6, 8 increments and the interior depth (interior table or working space) is 21.5 in. Overall cabinet width, depth and height will depend on the size of unit chosen.
 
Clean HEPA-filtered air flows outward from the cabinet. This horizontal laminar flow air washes out particulates and prevents contamination from entering the clean work zone. The cabinet features “clean edge” construction that puts the hood and tabletop in shear with the media edge of the HEPA filter to reduce turbulence along the sides of the hood, improve laminar flow and prevent contamination infiltration around the perimeter of the hood. 
 
Top and bottom front grills recirculate the air within the bench. Provides recirculating temperature control to within ± ½ºF.  Can operate at or above ambient using make-up air for cooling, or it can have an air conditioning unit with reheat for temperature control at or below ambient.
 
 Clean Air Products, www.cleanairproducts.com

Model 2200-245-051 Tip-Seal dispense valve is for precision dispensing of low- to high-viscosity flowable materials. It is also used in high-speed stitching or repetitive on-off applications where short segments of material are deposited onto a surface.
 
The zero-cavity design helps dispense solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Sealing at the tip prevents material from hardening in the nozzle, oozing or dripping. The valve opens and closes its material passage at the tip of the nozzle to precisely start and stop material flow.
 
Pneumatically actuated, the valve has a carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals to extend valve life. The stroke adjuster can set the needle opening to change material-flow rates and bead-profile sizes.
 
The valve’s precision dowel and screw holes allow easy and accurate mounting. The 0.125” orifice and short 0.32” tip length (8.1 mm) enables the valve to reach into parts and fixturing. Other orifices and tip lengths are available. Material is delivered to the valve by either a metering assembly or under regulated pressure from supply tanks or pumps.
 

ENVIRON provides web systems for managing WEEE compliance for business products, and the group has launched a new customer relationship module. 
 
Hosted on the company’s Website, the system enables companies to gain feedback from its customers on product satisfaction and after-sales service. Customers wishing to use the WEEE collection and recycling system are required to complete a marketing questionnaire which is emailed to the company.  As part of the questionnaire, customers are required to enter valid model numbers to use the system.
 
The WEEE web system:
Provides a single contract to manage producer registration, in-country recycling, and compliance reporting in all Member States;
Provides straightforward collection arrangements, which the company can communicate to business end-users through their own company website;
Offers a single corporate solution that can be expanded to cover other countries;
Includes the option to pass collection costs on to business end-users;
Provides flexibility and control of future WEEE recycling arrangements, enabling companies to ensure that recyclers continue to provide competitive rates for their services, and change recyclers in individual Member States to take advantage of new recycling technologies and techniques;
Demonstrates to customers that the company is compliant with the WEEE Directive and has addressed its environmental responsibilities.  

ENVIRON, www.b2bweee.com

SEFAR LDS is a laser technology stencil imaging machine for small format screen printing applications. With imaging capabilities between 1700 and 2400 dpi, it reportedly creates precision stencils that adhere to high quality standards, perfectly placed on each screen to ensure consistent color-to-color registration.
 
Available in two configurations: 1330 (max. screen size 15.5 x 17.5 in. – developed for the optical disc market) and 4060 (max. screen size 25.5 x 27.5 in.). Both systems are said to increase productivity (by removing several prepress steps from stencil making through on-press registration) and reduce costs by eliminating time and expenditures associated with conventional film imaging processes.
 
Sefar Printing Solutions, sefar.us.

Christopher Associates announced significant breakthroughs in performance of the NSpec AOI system. With a universal data converter, an enhanced and extensive parts library, and significant performance improvements, programming/debugging time has been reduced by 50% or more depending upon program specifics. Inspection speeds have improved and defect detection capabilities have also been enhanced. The programming speed improvement can be applied to all 3,500 NSpec systems in the field by a simple software update.
 
Using LED lighting and a telecentric lens with a high resolution color camera, the latest model, the DL, can inspect components, solder joints, full color inspection, 2-D solder paste, text, and 01005 components.
 
Christopher Associates Inc., christopherweb.com

Thermo Electron’s NITON Analyzers business unit has released new software with additional features and benefits to assist with RoHS compliance.
 
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
 
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
 
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
 
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
 

 

 

 

 

 

Dage has developed a computerized tomography (CT) option for its XiDAT XD7600NT digital x-ray inspection system.  The CT option further refines performance with volumetric reconstruction of solder joints. 
 
CT is an imaging method employing tomography whereby digital geometric processing is used to generate a 3-D image model of an object from a large series of individual 2-D x-ray images, or slices, taken about a single axis of rotation.
 
The CT capability is available as an option with new systems and is suited for analytical analysis of interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package. Equipped with this option, the system can quickly and easily convert between 2-D and 3-D modes for different inspection applications, is capable of ultra fast image reconstruction and can reconstructing up to 1,440 image slices.
 
When operating in 3-D mode, the sample is rotated in the x-ray beam and multiple 2-D digital images are captured. These 2-D images are fed in real-time to a dedicated reconstruction server where a 3-D model is available for viewing. 
 
The reconstruction server can generate 3-D volumes of 256³, 512³ and 1,024³ using a Feldkamp cone beam reconstruction algorithm with either full or sub-volume reconstruction, with all calculations being carried out by 16 dedicated processing units running in parallel.
 
The reconstructed 3-D image model can be viewed online or off-line with dedicated image hardware allowing real-time manipulation of 3-D models.  Image display features include:
Image Manipulation – rotate, pan and zoom
Clip Image – to eliminate unwanted detail
Volume Rendering – for creation of solid surfaces and maximum intensity, and to vary the opacity and color of volumes
Slices – multiple cross section at any orientation and the ability to vary the opacity and color of individual slices
Illumination Models – single light source or two light sources with shadow computation for optimal 3D perception
Image Save – saving 2D images in JPG or TIF formats
 
Dage Precision Industries, dageinc.com

SchmartBoard has released two boards that address tiny discrete surface-mount components.

 EZ Discrete #1 supports 0201, 0603, 0805, 1206,1210, 1608, 1812, 2010, 2512, & CAES-A, B, and C. EZ Discrete #2 supports SOT23-3, 5, 6, SC70-5,6, DPAK, D2PAK, SOT223, TO263-7, SOT89, 0805, 1206, & CASE-A, B, C, D and E. Many of these components are very small and require a magnifying glass to see, let alone hand-solder without creating shorts. The boards lock the component in place on the board, and are hand-soldered by touching the board with the soldering iron next to the component.

 
The products revolutionize the process of kitting and reloading SMT lines. The custom-configurable material handling solution allows numerous package types to be stored in a secure, controlled manner, whether that be reels, tubes, feeders or PCBs. The cart and software together increase inventory accuracy. Allows material to be received directly from the dock to stock/kits, eliminating non-value-added labor and the efforts of moving/transacting material into another stockroom after receipt.
 
The software was developed based on years of industry experience to deal with MRP systems that fall short of managing work in process. Uses “1 Package, 1 Location” technology to minimize machine setup/tear down and reload while maintaining accuracy of work in process inventory.
 
The supply chain management software increases visibility, presents actionable data, minimizes inventory liabilities and reduces cost. Helps increase SMT machine utilization accuracy and reduce unplanned material shortages by improving the inventory accuracy.
 
An SMT line can be loaded directly from INOCART on the line, eliminating kitting and staging of jobs prior to running on the SMT lines. Can hold feeders so kits can be presented to the SMT equipment ready to go.