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RunnerClick and Express RunnerClick JTAG test execution packages are for checking test devices, boards, and systems compliance with IEEE-STD-1149.1 Reportedly allow non-engineers to run different test procedures on multiple products. Test procedures can be run by product serial numbers, and are compatible with all previous RunnerClick and Express RunnerClick test plans. Include a cross-reference table to specify acceptable serial numbers and point to a specific test plan to open automatically when the software detects a valid serial number.  
 
Corelis, www.corelis.com

The Serial Advanced Technology Attachment (SATA) Connector family reportedly provides more reliable solutions for storage interface than parallel ATA connectors. The components were designed on a 1.27 mm in-line contact pitch and are recognized in two interface segments: signal and power. The 7-position Signal Cable Assemblies come in right angle or straight configurations, in 0.5 and 1 m lengths, and are designed to support the Generation I and II transmission specifications. The 22-position Combo Receptacle is designed for backplane interfaces and comes in SMT, vertical and extended height, through-hole, and vertical for backplanes. The 22-position Combo Plug is used on the device side and uses gullwing surface mount tails. It includes the L-shaped polarization and guide rails to ensure consistent and accurate blind mating. The assembly uses 18 AWG wire to distribute power along with two common grounds per 15-position power segment. 

3M, www.3M.com
 
 Q2’s second-generation high-speed connectors (QMS/QFS Series) features have been expanded with a standard Retention Pin option (RT1).

Features include: from 52 to 156 I/Os on 0.025" pitch and a mated board spacing of 10 mm. Other optional features include shields, power pins, and MMCX-scale RF connectors integrated into the connector set. Data Rate cables are available with a choice of pitches and 50W micro coax cable or 100W twinax EyeSpeed cable.

Samtec, www.samtec.com
The PDA version of the Remote Process Monitor permits viewing of real-time thermal process data on reflow ovens on any authorized PDA anywhere in the world. Shows pertinent data for all ovens in the factory on any authorized computer on the LAN.
 
KIC, www.kicthermal.com
The Gold 8 mm dual-lane feeders, for Universal placement equipment, are 0201-capable. Have continuous splice capability, said to improves line yield rates and boost throughput up to 30%. A PSV reel detection sensor enhances traceability for line control.

Single lane Black 8 mm and 12 mm electric tape feeders are for medium to low-volume midrange applications. Offer an alternative to traditional pneumatic feeders, and guarantee repeatable part presentation with the precision drive train and ensuring traceability with a unique feeder ID.

Universal Instruments, www.uic.com

FLO/EMC simulation software reportedly compresses the design cycle by reducing the number of hardware trials required and also makes it possible to evaluate more design alternatives without additional board spins and related costs.

Flomerics, www.flomerics.com


Cobrush flux applicator is a precise, inexpensive tool for applying liquid flux to tiny chip components and individual solder joints. Is disposable, and compatible with many different types of fluxes. Its fine bristle tip applies flux to very small areas in densely populated assemblies. A transparent cartridge shows the amount of remaining material in the reservoir; its small, compact size and large capacity make it ideal for most rework and post-assembly applications. Is constructed of rugged polypropylene, is ergonomic, and can easily be labeled.


Cobar Solder Products, www.cobar.com

Horizon 02i screen printer adds a position-adjustable 15" touchscreen LCD to enhance ease of use and operational speed. Is said to achieve 1.6 Cpk at ±25 µm full paste-on-pad process capability in 12 sec. cycle time. Has up to 508 x 508 mm board size range, and is fitted with ESD-safe transport rails.
 
Supports the TimeToGo upgrade, for optimizing replenishment intervals for paste, paper and USC solvent, and to predict and plan machine stoppages. Is part of the Instinctiv printer family.
 
DEK, www.dek.com

PCNAlert, for component event management, permits customers to receive manufacturers’ part change notices in a timely fashion. The tool ranks manufacturers based on their notification process. With this ranking, design engineers and procurement groups can assess the risk of using parts from a particular manufacturer. It also checks manufacturers’ Websites daily looking for posted notices about part changes. Includes AVLalert, which monitors approved vendor lists and approved manufacturer lists for product change notifications (PCNs) and end-of-life notices; and BOMverifier, an automatic on-demand BoM and parts list scrubber.

EMA Design Automation, www.PCNAlert.com.


The PalletPal Rotator can be used to rotate fully loaded pallets, replace broken pallets, and switch to or from in-house/shipping pallets, transfer loads to slip sheets, and replace damaged goods at the bottom of a load without the need for manual restacking.

Handles loads up to 48 x 48 x 60" with capacities up to 4400 lbs. Loads rotate a full 180° on a massive anti-friction turret bearing and can be stopped at any point during rotation.

Southworth Products, www.Southworthproducts.com  

UV15DC80 UV- and heat-curable epoxy is designed for bonding, sealing, coating and potting applications. Is low-viscosity, environmentally-friendly and is easy to apply and requires no mixing. Reportedly cures in shadowed areas by supplemental heat curing at 80°C for 15 to 30 min. Comes in half-pint, pint, quart, gallon, and five-gallon pail containers, and in syringe applicators.

Master Bond, www.masterbond.com

The FlashCORE family of manual and automated programming solutions has been adapted and optimized to program mDOC H3 devices at very high speeds. This enables mass adoption of mDOC H3 in mobile handsets and consumer electronics devices. mDOC H3 is the first multi-source embedded flash drive specifically designed for mobile handset vendors and consumer electronics manufacturers. 
 

DOC H3 products from msystems, Hynix and Toshiba will be available in quantities suitable for mass production later this year.

Data I/O, www.dataio.com.
 
msystems, www.m-systems.com
 

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