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Agilent Process Control Software is a defect-prevention package and has statistical process control and charting package capabilities. Can be used with the Medalist SJ50 AOI and Medalist SP50 solder paste inspection system for paste, pre- and post-reflow trends and defect analysis. Highlights include user-defined charting and alarming, historical and live-data analysis, production summary reports, and worst-feature analysis. Historical and live images are embedded into the charts.

Agilent, www.agilent.com

Araldite 7047 is a one-component, silver-filled epoxy adhesive said to combine high electrical and thermal conductivity. Is said to be a high purity, 100% solids system for void-free bonding of circuitry and ICs. Features a work life of up to four days at room temperature and reportedly cures in one hour at 165ºC (329ºF). Is compatible with Pb-free processing. Has aluminum/aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temp. Volume resistivity at room temp. is <0.0002 ohm-cm. Has a Tg of 130ºC (266ºF) and CTE of 72 ppm/ºC.

Huntsman Advanced Materials, www.huntsman.com/electronics

The Siplace X- and D-Series platform are said to accurately place components down to 01005 with no interruption in speed. The X4 is said to provide the fastest placement output per sq. ft. at 90,000 cph from a single machine. Comes standard with advanced digital component vision. A D2/D1/D1 line has more than 225 feeder inputs and 28 trays. Component range is from 01005 to 8 x 85 mm.

Siemens, www.usa.siemens.com

The Evo 2200 die bonder’s dispensing and bonding systems work in a single module. Throughput is said to reach 5000 cph and a footprint of 116 x 122 cm. Said to process up to 25 different 300mm wafers in a single pass. Has 14 pickup tools and five ejection tools available. Includes heatable bonding tool and the handling range from 250 microns small up to 50 mm large dies.

Datacon, www.datacon.at

The Medalist SP50 Series 3 solder paste inspection system reportedly provides 100% automated 2-D and 3-D inspection for process characterization and defect prevention. 3-D scanning speed is said to be 38.7 cm2; fiducial inspection and load/unload less than five sec.; gauge repeatable and reproductibility capability less than 10% gage R & R. Reportedly accommodates board sizes 2 x 2" to 20 x 20".

Agilent, www.agilent.com

Goepel’s JTAG/Boundary Scan includes VarioCore. Reportedly allows the reconfiguration of Scanflex I/O modules with special intellectual property to support a range of test capabilities in the same hardware setup.

Goepel, www.goepel.com

The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.

Finetech, www.opto-bonder.com

PowerStrip interconnects are rated for applications up to 28A at 80°C and have up to eight blade style contacts. Forty signal pins are standard and are said to handle up to 3A of current at 80°C. Available for parallel board spacings of 19 mm, and for perpendicular and coplanar board interface applications. These polarized through-hole connectors are for rugged applications; right-angle versions have screw-down features. Are RoHS-complaint and suitable for lead-free processing.

Samtec, www.samtec.com

The Axiom X-1000 series dispenser is intended for manufacturing in Class 100 cleanrooms. Is designed for applications sensitive to contamination by sub-micron-sized particles. Configured to minimize particle generation within the dispense area. All pneumatic valves are said to be exhausted to the base of the machine. Connection to the house vacuum reportedly avoids downstream particle emissions entering the cleanroom. Is said to be configurable for single or dual-valve dispensing.

Asymtek, www.asymtek.com

The Q2 high-speed connector options have been expanded with integrated power pins, RF connectors and retention pins. Come with positive alignment features, edge-mount and right-angle design variations, single-ended and differential signal routing, and optional EMI shielding. In 10 or 11mm mated height and signal pins on 0.635 mm pitch. Available with up to 156 I/Os per connector set in single-ended configuration and up to 64 pairs in a differential pair configuration. Pricing begins at 0.08¢ per line at 5,000 interconnects.

Samtec, www.samtec.com

Software upgrades are being offered for CBT6000, model 8000 automatic wire bonders and the model 3500 component placement work cell. Included are the latest operating software, improved vision systems for pattern recognition and Bond Data Miner, which monitors machine and process trends. Reportedly can track and archive traceability data; automatically adapt its process parameters; capture and analyze process and machine trends; and report its own uptime and statistics to any computer in the world.

Palomar Technologies, www.palomartechnologies.com

SMX Series surface mount DC to 18 GHz packages reportedly have low insertion loss and good return loss and thermal properties. Designed to provide good electrical transition performance for die. Made to provide wideband electrical performance and incorporate copper composite bases for thermal dissipation. Sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms.

StratEdge, www.stratedge.com