Hysol QMI536NB is a new die attach material for stacked die applications that require extremely low stress and robust mechanical properties. The material is qualified for Pb-free environments and provides an alternative to film die attach. Enables users to qualify a single material for stacked die packages. (Traditionally, different die attach materials are used for the various layers of a stacked package to avoid damage to the die passivation of the first die.)  With its protective and low-bleed formulation, the novel material can be used for both mother and daughter die.
 
Accelerated Cooling (AC) process for flip-chip manufacturing is used in conjunction with Henkel’s non-conductive paste (NCP) underfill encapsulants, Hysol FP5000 and Hysol FP5001. It enables rapid cooling of the device prior to any excessive heat exposure; is said to reduce warpage and voids while improving cycle time by nearly 50% over that of previous thermal compression processes. 
 
Hysol QMI529LS and Hysol GR828A material set is a die attach and mold compound combination designed specifically for thin and ultra-thin surface mount device applications. Both are optimized for Pb-free environments and provide the thin, yet reliable, materials characteristics required for low-profile consumer electronics.
 
Henkel Corp., electronics.henkel.com

Merit Sensor has received its first Alphasem EasyLine 8088 “Sensor Bonder.” The machine will play a role in the ramp-up of its new production site in Utah. The sensors to be produced at this site are mainly for medical applications (such as blood pressure sensors.)
 
According to a press release, the process control and high throughput of the machine were decisive selling points, as were the handling of ceramic substrates and the die technology. The machine enables Merit to boost pressure sensor output.
 
The equipment is based on the EasyLine platform and features high-speed air bearing pick-and -place, closed-loop linear motor pick tool for bond line thickness control and fully automatic wafer handling system. To meet demands in the field of MEMS and sensors, an active Theta control of the bond head has been implemented.
 
Merit Sensor Systems, www.merit-sensor.com

Ultrasonic Systems will demonstrate the Prism System coating microBGA and flip chip substrates at Semicon West. The system uses ultrasonic technology with a 60 khz titanium spray head and digitally controlled liquid delivery system.  The flux coating thickness ranges from sub-micron to 3 microns.
 
Includes a XYZ gantry with ball screw drives and closed loop servo controls.  Windows XP software allows for easy programming and operator interface to the machine.  Available as batch mode or conveyorized configuration.
 
Ultrasonic Systems, ultraspray.com
Semicon West Booth 8007

Ultrasonic Coating Module is a modular system design for integration into robotic work cells or semiconductor integrated processing systems.
 
Features the CAT 35 ILDS (Integrated Liquid Delivery System) coating head, micro-valve control and PLC controller for integration into work cell software.  This coating head reportedly provides a superior alternative to conventional spin coating, dispensing and other coating technologies.
 
Ultrasonic Systems, ultraspray.com
Booth 8007

EAC-7000 hand assembly series is available in two or three operator sections, and may have the rails set at zero or 15° (to customer preference).
 
The hand assembly lines provide a clean, ergonomic means to hand-place odd-form and other components prior to reflow or wave. Equipped with overhead lighting, adjust rear part shelves, low-profile front work area (maximizing leg room), ESD ground ports, and hand or foot pedal release for operators. Allow for progressive assembly through intelligent routing sequencing.
 
Features PLC, steel roller chain with pneumatic stops, intelligent sensing and rear shelf storage system. Capable of holding a variety of part bins or other carriers.
 
Optional add-ons include LCD holders, front work surface, ESD part bins, and tilt and feed stations (for 15° configurations).
 
Promation, pro-mation-inc.com 
 

SHANGHAI -- The SEMI and AeA trade groups have formed a working group for trade compliance workers in the Shanghai area.

The group will hold periodic roundtables and networking seminars on customs and export compliance topics will be designed to provide a continuous learning forum for local Shanghai trade professionals to expand their knowledge of international trade.

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LAGUNA, PHILIPPINES -- Integrated Microelectronics Inc. and Pulax Corp. have signed a deal under which IMI will provide high-volume electronic manufacturing services and Pulax will handle prototyping for electronics products, subassemblies and components for Japanese OEMs.

IMI president and chief executive Arthur R. Tan said Japan-based Pulax would handle prototyping, pilot run, engineering services, and other startup operations for IMI’s new business with Japanese OEMs. IMI in turn would provide large-scale manufacturing in its Southeast Asia plants.

Japanese OEMs contribute the bulk -- more than 60% -- of the revenues generated by the IMI group of companies.

Said Tan: “Pulax’ advanced design and mounting technologies for printed circuit boards and fast prototyping turnaround time complement IMI’s comprehensive and cost-effective manufacturing capabilities. Hence, Japanese customers will benefit from lower costs of production as well as faster time-to-market."

IMI has EMS plants in China, the Philippines, Singapore, and the U.S.

Pulax, which is headquartered in Tokyo, has been in business for more than 32 years.

ELM-700A engraves barcodes, product model numbers, logos, company names and serial number data on PCBs. Fully operated by PC control, features an extruded aluminum frame with painted vanity panels and a transparent cover.

Standard features: ability to handle PCBs from 50 x 50 mm to 430 x 350 mm, ability to handle PCBs with thicknesses ranging from 0.5 to 2.0 mm, auto-width adjust, three-color light tower lamp with audible alarm, conforms to SMEMA Spec.1.2, mechanical front stopper and side clamper, and more.

Can mark barcodes (1- and 2-D), text (alphabet, numeric, alpha-numeric), graphic data (.jpg, .bmp, .jpeg) and CAD data (dfx file). It can process both PCB and plastic materials, has a maximum adjustable conveyor speed of 200 mm/sec. and can both auto-center a marking point and auto-mark height adjustment.

With a maximum working area of 430 x 350 mm and a one-point marking area of 70 x 70 mm, the system has a 15" LCD monitor, inner fume exhauster, CO₂ laser and complies with Class 4 IEC standard laser safety. Offers repeatability of ±0.01 mm XY table movement.

Options include a barcode reader, a 15" LCD touch-screen monitor and a host connection.
Eunil H.A. Americas, www.eunil.com

A-Tek, a distribution company based out of Fort Collins, CO, will introduce Asscon Vapor Phase Technology to the North American market.
 
Vapor phase soldering allows high levels of thermal control and low delta Ts across complex circuits. The use of an inert liquid with a boiling point at or slightly above the desired soldering temperature creates a vapor blanket that, through the process of condensation onto the circuit, heats the circuit homogeneously without elevated ramp rates or differentials between large and small components. The phase change (condensation) at the surface of the solder piece lasts until the assembly has reached the temperature of the vapor. Due to the high vapor density and the liquid film created at the interface of the Vapor blanket and the circuit as a result of condensation, the complete heating takes place in an oxygen-free environment. The transferred quantity of heat is linear to the supplied heating energy making control simple and energy efficiency high.
 
Batch (stand alone) and inline systems are available. Batch machines feature pre-heating, soldering, drying and cooling. The loading of the machine and starting of the soldering process is done manually. May be additionally equipped with an automation system.
 
Inline-condensation-reflow-soldering machines close the gap between the automatic batch units and the convection-inline-machines for large mass production series. Using the temperature gradient control and the automatic solder-temperature identification, designed as classical inline machine with separate conveyors for loading, pre-heating and cooling of the PCBs arranged in the direction of the process, these machines may produce very high levels of productivity. 
 
Have standard SMEMA interfaces, can be integrated into automatic inline production.
 
The main application is the production of complex high-density boards or complicated components, high-mass circuits and very large back planes. Due to the favorable efficiency for the condensation heat-transfer, the machine requires only a very moderate energy supply. Average energy consumption is low even when operating at full capacity.
 
As the respective process vapors create an oxygen-free atmosphere in the soldering-zone, the machine does not require any additional protective gases, e.g. nitrogen. With its integrated circulating cooling system for the necessary cooling water, the machine is independent of an external water supply.
 

ATLANTA - Visiprise Inc. has been awarded ISO9001:2000 certification. The audit was completed by Quality Systems Consultants Ltd and denotes Visiprise’s administration of the design, supply, production and support of computer software systems to meet client’s requirements.
 


“Earning ISO certification is an important step we have taken to ensure the best quality standards at Visiprise,” said Dave Chambliss, COO of Visiprise. “We continually strive to improve our system’s ease-of- use and look to build on this certification in the evolution of our manufacturing offerings. Having ISO certification illustrates our commitment to uncompromised quality and unparalleled customer service and satisfaction.” 
 

To earn certification, a company implements a quality management system that includes all of the company's activities such as customer interaction, hiring and training of staff, vendor management, and service processes and procedures.

EL SEGUNDO, CA -- LCD-TVs will displace CRTs in three years as the leading type of television manufactured worldwide, rising 74% this year alone, a research firm said today.

iSuppli Corp. raised its forecast for LCD-TV panel production in 2006, citing "dramatic reductions in pricing and increased consumer acceptance." iSuppli boosted its 2006 forecast to 46.7 million units, up from its previous prediction of 41.9 million units.

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Series 1414 Wet Process Station satisfies the stringent cleanliness requirements of semiconductor process facilities. Achieves flexibility by mounting components on support rails. This facilitates the use of proven, highly reliable components positioned for easy replacement or repositioning for optimal product flow through the station.
 
Includes modular electrical devices and plumbing systems that provide an orderly maintenance program with minimal service inventory. Available in white stress-relieved polypropylene, natural polypropylene, fire retardant polypropylene, stainless and PVC. Designed for in-wall placement, allowing total laminar clean air flow to the work deck. Maintenance may be performed from the front, rear or both.
 
Has touch-tone microprocessors. A flexible membrane that is resistant to acids and solvents protects the face of the controller. Heated tanks come with liquid level sensors, high-limit overrides, ground fault interrupters and other safety overrides. DI water flow bypass diaphragm valves inhibit bacterial growth.