Mentor Graphics released of the latest version of its Board Station design flow for large, enterprise customers. The Board Station flow includes tools for design creation, layout and manufacture, and is for enterprise design teams.

The release offers improved integration with the enterprise, as well as improved design productivity and 'what if' signal integrity analysis. New feature include:

• Library and data management -- Tighter integration with DMS and added functionality to provide off-the-shelf RoHS design-for-compliance capabilities.
• Constraint editor system -- Addition of electrical rules entry, layout and analysis functionality to complement the high-speed physical rules already provided.
• Signal integrity verification -- Addition of the newly released ICX Pro Explorer functionality to the flow, Mentor's high-speed constraint development tool.
• Design layout -- Significant productivity enhancement capabilities including additional support for layout of flex boards; trace glossing so designers can more closely control interactive routing on dense designs; hard and soft autorouting "fences" to help control routing around dense BGAs as opposed to through them resulting in higher routing completion rates; additional gate and pin swapping capabilities to optimize layout.
• FPGA-on-Board -- Improved integration of I/O Designer to accommodate high pin count, high performance FPGA implementation.

Mentor Graphics, mentor.com

Practical Components, the supplier of dummy components, has added Amkor Technology's PoP (PSvfBGA), a stackable very thin fine-pitch BGA package. 

Also new is Amkor's tsMLF (Thin Substrate Micro LeadFrame-TAPP), a sub-100 micron flip chip test die, and the redesigned Cookson, Indium and AIM print test boards and kits.

Also new is Amkor's CVBGA very thin ChipArray BGA.

practicalcomponents.com

VJ Electronix is releasing an update to its Summit 2200 advanced rework station. New features include:

• Automated site prep (scavenging) system that permits fully automatic, component removal, noncontact, site prep, and placement of components with minimum operator intervention.
• Automatic and vision assisted placement, which facilitates precision placement of high lead count components such as Cu-CGAs. The system uses machine vision components and software to reduce cycle times and, improve yields. The system can be fully manual or manual with visual assist to allow fast and accurate placement of components that, without this benefit, are difficult to align.
• Wide area profile storage compatibility, which permits central storage of processes and profiles. During runtime, the system checks for the most updated profile through the network and downloads the latest process file on demand or automatically. This allows a central process lab to always maintain and distribute the latest data globally.
• New bottom heater and motorized table, including a 4.0 or 5.6 kW bottom heater designed for Pb-free processes. Also new to this table design is the ability to have a bottom heater cooling boost that decreases cycle times and meets maximum time above liquidus constraints.
• Integrated technical documentation. All manuals, help files, schematics and knowledgebase troubleshooting are imbedded in the SierraMate 7.0 application software. This allows operators and engineers to access all information about the machine locally. All GUI documentation, screens, help files and reports can be localized into native languages to ease in new operator learning.

vjelectronix.com

KIC 24/7 thermal process monitoring system version 2.3.0.0 includes bug fixes, improved printing capabilities, oven communication with SEHO reflow ovens, improved alarm functionality and more. 
 
Market drivers such as OEM requests for process traceability, conversion to Pb-free electronics and more are compelling electronics manufacturers to move from a manual spot check routine to automatic and continuous monitoring of their reflow process. The software provides full process traceability in thousands of installations around the world, along with automatic profiling and SPC charting. 
 
Version 2.3.0.0 is free of charge to all customers. 
 
KIC, kicthermal.com

CyberOptics will display Process Insight statistical process control software in booth 2D21 at the Nepcon South China this week.
 
The SPC software package is based on an enterprise-level database and open computing standards. Provides complete analysis of process performance. Offers comprehensive SPC charting capabilities, is a common interface for SE 300 Ultra and Flex Ultra for data analysis and correlation. Features chart-specific alarms to signal out-of-control data and trends, and data output from an SQL database for connection into shop floor control software. Provides real-time information to operators and customers, can be integrated into a shop floor management system, allowing full traceability.
 
Features the ability to access password-protected databases, faster loading of databases from SE 300 and Flex with new XML file watcher, and improved database structure.
 
Provides updates within line cycle times to allow for real-time corrective action. Features tools to access and manage all system data to allow for historical analysis. Data output for shop floor management system integration allows users to identify trends and increase yields.
 
CyberOptics Corp., cyberoptics.com

ADS 02M offline depaneling system is designed with an X/Y/Z gantry and features a rotary table, so the operator can load a panel while the system is cutting the next one. This is said to reduce overall cycle time.
 
Visit the EASi Line for a live demonstration of the High Speed Laser Marking System ALS 03. Features code verification with 1-D/2-D scanner, FIS dataconverter and repeatability +/- 100 micron at 6 sigma.
 
ASYS, asys-group.com
ATE Booth 5201
 

X-Tek Group will announce the addition of Computerised Tomography (CT), a 3-D imaging capability, to the Revolution microfocus system at Nepcon Shenzhen. The system features true concentric imaging, the highest degree of off axis tilt available and NanoTech open tube technology for unparalleled resolution and magnification. Visitors can also find out more about the group’s new operation in Hong Kong.

CT produces high resolution 3-D data sets which can be viewed at any angle, sliced in any direction and measured to enable detailed analysis of the internal structure of a wide range of components and objects.

Offers a viewing angle of up to 75^o, just 15^o to the plane of the board. This allows for maximum magnification (up to 6000x) at all angles over the entire 16 x 16” (410 x 410mm) manipulator scan area, for 100% BGA, µBGA, multilayer board and PCB solder joint inspection, with quick analysis of BGA ball wetting, attachment, cracks and delaminations. NanoTech source offers improved defect detection due to feature recognition in the submicron range.

Has advanced triple-mode programming interface incorporating off-line, teach-repeat and high level library function for program building.

X-Tek, xtekxray.com
Nepcon Shenzhen Stand 2B73

YTV F1-Series AOI system delivers fastest inspection and an intuitive interface for automated PCB inspection. For high-volume manufacturing environments. Off-line programming maximizes machine utilization with real-time SPC monitoring, and provides east configuration across multiple manufacturing lines.

YESPC software is a fully compatible enhancement to the AOI onlne. Provides diagnostic and trending analysis of the manufacturing process. Real-time monitoring and reporting allows management to immediately react to critical process events in SMT production processes

YESTech, yestechinc.com
ATE Booth 5303

CyberOptics Corp. will highlight SE 300 Ultra, its 3-D solder paste inspection system, in booth 2D21 at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
The 100% inspection system reportedly provides accurate, repeatable results at speeds that keep up with increasing line cycle times. Incorporates the field-proven technology and reliable features of the SE 300 along with new features.
 
Features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.
 
Can handle odd-shaped pads, has paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. Features paste height, area and volume measurements with Gage R&R <10%.
 
New features include 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits , easy-to-use Operator Interface and Defect Review and conveyor auto-width adjustment.
 

KISS 103 ‘Stretch’ large-format selective soldering system with 3” nozzles will be exhibited at the upcoming ATExpo in Rosemont, IL.
 
Offers the popular features found in the KISS 101 and 102 systems, but handles larger PCBs and panelized boards. Provides a 26 x 19" work area. The user can place more boards in the work area and take advantage of the Step-and-Repeat feature of the operating program.
 
3" nozzles are a new option, designed to increase throughput as well as close the gap between selective, or secondary soldering, and full wave soldering.  Enables quick conversion from a leaded to a no-lead solder process.  By "painting" the solder side of a circuit with the 3" wide wave, can deliver productivity that approaches that of standard wave soldering tools. Can be easily integrated with A.C.E.’s line of preheat modules.
 
A.C.E.products, www.ace-protech.com

EFD’s Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Pb-free formulations are known to leave dull, matte finishes, but the new clear, colorless no-clean flux residue allows the solder joint to sparkle. For applications requiring a shiny, cosmetic finish. Said to ease inspection and improve wetting capabilities for SMT, mechanical, electronic and electro-mechanical soldering applications. 
 

WaveMax 7000 thermoset composite material features enhanced durability for pallets used in high-temperature wave solder applications. Is made from an epoxy resin and random mat glass substrate. The ratio of glass to epoxy is high to maximize flexural strength and rigidity. Increased durability is critical for high-temperature, high-volume production runs that require a solder pallet to maintain strength at temperatures up to 315°C, for as many as 5000 soldering cycles.  
 
Has flexural strength of 59,000 psi, as well as flexural strength to 39,000 psi at elevated temperatures.
 
Norplex-Micarta, norplex-micarta.com