NITON XLt 898He is a nondestructive portable analysis tool for light element content in alloy material. Provides fast, laboratory-quality chemical analysis of light element content in aluminum and titanium alloys, as well as nickels, superalloys, stainless steels and more.
 
NITON X-Ray Fluorescence analyzers quickly and reliably provide accurate alloy material verification.
 
System fills the interior of the measurement head with pure helium, purging atmospheric air from the x-ray analysis path, and allowing light element x-rays to contact the high-resolution x-ray detector. As a result, operators can measure light element alloy content with the same analyzer that they use to test high-temp alloys.
 

EP62-1MED is a two-component epoxy adhesive system featuring chemical and temperature resistance. Designed to withstand repeated cycles of steam, ethylene oxide, radiation and chemical sterilization.
 
Cures at moderately elevated temperatures (150° to 200°F) and offers a long working life at room temperatures. Contains no solvents or volatiles and has a 100 to 10 mix ratio by weight.
 
Said to have bond strength to metals, glass, ceramics, wood and most plastics. Durable and serviceable up to 400°F. Shrinkage upon cure is low (<0.06%). The color of part A is clear and part B is brown. Available in pint, quart, gallon and five-gallon kits. Also available in gun applicators.
 

Series 150 Vertical Flow Modular Plenum Sections consist of full ceiling, HEPA filter plenum sections that provide filtered laminar flow air to clean areas. Designed to deliver filtered air through 100% of the ceiling’s available surface area.
 

 
Units with blowers on top are the Series 152. With legs added, these become the Series 552. The Series 552 is a building suspended filter plenum. The blower and motor are mounted directly on top of the Series152 filter plenum and blow directly into it. The Series 552 can be supplied with or without soft wall curtains and can also be supported with legs.
 
The Series 151 and Series 152 are designed to hang from a building, or they may be installed on a custom frame. The Series 551 and Series 552 are designed to be freestanding.
 

ECV-100 Coolveyor is a cooling fan conveyor used post-reflow; without proper cooling, damage can occur to Flash programming IC and other temperature-sensitive components. Pb-free soldering, in particular, requires a high-temperature process.
 
Can efficiently reduce the temperature of a board (PCB and components) with a well-insulated unit that uses a cooling compressor to maintain the interior temperature of 5° to 10°C with a fan. Equipped with an anti-static transparent viewing window.
 
Benefits include room temperature setting, the capability to accommodate PCBs from 50 x 50 to 250 x 330, air is cooled by the cooling unit, insulated case structure unit with viewing window and conveyor speed control of 1 to 2 m/min. Measures 800 x 1,000 x 1,500 and weighs 310 kg. When setting at 5° to 10°C, the temperature of the board surface drops at 2°C/sec.
 
Eunil H.A. Americas, eunil.com

Adding to its series of recently introduced optimized material sets, Henkel has announced a materials combination designed for stacked CSP (SCSP) devices. Uniting die attach material Hysol QMI536NB with mold compound Hysol GR9820, this material set reportedly delivers JEDEC Level 1/260° reflow performance.
 
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
 
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.  
 
Henkel, www.electronics.henkel.com

CTS Connect air-actuated internal or external connectors for effective sealing on smooth, rough or threaded circular features of a part create a tight, long-lasting seal. New leak test accessory products include:
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
 
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
 
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
 
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540

Eunil H.A. Americas has added the PARMI SPI 3-D paste inspection system to its product line.

The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.

Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.

Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.

440-R SMT Detergent is available in a ready-to-use spray bottle for safe, effective manual cleaning of SMT stencils and related tooling.  The stencil-cleaning chemistry  is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program. 
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly.  Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user.  This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning. 
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027

Speedline Technologies has added a chemical isolation option to its Accel MicroCel S2 centrifugal cleaning system. This platform enhancement improves existing zero-discharge systems and extends the life of mixed-bed deionizing resins.   

The open programming platform and interface are said to make the chemical isolation option simple to set up. The system can be configured as a complete on-board, internal closed-loop recycle system, and as such the option can reduce operating costs. 

The chemical isolation option will help minimize the amount of residual chemistry carried from the process chamber to the rinse vessel. The system can then reprocess the used rinse water through the internal closed-loop recycle system without contaminating the mixed bed deionizing resins, then recharge the rinse water to its previous deionized state.

Speedline Technologies, speedlinetech.com

FEINFOCUS HDCT-FOX  2-D/3-D x-ray inspection system combines high-resolution 2-D X-Ray technology and enhanced 3-D computed tomography techniques with Feinfocus HDX-Ray technology for inspection and analysis of complex electronic devices in the third dimension. For thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects and hybrids.
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.

Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.

Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.

COMET, comet.ch

UV40 UV curable conformal coating is for high-volume automotive and consumer electronics manufacturers who want the rapid cure of UV products, but require the processing ease of their current coatings. Maintains the speed of cure and environment-friendly chemistry required for electronic fabrication.

Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.

Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
 
HumiSeal, humiseal.com

DEK has developed an equipment and tooling package that coats wafers with ultra-thin die attach materials down to 25 microns in thickness with tolerances of +/- 7 microns using a printing process.
 
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
 
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
 
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.