Compact stopper blocks and brackets are for machine and assembly builds. Are available in low-carbon steel with black oxide or electroless nickel plating, as well as 304 stainless steel. Configurable heights in 1mm increments from 3 – 20 mm are offered with compact counterbore design for flush fitting in tight spaces. Hex or bolt styles are offered in low-carbon steel with black oxide or EN plating, as well as 304 S.S. Larger blocks, in standard, tapped and side-mounting plate styles are configurable in 5 mm increments from 10 – 50 mm heights, in black-oxide or EN plated steel and urethane materials. Fixed threaded styles are offered from 1/2" to1-1/2" heights. 

Misumi USA, www.misumiusa.com  

Trident is a Pb-free compatible, automatic post-reflow defluxing system. Is reportedly the fastest batch-format defluxing system available. Throughput rate is determined by board size. Is said to be capable of defluxing and cleanliness testing up to 200 4 x 6" boards and up to 28 18 x 20" boards per hour. Process consists of up to five cycles, including pre-wash, wash, rinse, cleanliness testing and drying. Is equipped with an automatic chemical management system. Wash solution is captured and reused. Is equipped with inverse-mounted vertically oriented spray pump. Includes built-in statistical process control data capturing technology.

Aqueous Technologies, www.aqueoustech.com

ScanINSPECT VPI is a process control tool that is said to qualify each step of the assembly and fabrication process before production. Is a standalone system that couples a high-res, color flatbed scanner with a dual lighting system. Said to validate process in all phases of production, including design; board fabrication; bare board, stencil and component inspection; deposition and component mounting, and finished boards using a calibrated scanner and dual lighting system. Uses Gerber, CAD or Golden part data to validate board fabrication, stencil cleanliness, paste/adhesive deposition and populated boards. Users are said to be able to check holes, slots and artwork; ensure parts from multiple vendors conform to the required shape, position, color and size; detect stretch, wear, blocked or damaged apertures; ensure new stencils and screens match board revision or that cleaning operations are successful. Reportedly can use to build part libraries direct from components.

ScanCAD International, www.scancad.com

EnviroMark 919G Pb-free solder paste is reportedly 100% halide- and halogen-free. Said to offer ultra-low voiding characteristics, lighter flux residue color, easier residue penetration, shiny joints and excellent solderability on all components and board finishes. Prints to 0.4 mm pitch. Said to reduce potential defects such as bridging, solder balls and tombstoning.

Kester, www.kester.com

The S3088-II high-speed AOI system includes 8M sensor technology and EasyPro3D user interface. Is said to provide reliable post-reflow, post-print or post-placement inspection. Offers inspection on PCBs up to 450 x 350 mm. Reportedly provides a resolution of 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis and permits inspection of components as small as 01005. Offers color evaluation as standard. Operator interface comes equipped with automatic parameter optimization and LIB2007 inspection library that contains more than 1,600 component types and takes into account IPC standards. ‘ValidCompare’ mode provides the operator with an archived image as a good-board reference. ‘TrustedChange’ integrated verification is said to simplify the reduction of false calls and ensures a zero-escape strategy.

Viscom Inc., www.viscom.com

This centralized pallet product line reportedly provides customers the opportunity to procure all assembly tooling from a single source using existing data from the Gerber files. Now includes ESD-safe process carriers for wave solder and SMT assembly. The carriers, said to be ideal for use with lead-free solder, allow masking of specific areas. Boards and components are protected from thermal shock and ESD. Utilizes materials said to be ideally suited to the soldering process, including Durapol and Delmat.

Photo Stencil, www.photostencil.com