‘Advantage X’ enhancement package is said to boost placement rates by 15%. The retrofittable upgrade is suitable for all MIMOT pick-and-place machines; it combines hardware and software advances. Beneficial for high-mix pick-and-place systems, bringing the cph rate to 24,000 for devices from chip components to fine pitch.
 
Features an intelligent nozzle vacuum sensor, automatic polarity checks for feeder setup and other software help tools.
 
Will be a standard feature on all new Advantage Systems.
 
MIMOT, mimot.com

BP Microsystems will highlight the latest addition to its Helix automated device programmer at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
 
Integrated in the handler are two Enhanced 7^th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01

Blakell Europlacer Ltd. will display the new Tornado head at the upcoming NEPCON South China trade show and exhibition.
 
The head features 12 position turret nozzles. Available on the Xpress range. Xpress 15 equipped with a Tornado head becomes Xpress 15T and the Xpress 25 becomes Xpress 25T. The speed of the machines is reportedly increased by 10%.
 
Xpress 25T combines high-speed and fine-pitch capabilities within a compact footprint. Twin heads can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70mm QFP and 100 mm connector optional) at a tact time of 0.128 sec (28,000 cph equivalent). Equipped with “smart nozzles” and on the fly vision.
 
Europlacer, europlacer.com
Nepcon Shenzhen booth 2M05

FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
 
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
 
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71

ESSEMTEC AG will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, at the upcoming NEPCON South China exhibition and conference.
 
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
 
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
 
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
 
Footprint is 80 x 80 cm.
 
 
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50

KIC will showcase its 24/7 Process Monitor at the upcoming Nepcon South China exhibition and conference in Shenzhen.
 
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
 
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
 
KIC, kicthermal.com
Nepcon South China booth 2D58

3-D engineering models for all DEK printer subassemblies can now be downloaded over the Internet, allowing machine owners to examine components in detail without taking a machine offline, and to verify and order new parts or upgrades quickly and easily.
 
The 3-D Find-a-Part service is free to all DEK machine owners, and is accessible 24/7 via the secure technical support account pages at www.dek.com.
 
Models are the actual CAD models used by DEK engineers, and are accurate, fully detailed and up to date. Customers can rotate the models in three axes, measure dimensions, zoom in or zoom out, isolate and inspect individual sub-components, and find part numbers using context sensitive keys. Price and availability, as well as online ordering, are also supported.
 
Because of the large file size for each model, DEK has installed extra, dedicated Internet infrastructure to support the service, so customers can view any model on screen in the time it takes to download the file.
 
“This service is valuable for customers needing to quickly inspect any subassembly or optional unit, such as a print head or underscreen cleaner, and also streamlines ordering of replacement or upgrade parts,” said Jon Howell, Customer Service Group manager. “As well as providing a more powerful troubleshooting solution than hard copy general assembly drawings, customers no longer have to spend time describing a required component to DEK sales or support staff. Examining a component and finding the part number now requires just a few simple mouse clicks.”
 
DEK, www.dek.com
 

Servo-Flo 305 System is a mid-sized shot meter for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The robust positive rod displacement and servo-motor design will dispense abrasive and filled one-component adhesives and sealants such as epoxies, silicones, urethanes and mastics.
 
Delivers a precise flow rate of material to a Snuf-Bak, Tip-Seal or No-Drip dispense valve for accurate start-stop of material flow. Can be floor-, pedestal- or robot-mounted for automation or manual applications. System-design selections include meter-volume size, material-temperature control, operator interface, dispense valve, material supply and system integration.
 
Closed-loop processor ensures precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
 

 
The soldering system combines EFD’s auger valve and Ultra TT tabletop dispensing robot with Leister’s Novolas diode laser. Uses EFD’s SolderPlus solder paste. The solder paste formulations available are fast, clog-free and designed to support the sub-second reflow cycles times common with laser heating.
 
The package system includes SolderPlus paste, the Ultra TT robot, EFD ProcessMate 6500 temperature control system and the diode laser, all housed in a laser-safe certified cabinet. These system components can also be bought individually.
                                                                                                  
EFD and Leister have aimed the marketing of their system at users requiring discreet, precise, rapid heating and controlled non-spatter high-yield solder performance.
 
The package is ideal for processes requiring non-contact point-to-point soldering of temperature-sensitive parts, especially component manufacturers serving the automotive and medical industries. Heat damage to temperature-sensitive plastics is said to be eliminated with the system.
 
www.efdsolder.com or www.leisterlaser.com

SP003 semiautomatic stencil printer is now available as SP003-V with vision for faster control and alignment correction.
 
Features trans-stencil vision, a motorized print head and vertical stencil separation. Can accommodate stencils or screens up to 29 x 29".
 
Said to achieve precise printing by controlling all important print parameters including squeegee pressure, angle of squeegee, print speed, stencil position and stencil separation after printing.
 
Available with different print mounts, giving it numerous applications ¾ vacuum table, groove table, flat table or magnetic table. The magnetic table is used mostly with single- and double-sided boards, and is flexible.
 
Easy to operate and control, for small- and medium-volume production. Print alignment is accomplished by clearance-free, fine-pitch thread screws, and other print parameters can be adjusted on the front panel.
 
Designed for stencil printing, screen printing, print/print, print/flood and flood/print; can print a max. of 400 x 410 mm, features two cameras (both adjustable) and is 700 x 800 x 500 mm (without optional substructure).
 
ESSEMTEC, essemtec.com

NITON XLt 898He is a nondestructive portable analysis tool for light element content in alloy material. Provides fast, laboratory-quality chemical analysis of light element content in aluminum and titanium alloys, as well as nickels, superalloys, stainless steels and more.
 
NITON X-Ray Fluorescence analyzers quickly and reliably provide accurate alloy material verification.
 
System fills the interior of the measurement head with pure helium, purging atmospheric air from the x-ray analysis path, and allowing light element x-rays to contact the high-resolution x-ray detector. As a result, operators can measure light element alloy content with the same analyzer that they use to test high-temp alloys.