The PCT-100 Pre-heater Convection Tool is said to enhance process control during Pb-free hand assembly and rework. Uses convection air heating to maximize responsiveness and avoid temperature overshoot. Can be used with or without a board holder to perform hand assembly or rework tasks on surface mount or through-hole assemblies. Can be used with conventional SnPb and Pb-free solders. The unit reportedly ramps quickly to desired temperature, following a controlled slope to eliminate thermal shock to the board and components. The 10cfm fan fitted to the unit enhances heating and cooling. Has been designed for production environments worldwide, meeting international standards for ESD safety and maximum casing temperature.

OK International, www.okinternational.com
 

ONYX25XLT features a radiant IR preheater, 32" x 24", with six independent zones and 15,000 W of heating power. Also features a moveable solder head; four motorized axes and a precision force measurement system; Visual Machines software; site cleaning with automatic tip height adjustments; and Multiple Field of View (MFOV) vision system with motorized zoom, reportedly providing full viewing of smaller components and corner viewing of components up to 70mm.
 
Air-Vac Engineering, www.air-vac-eng.com
 

 

 
Promation, www.Pro-mation-Inc.com
 
 

The APR-5000-XLS Array Package Rework System is said to meet Pb-free process windows. Optimized heating for Pb-free BGA rework permits reflow without incurring excessive lid temperatures, re-melting soldered joints outside the rework area, PCB warping or distorting plastic bodies of connectors such as RJ45s.
 
OK International, www.okinternational.com
 

The Sentinel System is a fully automated medical device testing solution. Controls line voltage to the Device Under Test (DUT) while performing hipot, leakage current and functional tests. Said to scan patient connections for leakage current without powering down the DUT. Integrated with CaptivATE software. Reportedly automatically downloads the test setup; creates test sequences; conducts required measurements, and outputs test results to a print file and/or a database. Also completes Electrical Safety Testing to IEC60601-1 and IEC60601-2-49.
 

The DispenseMateR D583/585 automated dispensing system is WEEE/RoHS compliant. Uses the same dispense control technology as Dynamic Dispensing ControlT (DDC) and Jet on the FlyT. Is designed for batch production dispensing processes, including solder paste, conductive adhesives, surface mount adhesive, gasketing, sealing and silicone/epoxy encapsulation. Said to be ideal for labs, new product development and prototyping. Two models are offered with different dispensing areas: the 583 model has a dispense and vision area of 325 x 325 mm; the D-585, 525 x 525 mm. Other features reportedly include precise and flexible control parameters through closed-loop servo technology and quick release mount for valves. An advanced height sensor automatically checks for warped parts and inconsistencies. Pattern Recognition and CAD import are optional.
 
Asymtek, www.asymtek.com
 
 

The ScanExpress JET test tool combines boundary-scan and functional test. Combines common pin and net-level diagnostics using boundary-scan testing with CPU emulation testing through its JTAG port. Provides functional test capabilities on designs using JTAG-compatible CPUs and even non-JTAG peripheral components. Structural tests for opens and shorts reportedly can be performed via boundary-scan, while at-speed functional testing can be performed using the CPU to run test programs loaded into memory. Uses proprietary techniques to test on-board memory at speed without loading code into memory; can test and diagnose faulty boards and systems even when the embedded CPU is not able to boot and board self-test is not operational. Users can access pre-built functional tests or create functional test scripts from scratch to test nonstandard parts.
 
Corelis, www.corelis.com
 
 
 

The VectraES wave soldering system is Pb-free capable and includes the ServoSpray servo-controlled reciprocating spray fluxer, an air atomized spray head, pressurized tank flux supply system, self-cleaning nozzle, and sprays in one or both directions. Also includes preheat technology: low mass forced convection. This one-piece module reportedly minimizes cross-board and top-to-bottom product temperature differentials. Its UltraFill system is said to be 40% wider than traditional SnPb nozzles, and provides increased contact and dwell time. Runs in air or nitrogen configurations. Reportedly improves hole fill, and reduces dross up to 40%.
 
Speedline Technologies, www.speedlinetech.com
 
 
 

Loctite 3508 is a Cornerbond underfill system designed for CSPs and BGAs in Pb-free environments. Benefits reportedly include higher throughput, reduced manufacturing costs and improved pot life. Is a one-component epoxy cornerfill engineered for process optimization with curing taking place during normal Pb-free solder reflow. Said to permit component self-alignment. Is preapplied to the board at the corners of the CSP pad site using a standard dispensing system. Has six-month shelf life, a pot life greater than 75 hours, and can be stored under standard refrigeration. Other advantages reportedly include improved adhesive strength over previous versions and a reworkable feature that enables defective components to be removed. 
 
Henkel Corporation, www.electronics.henkel.com

PADS2007 is said to offer the ability to implement RF and microwave circuitry using automated functionality and perform design for fabrication (DFF) checking early in the design process. Enhancements include high-speed analysis/verification functionality; controls for matched length nets and differential routing improvements; square and chamfered corners; DXF-in import, and via matrixing enhancements for RF design. Designs with partial vias (blind or buried) are automatically updated with the layer pairs and drill count of the partial vias in the design; alpha-numeric pin improvements simplify creation of large BGA-based parts; ECO enhancements include comparison of design rules between the schematic and layout databases. Fabrication checks, such as acid trap, starved thermals, solder mask slivers are checked in the CAD environment and database. Can turn on/off the visibility of the component pin numbers. Integration of DxDesigner and the HyperLynx LineSim tool.

Mentor Graphics Corporation, www.mentor.com  

The automatic Snuf-Bak dispense valve is said to be ideal for high-volume fluid control and fast shut-off of viscous materials such as polyurethanes, epoxies, silicones, greases and various cohesive and thixotropic adhesives and sealants. The pneumatically actuated valve opens and closes its material passage in the base of the nozzle adapter to start and stop material flow. The needle pulls backward during shutoff to prevent stringing. Material is delivered by either a metering assembly or from supply pumps or tanks. Precise volume reportedly is dispensed by a precision shot-meter, timer control panel or trigger-on time remote signal. Is designed with two 3/8" NPT and two 3/4" NPT inlet ports to adapt to nearly any hose or pipe size. The 1/2" NPT outlet port accepts standard or custom plastic or metal dispense nozzles. Has multiple mounting methods, including dual screw and dowel and slide bracket fixturing.

Sealant Equipment & Engineering Inc., www.SealantEquipment.com