The ScanBooster/USB-FXT is based on a USB2.0 interface. Provides solution for critical TAP accesses to ATE fixtures and HASS/HALT applications. JTAG/Boundary Scan Test, PLD programming and In-System programming can be executed over longer distances. Features two TAPs and supports programmable TCK frequency up to 16MHz max. Obtains flexibility and safety via distances up to 4 m to the Unit Under Test. Provides 32 programmable voltages, dynamic Parallel I/O, two ADC/DAC channels, external trigger signals and three static I/O. Can be used for extended test and PLD/Flash programming operations.

Goepel Electronic, www.goepel.com

The APR-5000-DZ array package rework system is said to enable fast ramp and tighter delta temperature control for Pb-free rework without affecting adjacent and underside components. Expands capability to rework odd-form and temperature-sensitive components. Reportedly delivers highly targeted and controlled heating for rework of high thermal demand boards, including multilayer assemblies up to 12" x 12". Has a dual convection bottom-side heater that consists of large and small area heaters. Can rework components with 0.4 mm pitch. Enables rework of components where vacuum pickup is not an option. Strobe light facilitates viewing the dual image of both component and board. Is for small, high-density boards used in mobile phones, handheld instruments and personal media players.

OK International, www.okinternational.com

The ETR-100 single shuttle bay depaneling station is built on rugged platforms. Is designed for low- to mid-volume depaneling requirements and incorporates a single shuttle bay for operator loading and unloading of PCB arrays. Integrated touch panel displays operational sequence as the system progresses through its functions. Permits process viewing.

Promation Inc., www.Pro-mation-Inc.com

Alpha WS-819 water-soluble, Pb-free solder paste reportedly withstands 50% +/-15% humidity. Developed for Pb-free PCBs. Is said to provide long stencil life, reduced printing cycle time, voiding resistance, and water cleaning without saponifiers and special waste water treatment and disposal systems. Has been tested on Enthone OSP, Alpha immersion silver, and immersion tin and ENIG finishes.

Cookson Electronics, www.cooksonelectronics.com

The Agilis Stick Magazine uses stick-feeding technology. Also uses a precision linear drive and servo-controlled horizontal motion to feed up to 50 mm long components in up to 28 mm high sticks; moves the stick forward and immediately pulls straight back to advance components through the stick, into the pickup position. No manual feeding required. Key benefits are said to include increased accuracy and reliability; quick setups and changeovers; wide component range; one magazine handles all, and removable stick pallets with ID and barcode. 

MYDATA, www.mydata.com

The OptiGuard stencil system is part of the VectorGuard stencil range. Provides an alternative mounting process, helpful when stepped or multi-level stencils are deployed. Can be used with laser-cut, precision-etched, laser-formed or electro-formed stencils. Can be purchased from DEK, Tecan, or any stencil manufacturer licensed to sell the technology.

DEK, www.dek.com

This double-row SMT strip socket accepts 0.025"-0.037" diameter and 0.025" square pins. Is offered standard in four- up to 100-position configurations on 0.100" spacing. The 0.276" tall insulator is manufactured with high-temperature thermoplastic suitable for reflow soldering operations. Is rated at 4.5 A per position. Is available in RoHS-compliant and traditional platings. For connector configurations up to 10 positions per row, the coplanarity of the leads is 0.005". 

Mill-Max, www.mill-max.com

HPC-Z interconnections are said to provide signal connections only where desired, with functional isolation for single or double-side surface-mount partitions. Solves thick board drilling and wire density problems. Has capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. Provides interconnections within the board, and reportedly eliminates unnecessary PTH drilling. Vertical connection with a lamination is in place of a PTH; aspect ratios for drill and plate are limited to sub-assembly dimensions. Increased wiring density because of smaller vias and lands.

Endicott Interconnect Technologies, www.eitny.com

ScanAssist, part of the System Cascon boundary scan software platform, enables real-time activation and analysis of individually defined logic states directly in the target hardware (pin/net toggler) without prior test program generation. Features automatic identification of potentially unsafe or hardware harming vectors and logic states of non-boundary scan nets and pins. Is complemented by interactive graphical visualizer Scan Vision III. Reportedly can apply a data flow-oriented, virtual schematic for interactive logic probing in a completely integrated development environment. Logic levels can be provided in object browsers and ASCII files, as well as in schematic and layout visualizer. Virtual schematic enables the synthetic combination of native schematic sectors. A tracing of the entire debug session is possible because all user interactions are recorded separately.

Goepel Electronic, www.goepel.com

Axiom X-1030 Series dispenser is for selective jetting of traditional flux, no-clean solder fluxes and other precise coating applications. Comes in single or dual-lane configurations. Said to optimize underfill and package reliability, improving production throughput and equipment utilization by as much as 60-85%. Configured with DJ-2200 DispenseJet valve with coaxial air technology. Maintains 0.5 to 1.5 mm edge definition. Minimizes overspray associated with other spraying techniques. Said to ensure consistent, ultra-thin flux film builds (as low as 5 µm) by following jetted flux with a pulse of air.

Asymtek, www.asymtek.com