MicroPILR platform has low-profile, pin-shaped contacts that replace solder balls on semiconductor packages and plated vias in package substrates and PCBs. Benefits reportedly include reduced profile, fine pitch, improved electrical and thermal performance, and enhanced reliability. Pins can be used as internal or external interconnections in a variety of applications, including the interconnection between semiconductor die and package substrates, semiconductor packages and PCBs, the layers within package substrates, and PCBs to PCBs. Can be formed directly onto substrates and are typically nickel/gold plated copper. Range from 25 to 175 microns in height and 40 to 200 microns in pin tip diameter. Is capable of enabling contact pitches to 100 microns in a die-to-package substrate; in package-to-PCB applications, pitches to 0.3 mm or lower; and within package substrates, pitches of 150 microns or lower. Specific device applications include high-density stacked flash, DRAM and SRAM; logic plus memory packaging; and stacked and mobile memory packaging. 
 

The PMT400 rework system is designed for rework of microBGA, BGA, CSP, SMT, MCM and PTH assemblies. Proprietary Windows-based X-PC Advanced Process software provides GUI, featuring intuitive programming and Teach Mode profiling. Is Pb-free capable. Features precision gantry motion and a standard two-zone IR bottom heater. Provides performance in a small 28" sq. footprint. Includes a six-nozzle starter, network data management (XP Pro), real-time thermal control (external TC), automatic retract optics and an automated component pickup nest. Can handle 0.010" minimum component size, and offers a 2" sq. field of view, as well as 2" top- and bottom-side clearance. Provides 1 kW focused convection top heater and 14 x 20" maximum board size with 1.5 kW IR bottom heater.
 
VJ Electronix, www.vjelectronix.com
 

For low-profile IO applications, this surface mount SIP socket strip is assembled parallel to its board surface. Ideal for placement near the board edge for easy access test connections and creating pluggable adapter modules, which can sit perpendicular to the motherboard. The brass alloy receptacle press-fit accepts mated pin diameters between 0.025-0.037" and 0.025" square posts. This socket is rated at 4.5A per pin position. Suitable for reflow soldering operations. Standard configurations are available from 2-10 positions with a 0.005" coplanarity rating. 
 
Mill-Max Mfg. Corp., www.mill-max.com

The Aerial flying probe is based on Viva Integrated Platform core hardware and software. Is said to be for testing prototypes, samples and small-to-medium production runs. Uses four independent mobile test probes, which reportedly enable simultaneous double-sided testing. One Touch Per Net technique characterizes nets and identifies faults on subsequent boards, executing additional tests at the same time. Data collection and statistics functions come standard. Is compatible with Pilot flying probe, Strategy ICT and Valid functional testers. Firefly concentrates power and control of laser technology into automated selective soldering. Thermal control said to be guaranteed by an integrated temperature control system that provides continuous feedback during the soldering process. A CCD camera is included for optical inspection for testing component presence/absence and orientation. 
 
Seica Electronics, www.seica.com 
 

The USB-1149.1/4E is a USB 2.0-based boundary-scan test and in-system programming controller. Offers board testing and in-system programming of CPLDs, FPGAs, and flash memories at full theoretical programming speed. Delivers test vectors at a sustained test clock frequency of 100 MHz. Includes direct I2C and serial peripheral interface-based device programming capabilities. The SPI and I2C interfaces are independent of the JTAG test interface. Features automatic signal delay compensation for long cable runs to the UUT, slew rate control, adjustable input thresholds, software controllable signal pin reassignment, and eight analog channels for measuring target supply voltages or other signals up to +5VDC.
 
Corelis, http://www.corelis.com

Micro-Line digital dispensing valve, for the Prism coating system, is reportedly much more effective than conventional needle dispensing. Consists of a high-speed liquid metering valve and a precision nozzle. Applies conformal coatings in precise lines or dots as small as 1 mm with the liquid flow rate set electronically. Is applied at a distance from 5 to 15 mm above the board for accurate coating on all substrates. 
 
Ultrasonic Systems, www.ultraspray.com

The MT9928 semiconductor test handler offers up to eight parallel test sites, can test 28,000 UPH, and supports changeover between different types of device under test packages in a short time. Can test semiconductor devices in a temperature range of -55° to 175°C with up to ±2°C of temperature control accuracy. During the test, the temperature stability of devices can reach ±0.5°C. Can also sync thermal levels between DUT and the temperature cavity more quickly. For large-size components like SO300 and SO430, MT9928 reportedly provides greater test speed (2x or more) than other test handlers. Supports standard SOT, SO, MLF and TO packages from 1.2 x 2 mm to 15 x 21 mm, to 0.4 mm component pin pitch. 
 
Multitest, www.multitest.com 
 

Servo-Flo 704-HV two-component dispense system is said to be ideal for automated, semiautomated or robotic dispensing applications. A dual servo motor design dispenses various-sized mixed material volumes and electronically adjusts the material ratio without changing meter hardware. Is a high-volume continuous flow dual-gear meter system that proportions, mixes and dispenses infinite volumes of two-part epoxies, polyurethanes, silicones and acrylics. Provides fixed and variable flow-rate dispensing or variable flow-rate profiling. Operator interface control selects a preset dispense program that adjusts material-volume settings and output flow rates for different-size part batches or extruded bead sizes. Accepts low- to high-viscosity materials.
 

The Delta flexible wave-soldering platform (models 5 and 7) is designed to deliver high yields and throughput. Is said to be characterized by tighter process control and flexibility in virtually every aspect of the wave soldering process. The EasyUse operator interface reportedly makes programming, setup, and process changes easier and the entire process more configurable. Is fully Pb-free capable. Includes automatic removal of dross, chipwave nozzle open access, a separate dross compartment, closed-loop fluxing, preheating, and wave height measurement.
 
Vitronics Soltec, www.vitronics-soltec.com

The Flashstream Vector Programming System reportedly offers the fastest flash programming of NAND and NOR flash memory at speeds as low as 2.5% over theoretical programming minimum; uses Vector Engine. Synchronous operations eliminate the dead times when the DUT waits on the programmer. Designed for high-density flash; programs NAND and NOR Flash up to 32 Gb and has upgradeable RAM for future densities. It comes standard with 4191 Mb (32.7 Gb) memory per site that is upgradeable to handle future densities. Communicates with USB 2.0 between the host PC and programmer. Includes bad block replacement scheme for NAND and low-voltage support.
 

EP40 is a flexible, two-component epoxy resin compound. Is especially designed for bonding, sealing and casting engineering plastics and metals. Has been formulated to cure readily at ambient or more quickly at elevated temperatures with a non-critical one-to-one mix ratio by weight or volume. Reportedly includes superior resistance to thermal cycling and mechanical vibration and shock, and excellent electrical insulation properties. Adheres to engineering plastics, such as polycarbonates, acrylics and ABS to steel, aluminum and other metals. Shear and peel strength for bonding polycarbonates are in the order of 1000 psi and 20 pli respectively, while steel and aluminum bonds yielded shear strength values as high as 1800 and 1500 psi. Said to have service temperature range of -100°F to +230°F. 
 

BluePrint for PCBs Version 1.7 creates documentation for PCB fabrication, assembly and inspection. Functionality and enhancements include advanced visibility functionality for components, pins, nets, drills, ref designators, part names and attributes. Reportedly permits finetuning of each PCB view display to better articulate manufacturing instructions. Also includes customer driver defect resolutions and enhancements for dimensioning and drafting commands; complete API documentation release; a direct integration link via ODBC to Omnify Software SQL database; search functionality; PADS 2007 support and PADS stroke font support; replication of headers on split tables for parts lists, variant lists, component lists, etc. Available April 6 as a free download to customers with maintenance contract.