PowerClean II cleans lead-free circuit boards during manufacturing, rework and repair. Formula is based on Vertrel solvents from DuPont and VersaTrans solvents from PPG. Said to be ideal replacement for ozone-depleting solvents. Is alcohol-free with reportedly no risk of white residues.
 

Alpha EF-2210 wave solder flux offers soldering and electrical reliability performance. Complies with environmental regulations. Is a VOC-free, no-clean, low-solids, rosin-free flux that passes the Bellcore SIR electrical reliability requirement. Uses an activator system said to minimize micro-solder balls, bridging and icicles. Water-based, non-flammable formula. Is Pb-free and SnPb compatible.
 
Cookson Electronics, www.cooksonelectronics.com 

The AX-201 places many different types of components with a reported accuracy of better than 20 microns at single-digit defects per million. Places 01005 components, fine-pitch devices and odd-form components up to 130 x 79 mm with machine vision and laser alignment. Is suitable for both stand-alone and line-balancing applications with the AX-301 or AX-501. It has a placement rate of up to 18,000 cph. Placement force is programmable from 0.9 to 40 N. Feeders are configurable to hold up to 212 pick positions and 376 Jedec trays. Shares common user interface, feeders, trolleys and placement heads with other A-Series machines. Is designed for medium and large batch production in both high and low product mix environments. 
 
Assembléon, www.assembleon.com

The Handheld Laser-Focus Camera System for small-spot testing captures a digital picture and test results for compliance RoHS screening tests in an XRF Analyzer. Isolates test areas by placing a test spot down to 3 mm diameter and displaying the image and sample target on the color PDA screen in real-time. Ideal for evaluating non-homogeneous parts such as PCBs where the beam can be focused on a small component, solder joint, lead or terminal. Can switch from collimated pinpoint to full-field analysis. Snapshot images of samples analyzed plus laser-targeted small-spot analysis are saved in test records. Said to measure up to 25 elements in a single test. 
 
Innov-X Systems, www.innov-x-sys.com

 The X-50 Mobile XRF tests Cd to 1 ppm in many sample types, 10 ppm in alloys. Ideal for RoHS Packaging Directive, which requires sum of Cd, Hg, Pb, Cr less than 100 ppm. The Inspector Series XRF tests Pb content in solder and parts. Alerts users to banned metals using pass/fail criteria and documents total Cr, Br, Pb, Hg, and Cd. Angled front display plus rear display for easy viewing of test results; no wipe tests; said to eliminate the liability of isotope control, improper use, theft and disposal.
 
Innov-X Systems, www.innov-x-sys.com

Hawk Micro XRF benchtop analyzers deliver identification and elemental analysis from Ch to U. Use collimated beam of 13 to 0.2 mm diameter, with laser beam focusing. Ideal for testing small or nonhomogeneous samples. Applications include RoHS compliance analysis for electronics, PCB and components. Reportedly can perform standard-less quantitative analysis with statistical accuracy. Movable X-Y stage affords precise measurements across samples. A color CCD camera enables digital snapshots with magnification of up to 68X; combined with the laser spot tool, enables digital pictures to be analyzed and stored. Includes a large testing chamber, X-ray tube source and Si PiN-diode detector interfaced to a PC. 
 
Innov-X Systems, www.innov-x-sys.com

The SolderStar PLUS is the latest Neptune USB data logger. The system adds an integrated high-speed USB interface. Reportedly offers easier connectivity, speedier offloading of data and simultaneous rapid charging of the high temperature on board battery. Is ready for use.
 
SolderStar, www.solderstar.co.uk   
 

The WaveShuttle PLUS enhances the use of the SolderStar 4 & 6 channel Neptune data loggers for the wave soldering process. Additional software tools are included, along with a wave soldering fixture and second heatshield, allowing comprehensive testing of both reflow and wave soldering processes with one device.
 
SolderStar, www.solderstar.co.uk
 

The RD52 inline vapor phase reflow oven is for high-volume production and inline processing. Features adjustable pin chain conveyors, a four-zone preheat section, horizontal reflow position and left to right product flow. Provides touch-screen operation, fully integrated controls, SMEMA upstream/downstream interface and bar code capability. Offers a working envelope of 18 x 15" with a product clearance height of 1.5", using an adjustable pin chain conveyor for dual-side board capability; a 5.7" high-visibility touch-screen display for easy operator use, post-reflow cool down zone, and a working fluid auxiliary tank and filter system.
 

 

MicroPILR platform has low-profile, pin-shaped contacts that replace solder balls on semiconductor packages and plated vias in package substrates and PCBs. Benefits reportedly include reduced profile, fine pitch, improved electrical and thermal performance, and enhanced reliability. Pins can be used as internal or external interconnections in a variety of applications, including the interconnection between semiconductor die and package substrates, semiconductor packages and PCBs, the layers within package substrates, and PCBs to PCBs. Can be formed directly onto substrates and are typically nickel/gold plated copper. Range from 25 to 175 microns in height and 40 to 200 microns in pin tip diameter. Is capable of enabling contact pitches to 100 microns in a die-to-package substrate; in package-to-PCB applications, pitches to 0.3 mm or lower; and within package substrates, pitches of 150 microns or lower. Specific device applications include high-density stacked flash, DRAM and SRAM; logic plus memory packaging; and stacked and mobile memory packaging. 
 

The PMT400 rework system is designed for rework of microBGA, BGA, CSP, SMT, MCM and PTH assemblies. Proprietary Windows-based X-PC Advanced Process software provides GUI, featuring intuitive programming and Teach Mode profiling. Is Pb-free capable. Features precision gantry motion and a standard two-zone IR bottom heater. Provides performance in a small 28" sq. footprint. Includes a six-nozzle starter, network data management (XP Pro), real-time thermal control (external TC), automatic retract optics and an automated component pickup nest. Can handle 0.010" minimum component size, and offers a 2" sq. field of view, as well as 2" top- and bottom-side clearance. Provides 1 kW focused convection top heater and 14 x 20" maximum board size with 1.5 kW IR bottom heater.
 
VJ Electronix, www.vjelectronix.com