Henkel has developed a die attach and mold compound material set that is Pb-free compatible and designed for thin and ultra-thin surface-mount device applications.
 
Combined, the Hysol QMI529LS die attach material and Hysol GR828A mold compound deliver the thin, yet highly reliable, materials properties necessary for packages in  low-profile products such as cell phones, PDAs, portable music players and entertainment devices . 
 
When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of the die attach adhesive with the “Green” mold compound reportedly produces superior material set reliability and performance. QMI529LS’ formulation provides hydrophobic properties, while delivering stability at high temperatures. GR828A is a low stress molding compound that exhibits excellent gate leakage performance. Testing of this materials combination to JEDEC Level 1, 260°C has confirmed robust performance even in demanding Pb-free manufacturing conditions. 
 
Henkel,is one of the world’s leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across electronics.henkel.com

Model 325 Electrostatic Voltmeter, an ultra-sensitive instrument which is ideal for noncontacting electrostatic voltage measurement and monitoring in applications within high-tech, semiconductor, materials processing, materials science and R&D sectors. 
 
Designed for applications that require highly accurate, low noise, noncontacting measurement of electrostatic voltages from millivolts to +/- 40 V over a range of probe-to-surface distances. 
 
Applications include electrostatic monitoring of devices sensitive to ESD, and testing of the reliability and characteristics of dielectric materials and films in electronic applications.
 
In semiconductors, is designed to measure the surface potential of bare or processed wafers to analyze doping and thin film characteristics. Also useful for measurements of polarization, residual charge and characterization of electrostatic chucks.
 
Can monitor electrostatic charge where the build-up of such charge can cause productivity or yield problems, as in high-end processing of paper, plastic, textile or other film products. 
 
In materials science and R&D, applications include contact potential (surface work function) determination, materials evaluation and electret studies.
 
Features include sensitivity of 1 mV, speed of response less than 3 ms and accuracy better than 0.05% of full scale. Low impedance probe sensor assures measurement accuracy which is essentially independent of probe-to-test-surface spacing while eliminating the external  environmental effects of high humidity and contamination on measurement accuracy. Contaminants include airborne dust, ions, chemicals and other particulates.
 
Offers a higher performance alternative to Model 320C Electrostatic Voltmeter with faster speed of response, lower noise and higher accuracy. Smaller probe also increases the unit’s utility in space-constrained environments. Designed to address demanding semiconductor parameters for permittivity, oxide thickness and integrity, contact potentials and higher-speed automated voltage profile scanning.
 
Special features allow tuning the performance of the unit to compensate for specific test conditions.  Can be operated as a bench top unit or in a standard rack (with optional hardware).
 
TREK, Inc., trekinc.com

K-Alpha materials characterization instrument uses x-ray photoelectron spectroscopy to quantitatively determine the surface chemical composition of the top few nanometers of solid materials. Insulators, semiconductors and metals can be analyzed in a user-friendly, reliable and automated way. An integral ion source provides a high-resolution depth profiling capability, thus facilitating true 3D analysis. For high-throughput sample analysis.

Thermo Electron Corp., thermo.com/surfaceanalysis

The VPD-5 depaneler is said to permit stress-free board separation with components (inlcuding ceramic capacitors) as close as 0.5 mm from the score line. Reportedly handles boards as thin as 0.32", and can separate boards with tall components near the score line (up to 0.800" from the top of the PCB). Panel insertions limited to the score line, preventing operator errors. In two models; for boards up to 10" and 13", respectively.

Fancort Industries, fancourt.com

Hysol QMI536NB non-conductive PTFE-filled paste is for stacked die applications that require extremely low stress and robust mechanical properties. Can be used on all levels of a stacked die, enabling the qualification of a single material. Is said to eliminate provide very low resin bleed and very fast cure. Can be used on solder resist, bare silicon and multiple die passivations. Is lead-free compatible, showing no reliability issues or material deterioration even when processed in higher temperature environments. shows high resistance to delamination and popcorning after multiple exposures to 260°C reflow temperatures.

Henkel, www.electronics.henkel.com 

PRO 2 Tdp is a tabletop assembly cell that may be used for low- to mid-volume manufacturing operations that require an LED component be picked, placed and soldered onto a PCB or substrate. The onboard dispensing head also can place a dot of thermal paste or silicon adhesive between the PCB and LED prior to attach. The robot selectively solders with twin irons attaching each side of the LED simultaneously. Dual automatic solder feeders, pre-heat plate and thermal loop feedback are standard.
 

 
Bench length and height depends on the specific process, but standard floor-to-tabletop height is 30 in. Standard widths are 2-1/2 in. over nominal 3, 4, 5, 6, 8 increments and the interior depth (interior table or working space) is 21.5 in. Overall cabinet width, depth and height will depend on the size of unit chosen.
 
Clean HEPA-filtered air flows outward from the cabinet. This horizontal laminar flow air washes out particulates and prevents contamination from entering the clean work zone. The cabinet features “clean edge” construction that puts the hood and tabletop in shear with the media edge of the HEPA filter to reduce turbulence along the sides of the hood, improve laminar flow and prevent contamination infiltration around the perimeter of the hood. 
 
Top and bottom front grills recirculate the air within the bench. Provides recirculating temperature control to within ± ½ºF.  Can operate at or above ambient using make-up air for cooling, or it can have an air conditioning unit with reheat for temperature control at or below ambient.
 
 Clean Air Products, www.cleanairproducts.com

Model 2200-245-051 Tip-Seal dispense valve is for precision dispensing of low- to high-viscosity flowable materials. It is also used in high-speed stitching or repetitive on-off applications where short segments of material are deposited onto a surface.
 
The zero-cavity design helps dispense solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Sealing at the tip prevents material from hardening in the nozzle, oozing or dripping. The valve opens and closes its material passage at the tip of the nozzle to precisely start and stop material flow.
 
Pneumatically actuated, the valve has a carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals to extend valve life. The stroke adjuster can set the needle opening to change material-flow rates and bead-profile sizes.
 
The valve’s precision dowel and screw holes allow easy and accurate mounting. The 0.125” orifice and short 0.32” tip length (8.1 mm) enables the valve to reach into parts and fixturing. Other orifices and tip lengths are available. Material is delivered to the valve by either a metering assembly or under regulated pressure from supply tanks or pumps.
 

ENVIRON provides web systems for managing WEEE compliance for business products, and the group has launched a new customer relationship module. 
 
Hosted on the company’s Website, the system enables companies to gain feedback from its customers on product satisfaction and after-sales service. Customers wishing to use the WEEE collection and recycling system are required to complete a marketing questionnaire which is emailed to the company.  As part of the questionnaire, customers are required to enter valid model numbers to use the system.
 
The WEEE web system:
Provides a single contract to manage producer registration, in-country recycling, and compliance reporting in all Member States;
Provides straightforward collection arrangements, which the company can communicate to business end-users through their own company website;
Offers a single corporate solution that can be expanded to cover other countries;
Includes the option to pass collection costs on to business end-users;
Provides flexibility and control of future WEEE recycling arrangements, enabling companies to ensure that recyclers continue to provide competitive rates for their services, and change recyclers in individual Member States to take advantage of new recycling technologies and techniques;
Demonstrates to customers that the company is compliant with the WEEE Directive and has addressed its environmental responsibilities.  

ENVIRON, www.b2bweee.com

SEFAR LDS is a laser technology stencil imaging machine for small format screen printing applications. With imaging capabilities between 1700 and 2400 dpi, it reportedly creates precision stencils that adhere to high quality standards, perfectly placed on each screen to ensure consistent color-to-color registration.
 
Available in two configurations: 1330 (max. screen size 15.5 x 17.5 in. – developed for the optical disc market) and 4060 (max. screen size 25.5 x 27.5 in.). Both systems are said to increase productivity (by removing several prepress steps from stencil making through on-press registration) and reduce costs by eliminating time and expenditures associated with conventional film imaging processes.
 
Sefar Printing Solutions, sefar.us.

Christopher Associates announced significant breakthroughs in performance of the NSpec AOI system. With a universal data converter, an enhanced and extensive parts library, and significant performance improvements, programming/debugging time has been reduced by 50% or more depending upon program specifics. Inspection speeds have improved and defect detection capabilities have also been enhanced. The programming speed improvement can be applied to all 3,500 NSpec systems in the field by a simple software update.
 
Using LED lighting and a telecentric lens with a high resolution color camera, the latest model, the DL, can inspect components, solder joints, full color inspection, 2-D solder paste, text, and 01005 components.
 
Christopher Associates Inc., christopherweb.com

Thermo Electron’s NITON Analyzers business unit has released new software with additional features and benefits to assist with RoHS compliance.
 
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
 
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
 
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
 
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.