Pyramax 100 reflow oven comes in 8-zone air or nitrogen models, and recaches 350ºC maximum temperature. Is Pb-free capable, reportedly has low nitrogen and power consumption, and uses closed loop convection control. Delivers features like side-to-side recirculation, and convection efficiency that reportedly reduces zone temperature set points. Features Windows-based Wincon oven control software and smart-tracking SMEMA conveyors.  

BTU International Inc., www.btu.com

  

StatNot XC is a static dissipative material that can be combined with existing materials, such as the NP510A fiberglass epoxy composite. The composite surface is said to maintain a surface resistivity of 106 to 109 ohms per sq. Said to be ideal for applications in the electronics assembly market, such as test fixtures and assembly work surfaces. Is tested and certified to a surface resistivity range of 105 to 1010 ohms per sq.

Norplex-Micarta, www.norplex-micarta.com 

PCB Artist software is a free layout package that includes schematic symbol, footprint and part creation wizards to streamline the PCB design process and reportedly reduce component creation time to as little as five minutes. Customers can draw from an extensive library of components. Includes automated component placement and trace routing; back-and-forward integration that permits users to make changes to the schematic that automatically translate to the PCB design. Gerber-formatted files available on request.

PCB Artist, www.pcbartist.com 

The Icon i8 fully automatic screen printer is said to wield high throughput and flexibility. Has been developed to meet the precise demands of the Asian electronics market. Features a high degree of automation; reportedly reduces product changeover time to 2 min. and product setup time to less than 10 min. Delivers a 12 sec. cycle time and 350 x 300 mm max. board dimensions. Includes a compact auto tooling system and advanced statistical process control software; uses SPC techniques; vacuum under screen cleaner; available in 400 and 520 mm widths; paste on pad solder verification. Print speeds from 2 mm to 150 mm/sec.; can handle boards from 40 x 50 mm up to 350 x 300 mm, and a thickness of 0.2 to 6.0 mm. Max. board weight is 1 Kg.

Icon Technologies, www.iconprinter.com

The integrated intelligence concept is based on intelligent feeder and intelligent machine. The feeder records component identity, inventory count and pickup correction so the machine can confirm that it picks the correct component reliably. The machine must be able to enable high throughput when feeders are not in optimized positions. The turret head and machine architecture are reportedly critical to enabling this potential. Said to cope with feeders in any position with limited reduction in placement rate. Every feeder is said to be fully programmable with component and inventory data. Once the feeders are loaded, the machine automatically recognizes the information.

Europlacer, www.europlacer.com

Zestron America, www.zestron.com

Dyne-A-Mite IT CO₂ Plasma is said to provide superior surface treatment to improve adhesion on a wide variety of materials. The use of gas or liquid-phase CO₂ with atmospheric plasma discharge surface pretreatment technology can remove micron and submicron particulates and hydrocarbon-based contaminations on plastics and metals. Increases surface tension of base substrates. Bonding strength is said to be improved. Is suitable for either initial or final cleaning, and for cleaning applications.    

Enercon, www.enerconind.com/treating

The OUC-500 Wave Unload Flat Belt conveyor station provides a means to unload PCBs from the wave. The ESD flat belt is said to be 500 mm and can handle PCBs up to 17" in width. Comes standard with variable speed control and three topside fan arrays. Framing system can be adjusted.

Promation, www.pro-mation-inc.com

The NSM series wave soldering machine has a modular design and dimensions of 4376 x 1620 x 1710 mm. Features include conveyor speed of up to 2000 mm/min; flux flow of 20 to approx. 100 ml/min.; transparent windows; closed loop with inverter control system; flux level checked by non-osculation inductor; hermetical container; three pre-heaters in forced air convection 1.8 m preheating zone; electromagnetic and motorized pumping for solder bath, and optional nitrogen configuration.

JT Electronic Equipment Co., www.jt-ele.com

Kimtech Pure W3 dispenser for presaturated alcohol wipes is said to provide one-handed dispensing with no need to hold a package or reseal a closing flap. Features include self-closing, self-sealing lid; extractor arm that is said to automatically lift each wiper, and a design that reportedly doesn’t generate particles. Available in three formulations, including 70% isopropyl alcohol/30% deionized water. Wipers are continuous filament double-knit polyester.

Kimberly-Clark Professional, www.kcprofessional.com

Performance Upgrade packages for CBT6000 and Model 8000 automatic wire bonders and the Model 3500 component placement work cell include improved vision systems for pattern recognition and Bond Data Miner. BDM is a software package that monitors machine and process trends; can track and archive traceability data for each part, die, wire and bond; said to automatically adapt process parameters to address lot to lot and/or part variations; reports its own uptime and statistics to any computer.

Palomar Technologies, www.palomartechnologies.com

Hysol FP4581 and Hysol FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically for the requirements of high-lead, bumped large die flip-chip packages. Low CTE properties, improved toughness; forms rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance. Ideal for flip-chip devices that require improved crack and fracture resistance. Compatible with most no-clean flux systems. Contains fillers less than or equal to 2 µm in diameter and has been formulated for use with overmolded components in high-lead and Pb-free applications. Amine-based underfill systems are said to offer excellent adhesion to SiN and polyimide. Both are designed to deliver lower stress with the combination of thermal mechanical characteristics to prevent delamination, bump fatigue and UBM failure. 

Henkel Corp., www.henkel.com/electronics