The Weller WD1002 soldering station features an 85W, single-channel power unit with three programmable presets. Features 67 x 29 mm high-contrast LCD display that reportedly shows selected temperature and programmed temperatures for each preset button simultaneously. Programming range is said to be 150° to 850°F. Comes with an 80W pencil with silver heating element. Station includes four-position, adjustable stand with an antistatic finish.
The B3 benchtop automated optical inspection system for assembled PCBs reportedly improves inspection speed by up to three times. Fusion lighting and advanced image processing technology said to provide highest defect coverage of any benchtop system. Said to take less than 30 minutes to create a complete inspection program, including solder joints. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms.
Manual Snuf-Bak Horizontal Dispense Valve is designed for precision shot dispensing of one-component materials horizontally onto an exterior surface or into a product interior. Includes a standard valve in a hanging bracket assembly and a manually operated electric trigger. Volume dispensed is determined by a precision shot-meter, timer control panel or trigger-on time. Reportedly ideal for volume control and fast shutoff of viscous materials such as silicones, polyurethanes, greases and various thixotropic and cohesive adhesives and sealants. The 1/4" NPT outlet port accepts standard or custom plastic or metal dispense nozzle. Hanging bracket permits mounting from an overhead tool balance.
Polaris Jr. is said to allow the integration of single-process functions such as final-assembly dispensing, screwdriving, and pick-and-place. Features a standardized tool interface that comes in cell sizes from 500 mm to 2.5 m and into which more than 20 functional modules can be plugged.
Vectra liquid crystal polymer S135 reportedly has a distortion temperature under load (DTUL) of 335°C (635°F), improved weld-line strength, and a reduced viscosity that allows it to fill walls as thin as 0.2 mm (0.008"). Can be molded at tool temperatures below 93°C (200°F) and has low outgassing levels.
Agilent Process Control Software is a defect-prevention package and has statistical process control and charting package capabilities. Can be used with the Medalist SJ50 AOI and Medalist SP50 solder paste inspection system for paste, pre- and post-reflow trends and defect analysis. Highlights include user-defined charting and alarming, historical and live-data analysis, production summary reports, and worst-feature analysis. Historical and live images are embedded into the charts.
Araldite 7047 is a one-component, silver-filled epoxy adhesive said to combine high electrical and thermal conductivity. Is said to be a high purity, 100% solids system for void-free bonding of circuitry and ICs. Features a work life of up to four days at room temperature and reportedly cures in one hour at 165ºC (329ºF). Is compatible with Pb-free processing. Has aluminum/aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temp. Volume resistivity at room temp. is <0.0002 ohm-cm. Has a Tg of 130ºC (266ºF) and CTE of 72 ppm/ºC.
The Siplace X- and D-Series platform are said to accurately place components down to 01005 with no interruption in speed. The X4 is said to provide the fastest placement output per sq. ft. at 90,000 cph from a single machine. Comes standard with advanced digital component vision. A D2/D1/D1 line has more than 225 feeder inputs and 28 trays. Component range is from 01005 to 8 x 85 mm.
The Evo 2200 die bonder’s dispensing and bonding systems work in a single module. Throughput is said to reach 5000 cph and a footprint of 116 x 122 cm. Said to process up to 25 different 300mm wafers in a single pass. Has 14 pickup tools and five ejection tools available. Includes heatable bonding tool and the handling range from 250 microns small up to 50 mm large dies.
The Medalist SP50 Series 3 solder paste inspection system reportedly provides 100% automated 2-D and 3-D inspection for process characterization and defect prevention. 3-D scanning speed is said to be 38.7 cm2; fiducial inspection and load/unload less than five sec.; gauge repeatable and reproductibility capability less than 10% gage R & R. Reportedly accommodates board sizes 2 x 2" to 20 x 20".
Goepel’s JTAG/Boundary Scan includes VarioCore. Reportedly allows the reconfiguration of Scanflex I/O modules with special intellectual property to support a range of test capabilities in the same hardware setup.
The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.