Products
vPlan software will be provided to Spectral Response Inc., enabling faster transition from NPI to full production with a reported seamless coverage for all production lines, including Siemens, Fuji, Universal and Panasonic machines. Will help increase overall equipment effectiveness through process automation. Includes new capabilities, such as auto-generation of machine shapes from VPL. Delivers manufacturing process definitions to the production floor, and automatically generates machine-specific libraries on demand.
Valor Computerized Systems Ltd., www.valor.com
The FLX2010 SMD pick-and-place comes with 190 feeders and permits feeder changeover during operation. Said to place 5,000 cph. Enables placement of 0201 or 0.3 mm components, tall condensators (height up to 15 mm), large connectors and BGAs with 50 mm side length. Features a combination of laser and vision centering systems. Feeder management system automatically recognizes feeders and pickup height. LEDs show feeder status and notify the operator if a minimum quantity is reached. Feeder setup control system is based on barcode identification. Machine programming can be prepared offline during production.
Essemtec, www.essemtec.com
Essemtec, www.essemtec.com
AutoVue v.19.2 is an EDA-centric product offering that addresses specific requirements of PCB design and contract manufacturing. Is for viewing, reviewing and collaborating on EDA files. Includes native viewing, markup and secure real-time collaboration capabilities via the Web for manufacturing documents, PCB layouts, schematics and Office documents. Electro-Mechanical Professional provides format support for EDA, 3D, 2D and Office document types in a single solution; said to bridge the gap between MCAD and EDA. Delivers enhancements and new format support for manufacturing, A/E/C, oil and gas, and plant design communities, including AutoCAD 2008, SmartSketch 4.0 & 5.0, SolidEdge 19, Inventor 2008 and more.
Cimmetry Systems Corp., www.cimmetry.com
The SN100C Pb-free alloy flux system is available in low VOC, VOC-free, alcohol-based formulations, solder paste form, and also as paste and liquid fluxes; appropriate for wave, reflow, selective, and hand (cored wire) soldering. Has a synthetic base that reportedly provides stability under the higher temperatures required by Pb-free alloys. Said to work well in air or under a nitrogen blanket. Is compatible with many different finishes, including OSP, Ni/Au, Ag and Sn.
Cobar Solder Products, www.cobar.com
The Traceability and Control Validation Kit is designed to validate manufacturing process and provide the potential for rich product and process traceability detail. Is reportedly the first measurement tool for manufacturers to validate their plants’ traceability and control based on rating traceability. Is designed to help engineers quickly find key products needed to qualify their assembly technology. Is also said to provide the physical materials and procedural guide to determine a factory’s traceability and control capability, and to rate the results in a formalized matrix.
Aegis Industrial Software Corp., www.aiscorp.com
Practical Components Inc., www.practicalcomponents.com
Three semiconductor testing procedures for QFN, DFN, CSP and WLP semiconductor packages use “test on tape“ process, with MCT Tapestry Film Frame Handler. Said to test multiple package types and sizes without requiring mechanical conversion kits. “Test after singulation” process reportedly eliminates semiconductor defects caused by mechanical sawing after electrical testing. The “wafer to pocket die traceability” system is said to track every unit from the wafer through test and inspection to the specific pocket on a reel of taped units; allows customers to perform virtual retest of taped devices in the event of a specification change or new OEM requirement.
Best Electronics and US Export Authority, www.usea.com
CM10 has been specifically designed for simultaneous double-sided cleaning of large format substrates. Applications include PCBs, flat panel displays, screen printing, LCDs, lamination, packaging and glass manufacture. Has elastomer contact cleaning rollers and adhesive system. Four large-diameter elastomer rollers are said to remove unattached particles down to one µm and transfer them to a high coat weight, pre-sheeted, reverse-wound adhesive roll. Analysis and assessment of the source of contamination is made possible. Has cleaning module tilt system. Includes 7kv anti-static system. Operation up to 40 m/min.
Teknek, www.teknek.com
SJ7 Mini solder bars build on properties of the SJ7 solder alloy. Are approx. 110 mm long, 8 mm wide and 5 mm high; said to be ideal for small dipping pots and solder fountains. Yield results for applications involving harsh environments, thermal cycling and high strain. Said to feature improved tensile and creep strength, time to rupture, wetting capabilities and yield.
Almit Technology, www.almit.com
Almit Technology, www.almit.com
The M22XDL-350 desktop AOI features a small footprint and is for inspecting PCBs, including SMT and THT components, reflow and wave solder joints, and solder paste. Introduces three-pulse wave modulated LED light sources and up to six different lighting combinations. Enhanced by Rep 22X Statistics and Repair Desk Software. Monitors inspection process in real-time while visualizing collected data. Features 24-bit color imaging. Reportedly overcomes limitations of 8-bit greyscale imaging.
Marantz Business Electronics, www.marantz.com
Marantz Business Electronics, www.marantz.com
The Weller WHA900 Hot Air Station features a closed-loop feedback control said to maintain desired temperature at the nozzle, independent of the airflow rate. The sensor, located inside the nozzle, adjusts heat output based on user-selected settings. Its hot air pencil, usable with a wide range of nozzles, reportedly yields a 650W output and a temperature range of 100° to 1,000°F.
Cooper Hand Tools, www.cooperhandtools.com/weller
Virtual Panel Carrier centers substrates and is said to enable multiple component support and alignment during screen printing and all subsequent assembly processes. Enables alignment once; reportedly no further adjustments are required. Design consists of a base carrier with a consumable foil. Said to provide stability, centering and alignment capabilities required to process substrates or components in a single panel. Parts are placed manually or loaded with a placement system. Substrates are held in the carrier via a patented four-sided tensioning mechanism. Parts are referenced using two global fiducials. Is scalable.
DEK, www.dek.com
DEK, www.dek.com
SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool.
Ansoft Corp., www.ansoft.com/siwave
Ansoft Corp., www.ansoft.com/siwave
Press Releases
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments
- Creation Technologies Celebrates Ribbon Cutting of Expanded Denver Product Realization Center; Patrick L. Freytag Comments