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UV15DC80 UV- and heat-curable epoxy is designed for bonding, sealing, coating and potting applications. Is low-viscosity, environmentally-friendly and is easy to apply and requires no mixing. Reportedly cures in shadowed areas by supplemental heat curing at 80°C for 15 to 30 min. Comes in half-pint, pint, quart, gallon, and five-gallon pail containers, and in syringe applicators.

Master Bond, www.masterbond.com

The FlashCORE family of manual and automated programming solutions has been adapted and optimized to program mDOC H3 devices at very high speeds. This enables mass adoption of mDOC H3 in mobile handsets and consumer electronics devices. mDOC H3 is the first multi-source embedded flash drive specifically designed for mobile handset vendors and consumer electronics manufacturers. 
 

DOC H3 products from msystems, Hynix and Toshiba will be available in quantities suitable for mass production later this year.

Data I/O, www.dataio.com.
 
msystems, www.m-systems.com
 

VShare product lifecycle management toolset supports DfM collaboration between PCB design and engineering by means of a centralized, scalable platform that offers secure access to important design information and DfM issues. The tool’s dashboard is said to capture all relevant DfM data in a centralized environment so that all users can work in real-time with the same, graphically-rich data set. Runs using standard Internet browsers within a secure, Web-based environment. Can import DfM results other Valor tools and attach graphical or text objects. Generates reports on critical steps, project status and details, and approvals. The platform starts at $25,000 for a company-wide package.

Valor Computerized Systems, valor.com

The open-source Interconnector design suite enables design and testing of chip-to-chip interconnections supporting signaling rates of up to 25Gbps. The software can be used to assemble a system, select ICs, channels and connectors; test components to analyze performance; and trigger the signal generator to create source and sink data.
 
The first version is offered to solicit user feedback to help shape the production version. Future versions will use S-parameter data from tests of actual materials and structures.
 
SiliconPipe, www.SiliconPipe.com
Circuitmedic’s Flextac Wire Dots, for wire tacking, consist of pre-cut shapes of a thin, flexible polymer film, membrane coated on one side with a high performance sensitive adhesive.

 
Flextac Wire Dots are said to apply instantly to a clean PCB surface with no curing time and no bonding to skin or clothes or difficult cleanup. They reportedly maintain their hold across a wide range of process and operating temperatures, and will hold securely after exposure to numerous chemicals. Will hold securely through a typical PCB hot water wash. Are RoHS/WEEE compliant.

 

CircuitMedic, www.CircuitMedic.com

Ultra PP dispense tips, with flexible polypropylene shafts, reportedly reach into hard-to-access areas and work with scratch-prone substrates.
 
Designed for use with air-powered benchtop dispensers or automated dispense valves, precision engineered PP tips are available in 0.5² or 1.5² lengths, with internal diameters from 0.054² (15 gauge) to 0.010² (25 gauge). Color-coded tip hubs feature SafetyLok threads for secure attachment to handheld syringe barrels or automated dispense valves. The tips come packaged in lint-free, lot-numbered transparent boxes.
 
EFD, www.efd-inc.com/components.html
The FLX500 portable automated programmer is said to be the first such device to provide plug and program automation capabilities. The touch screen user interface is language independent. Can be plugged into a standard wall outlet. The self‑contained air supply eliminates the need for an external air system. The system picks devices from tray media, places them in sockets for programming, then returns them to output trays.

 
The ImageWriter, for in‑system programming, can program final application code or localized content into the device.
 
Data I/O, www.dataio.com
The Medalist SJ50 Series 3 automated optical inspection system improves ease of use, throughput, component location and supportability over the previous generation and can handle 01005 components.

Includes algorithms designed to bring greater image clarity to low-contrast components, for better defect analysis. The image clarity results in lower false-call rates and improved defect detection.

Is ergonomically advanced with significant user and system interfaces. Can be deployed in a 2-D paste, pre-reflow, mixed-mode and post-reflow environment while quickly converting the optics head for inline 3-D solder paste inspection.

Links to downstream repair stations and statistical process control.

Agilent Technologies, www.agilent.com/see/aoi.




Cadstar 9.0 desktop PCB design software features major usability and flexibility enhancements, along with functionality for adopting new technology. Improvements include graphical representations of every function assignment, making the tool both easier to work.

"Trunk" routing functionality, within P.R.Editor XR, can now swap equivalent pins quickly and easily to improve routability. The report generator, post drill files, DXF post processing, general menu and tool bars have been made more user friendly. Back annotation function has been enhanced to make file transfer from PCB design into the schematic smoother and simpler.

Cadstar SI Verify, which offers a complete post-layout signal integrity simulation toolset with seamless integration into Cadstar, also features many new functions for ease of use and accuracy. This includes upgrades to the via modelling function, to provide more in-depth analysis details and user defined n-port circuit models to take into account components such as filters and ferrite beads. Both of these enhancements are also supported by Scenario Editor, a “what-if” simulation scratch pad.

Zuken, zuken.com
The latest addition to the Helix automated device programmer has the same dph and is based on the Helix-TU-10 design. As a desktop automated system, the Helix comes standard with two precision-designed tray input and output handling systems with a reject location.The tray version uses the same core programming technology and socket modules as standard automated lines. The pressure plates are exchangeable between the two units. Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability, which permits programming of up to four devices simultaneously per site.

Handles such packages as MSOP, SOIC, PLCC, SSOP and TSSOP.

A tray-only version will be available at a later date.

BPM Microsystems, www.bpmmicro.com. Read more ...
The GEM Series tabletop AOI comes with new easy-to-use iPro√ software with a new graphical interface said to be easier to use. The software guides users on setting up inspection parameters, resulting in improvd productivity and less training time.

Also, coverage of the Ultra 850G system has been expanded to wire bond and die placement inspection. Flying Color Technology has been added to broaden the defect coverage and lower false rejects.

Machine Vision Products, www.machinevisionproducts.com.

The Quadrus Mini ESD-safe miniature fixed-mount imager is for reading codes on sensitive components without discharging static. Can be safely and easily integrated into ESD-sensitive assembly processes. Has a nickel coating and ESD-resistant labels, and requires no aerosol coating or restrictive mounting distances. Permits close-range reading of static-sensitive parts and components. Features a megapixel sensor and powerful algorithms for reading long bar codes and high density 2-D symbols in any direction on multiple surfaces. Autofocus, EZ button setup, and Good Read green flash provide exceptional ease of use.
RoHS/WEEE compliant.

Microscan, microscan.com

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