SEMTest is a configurable stress-screening system able to perform lifetime testing of power semiconductors and modules incorporating IGBT, MOSFET, SCR, diode and bipolar parts. Is said to be ideal for manufacturers and users of power semiconductors who want to qualify commercial off-the-shelf devices for use in high-reliability applications. The core is a flexible architecture that can be modified. Standard systems can be configured from 20 to 1000 test cells; larger systems are available on special order. Each cell features its own local controller to set and monitor applied or UUT power and other test parameters; has a measurement unit for temperature, current, voltage, and timing.
The latest versions of PCB transfer conveyors and PCB inline work stations include the 600 mm single drive transfer conveyor, a 1000 mm dual drive transfer conveyor, and a full feature 1000 mm dual drive workstation.
CION Module/DIMM168 is a digital module serially controlled via TAP by CION ASIC chips. Said to enable testing of all signal and voltage supply pins of JEDEC Std.-compliant DIMM168 plug connectors. Is plugged into a socket, whereby interface stages’ voltage between 1.8V and 5V are adapted automatically. Several boards of the same or different types can be cascaded in a daisy chain configuration. All channels can be independently switched as Input/Output/Tristate. Provides special safety mechanisms.
Videojet 3430 laser marking system is said to be capable of speeds up to 2,000 characters per sec. and line speeds up to 50 ft. per sec. Has an IP65-rated housing, self-contained cooling system, an articulated arm and a small marking head. Uses no consumables such as inks, solvents or compressed air).
The Green Monster ESD stencil wiping roll is Pb-free compatible and antistatic. Said to prevent sparks that can damage components and cause voids in solder traces. Uses coarse ESD fibers. Fabric is said to have an aggressive cleaning surface. Reportedly provides more voids to collect solder paste, as opposed to smearing that results from using paper. Is made of a cross-linked acrylic polymer that bonds the fibers together. Porous product permits full use of the vacuum system.
This environmentally safe circuit board cleaner will replace former cleaners that required special handling and disposal. Is nonflammable. Reportedly cleans better than previous solutions in most applications and without the need for fume evacuation or special toxic handling. Developed specifically for cleaning circuits and components to eliminate leakage through residue or contaminants. Said to work well on boards in high frequency and low voltage applications where contaminants cause failure. Available in liquid concentrate and is suitable for high-volume circuit board production equipment and special hand-cleaning applications.
The Grab-Eez wipe dispenser is said to be economical, dispensing only one wipe at a time. The double C-fold design gives each wipe an exposed edge so that the user can grab one wipe without touching the next. Said to conform to housekeeping practices and protects wipes from the environment until use.
Wedge emulation technology is for low profile interconnects, fine pitch, running stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages. Uses Model 8000 ball bonder. Said to bond seven to 12 wires per second. Can program an interconnect beginning with a stitch instead of ball; complies with visual standards defined per Mil-Std-883, Method 2017. Can use a wire other than gold, such as aluminum or copper.
IPC-7351A LP Wizard is for the CR-5000 PCB and advanced packaging suite. This land pattern generator is said to reduce the time it takes to build a standard SMT footprint/symbol for a library part; ensures compatibility with the latest IPC standard for surface mount design. The task reportedly takes less than a minute. Consists of land pattern viewers, calculators and generators for the creation of CAD land patterns, including pads, padstacks and footprints/symbols in SMT parts libraries. Dovetails with free IPC library documentation and viewer provided with IPC-7351 standard. Data can be shared with engineers throughout organization on a project-by-project basis.
Blindmateable vertical headers have been added to the 4.2 mm PE series connector system. The system is a wire-to-wire, wire-to-board and wire-to-panel connector based on 4.2 mm x 4.2 mm centerlines. Headers are available in even position sizes, ranging from two up to 24. Reportedly can create system where exact positioning of mating connectors is aided by the funnel lead-in of the housing to permit easier alignment and mating in wire-to-board applications. Is available in UL 94V-2 or UL 94V-0 housing materials; contacts are tin-plated or gold-plated brass. Are rated for 9A max. (two-position version) and 600 VAC. Rated for 50 mating and unmating cycles and said to be suitable for intermating and interchanging with competitive products as well as AMP-DUAC connectors.
The Momentum (MPM) printer features CANopen motion control and I/O architecture. Its vision system includes a USB digital camera with look-up/look-down capability, telecentric lens, and advanced lighting techniques. Includes contrast-based 2-D, BridgeVision and StencilVision, all with SpeedVision; new transport and squeegee systems, vacuum stencil wiper and roller solvent bar delivery system. Machine operation with Benchmark software has wizards for error recovery, machine functions and utilities. Reportedly, a new product file can be created in less than 10 min.; any existing process program can be used as template. RemoteTech diagnostics package enables remote support and troubleshooting. Includes a single, front-fixed rail conveyor with top clamp and centernest vacuum hold down and a 17" flat panel display. Board size capability from 609 x 508 mm to 50.8 x 50.8 mm. Accuracy and repeatability is said to be +/-12.5 µm at 6 sigma (Cpk greater than or equal to 2), with a cycle time as fast as 10 sec. (excluding print).
The SP600 automated batch printer comes with a table that can be designed with a standard fixation or a customer-specific substrate holder. Because of shuttle system, any kind of substrate holders reportedly can be used. Enables printing of solder paste onto PCB, conductive glue printing on flex circuits, and special paste application on ceramic on one system. Print table is motorized in four axes (x, y, c and theta); said to allow automatic alignment of the substrate to the stencil. Two vision cameras measure reference structures and calculate offset. Operator can see in real-time which squeegee, stencil or tension frame must be installed. Is said to be ready in less than five minutes for new job. Comes prepared for 29" stencil frames. Substrate holder is designed for single or double-sided PCBs up to 450 x 500 mm. Rubber or metal squeegees with a length of up to 500 mm can be used. Features automatic stencil cleaning (dry, wet, vacuum).