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Selective soldering systems with internal (integral) preheating modules are for large, high-mass assemblies in which process heat is applied only to the bottom side. Said to promote the draw of solder through the barrel to the board topside. Includes continuous preheat during selective soldering.

ACE Production Technologies, www.ace-protech.com

HD Grid-Lok is a high-density tooling solution designed to support entire PCB assembly without manual intervention. Its 12 mm pin pitch reportedly can be set up in seconds. Is said to be ideal for high changeover manufacturing environments. Is based on a modular foundation concept; reportedly will conform to any board profile and to individual substrate topographies, with pins automatically locked into position.

DEK, www.dek.com

FLO/PCB Version 4.1 thermal design software includes the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. Is said to make it possible to perform board-level thermal simulation early in the design process. Includes a SmartPart object used to represent epoxy type solid cured potting compounds; can be placed over all or part of either side of the PCB. Multiple potting compound regions reportedly can be defined. Provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. Using legend scaling options, users can define minimum and maximum values for the upper and lower bounds of the scale. Also includes an advanced search capability. Maintains bi-directional connectivity with Version 7.1 of Flotherm.

Flomerics, www.flopcb.com and www.flomerics.com

The 6-Pack Analysis Package is a sampling service designed to define the cleaning bath loading capacity for inline and batch cleaning processes. Consists of a set of sample bottles for regular sampling directly from the cleaning tank. Each sample is subsequently returned to the analytical center for detailed analysis. A bath-loading report is provided to users, including recommendations on how to further extend the cleaning agent’s bath life.

Zestron America, www.zestron.com

The RO300FC full convection reflow oven has four zones (three heating and one cooling), for all soldering and curing tasks. An inert gas model is also available, and changeovers between air and nitrogen are said to take less than 5 minutes.

The unit is 78.8 x 28 x 47.2". Solder width is 11.8", transport speed is 4 - 31.5".min.

Between heating zones is a "stream seal" that permits temperature differences between two zones up to 90°C (194°F).

Comes with optional RO-CONTROL software, which simulates new processes prior to soldering and graphically compares temperature profiles.

Essemtec, www.essemtec-usa.com

The Juki 350 selective soldering system comes standard with an X,Y, Z and A axis servo drive and is equipped with all the functionality necessary to begin production immediately. Includes a soldering unit that features forced hot air nitrogen preheat at the mini-wave nozzle. Nitrogen preheat limits dross buildup, opening the process window and reducing maintenance. An innovative nitrogen management system is used to reduce nitrogen consumption. Other standard features include a spray fluxer or micro-dot drop jet fluxer mounted on an individual A axis servo drive; 5-liter pressurized flux tank; an exchangeable quick exchange mini-wave nozzle from 4 to 30 mm in diameter (custom nozzles are available by request); exchangeable Pb-free ready solder pot with 110 lb. capacity; auto feeder solder roll for maintaining solder pot feed level; a wave height on/off control feature; online/offline programming software that can accept images such as JPG, BMP, TIF, as well as Gerber files for easy programming with a simple to use GUI; and a float sensor for keeping constant levels of solder in the pot at all times. Comes with dual nozzle and dual fluxing capability.

Juki Corp., www.jas-smt.com

PCS peelable coating mask is a flexible synthetic acrylic latex designed to withstand coating and wave soldering processes. Is water-based and environmentally friendly. On application the mask is orange and darkens once cured. Said to it peel easily after curing. Reportedly noncorrosive to most substrates, with good solvent resistance. For masking components, connectors and other items during a conformal coating process. Is suitable for dip, spray or brush applied conformal coatings.

Electrolube, www.electrolube.com

The BC-60 edge carry transfer conveyor is 600 mm in length and has a single drive; the BC-100 comes with a single 1M drive or 2-500 mm drives. The ESD edge belt is 3 mm wide and can handle PCBs up to 18" in width. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with both hand and foot pedal for PCB release, and programmable logic controller.

Promation Inc., www.Pro-mation-Inc.com

This no-drip, Pb-free, no-clean SAC 305 solder paste for mechanical soldering is said to be excellent for gap filling and application on vertical surfaces. Help solder joints around a heat tube (or heat sink) container. Reportedly wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper.

EFD Inc., www.efd-inc.com

SIP and STRIP male pin headers feature sturdy 0.040" diameter leads; mate to standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2x4) up to 100 (2x50) position configurations on 0.100" spacing. Reportedly creates a high current interconnect rated at 8 amps per position. The low-profile insulator (0.071" thick) is manufactured with high-temperature thermoplastic. Standard and RoHS plating available. Use brass alloy 360 ½ hard.

Mill-max, www.mill-max.com

Hysol FP4581 and FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is formulated high-lead, bumped large die flip-chip packages. Is said to have low coefficient of thermal expansion properties and improved toughness over previous materials; forms a rigid, low-stress seal on solder joints. Is said to be ideal for flip-chip devices that require improved crack and fracture resistance. Is compatible with most no-clean flux systems. FP4583 is for applications requiring a fine filler. Contains fillers less than or equal to 2 µm in diameter; is formulated for overmolded components.

Henkel Corp., www.henkel.com/electronics

The YTV B3 benchtop AOI now comes standard with Fusion Lighting. Said to offer up to 3x improvement in inspection speed and advanced image processing. Consists of more than 600 colored LED lights that project to the PCB surface from different angles (high, medium and low). Enhanced contrast in the image is said to allow inspection algorithms to identify features in component body or solder joints that would have been previously difficult to see. Is available with two top-down viewing thin cameras for inspection of components down to 01005s. Cameras reportedly permit small component inspection without a significant increase in cycle times.

YESTech, www.yestechinc.com