The XiDAT XD7600NT digital x-ray inspection system is now equipped with a standard 2.0 MP imaging system. Provides up to 70° for any position 360° around any point of the entire 18" x 16" inspection area; inspects all interconnections and PCBs containing BGA and CSP devices. The NT250 x-ray tube has 250 nm submicron feature recognition and real-time digital inspection at 2.0 MP viewed on a 24" flat panel LCD display with up to 9,200X magnification. Can be equipped with a CT option providing 3-D modeling and volumetric measurement of solder joints.
CAM350 v. 9.5 for PCB verification and optimization adds a variety of features including AutoImport templates; PADS layout import interface updates; license borrowing, and Vista support. ODB++ Import supports the CAD Netlist as a reference in CAM350. The One-Up and Panel Border To Layers commands convert to graphics. Netlist Extract algorithm updates are said to support faster performance for large files. DXF Export Interface updated to support intuitive selection of layers to export. AutoImport command supports saving default NC Data format specifications. More than 35 software corrections have been made.
The Power SchmartModule reportedly permits hand soldering of surface mount components easily, quickly and flawlessly. Permits users to power up circuits with one of seven voltages; voltage choices are -9, -12, +2.5, +3.3, +5, +9 and +12 volts. Comes as a bare board with a bill of materials, schematic and instructions. Uses patent-pending "ez" technology. Able to reuse product on many different circuits.
DV509-UV-LF is a diaphragm action valve designed for UV resins. The wetted chamber is compatible for low to medium viscosity UV materials. Is high cycling, rated at 200 cycles/min. Has lightweight, compact design; suitable for automated systems. Diaphragm seal is attached to a solenoid that opens when receiving an air signal from a valve controller. It flexes to permit fluid to exit for the duration that the seal is opened. A return spring snaps the diaphragm shut after the air signal is removed.
The anti-allergenic adjustable fabric wristband adjusts under the cover, leaving no exposed “tail” of band material. No metal contact with the skin. Adjusts in circumference from 4.75" to 7.9". Is bright yellow for high visibility in ESD protected areas. A 4 mm snap is standard and is compatible with all 4 mm cords, including Desco Jewel coil cords.
Polyurethane-coated nylon dissipative gloves are low-dust and lint sloughing. Said to be ideal for photo work and other processes requiring clean handling. Fingerprints, contamination and scratches are minimized. Are form-fitting and have slip-resistant coated fingertips. Reportedly have excellent elasticity and ventilation. Resistance is 10e5-10e8 ohms, per ANSI/ESD 5P 15.1. Four sizes available.
GSR 1200, for PCB depaneling, provides tool life tracking with automatic notification of tool breakage, etc.; automatic backup of program files; definable distance routed for filter bag change; three levels of software access providing programming security. Supplied with an analog CCD camera. Has tool bit diameter compensation. Uses advanced precision manipulators on all four axes; fully enclosed heavy duty preloaded linear guides; servo motor z-axis with power-off brake. Is fitted with sliding doors and a safety perspex screen. Features include routing speeds up to 100 mm/sec. coupled with positioning speeds up to 1000 mm/sec.; two independent workstations; large panel size up to 350 x 350 mm; integrated top clamping; fixture carriage plate with reference holes; vision assisted jog and teach facility; zero maintenance AC servo motors with repeatability ±0.02 mm.
Asscon Vapor Phase technology is said to be the most versatile reflow system for Pb-free and leaded applications. Maintains peak temperature of a small resistor while reaching a suitable liquidous period for larger, adjacent devices. All parts reportedly reach the same peak temperature; local differentials are reportedly nonexistent. Bringing the circuit back to a liquidous state in a non-turbulent chamber permits removal of and replacement of high mass/value parts without exerting high levels of mechanical stress on the PCB or parts by creating local temperature differentials. Is conducted in an oxygen-free environment, with minimal or no fluxing, and no extraction for operators. Removal process guaranteed not to take place until the joints are liquidous.
Uni-form epoxy preforms are available in M5-82, a linear epoxy system that remains flexible under temperature changes. Post-cure flexibility said to improve adhesion to component materials with dissimilar coefficients of thermal expansion. Developed for under-the-hood automotive applications and other environments that require seal integrity under adverse temperature conditions. Are one-part epoxy resins solid at room temperature. Melt and cure when heated, forming a seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Close tolerances on preform dimensions; consistent pre-mixed ratios of resin to catalyst; and consistent viscosity from beginning to end of batch ensure uniform. Available with outside diameters from 0.035" to 0.720". Can be dispensed as rapidly as 200 to 600 parts per minute. Said to eliminate pot-life concerns and cleanup procedures.
Medalist i1000 offers the VTEP v2.0 vectorless test suite, which comprises iVTEP and network parameter measurement technology. Reportedly offers unparalleled coverage of micro ball grid arrays and flip chips, as well as power and ground pins for connectors found in digital consumer products and desktop PCs. Is compatible with most MDA fixtures. An AutoDebug feature slashes debugging time to a few hours. Comes with an automatic node-guarding feature that is said to eliminate the need for manual checks of schematics for guard points. Offers two fixture options. Provides fast fixture-swapping time while maintaining high signal integrity. Available in June.
Offset Placement After Solder Screen (OPASS) printing addresses solder paste alignment errors. With the technology, the placement machine reportedly can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of prior process errors. Addresses placing small components centered on the paste and not the pad, which reduces defect rate. Said to eliminate the need for other equipment such as AOI machines.
The Opal FP-XII is a turnkey system for standalone and line-balancing applications. Places 01005, fine-pitch and odd-form components with a reported accuracy as good as 30 microns. Has placement rates up to 6,800 components per hour. Incorporates two independent super-fine servo-controlled heads with high-resolution encoders. Takes odd-form components up to 45 x 100 mm (up to 20 mm high). Is supplied with operator monitor, board clamping system with automatic width adjustment, nozzle exchange system and feeder lock verification. Places up to 11,600 cph with four heads or optionally 17,700 cph with eight heads.