SJ7 Mini solder bars build on properties of the SJ7 solder alloy. Are approx. 110 mm long, 8 mm wide and 5 mm high; said to be ideal for small dipping pots and solder fountains. Yield results for applications involving harsh environments, thermal cycling and high strain. Said to feature improved tensile and creep strength, time to rupture, wetting capabilities and yield.

Almit Technology, www.almit.com

The M22XDL-350 desktop AOI features a small footprint and is for inspecting PCBs, including SMT and THT components, reflow and wave solder joints, and solder paste. Introduces three-pulse wave modulated LED light sources and up to six different lighting combinations. Enhanced by Rep 22X Statistics and Repair Desk Software. Monitors inspection process in real-time while visualizing collected data. Features 24-bit color imaging. Reportedly overcomes limitations of 8-bit greyscale imaging.

Marantz Business Electronics, www.marantz.com

 
Cooper Hand Tools, www.cooperhandtools.com/weller

Virtual Panel Carrier centers substrates and is said to enable multiple component support and alignment during screen printing and all subsequent assembly processes. Enables alignment once; reportedly no further adjustments are required. Design consists of a base carrier with a consumable foil. Said to provide stability, centering and alignment capabilities required to process substrates or components in a single panel. Parts are placed manually or loaded with a placement system. Substrates are held in the carrier via a patented four-sided tensioning mechanism. Parts are referenced using two global fiducials. Is scalable.

SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool. 

Ansoft Corp., www.ansoft.com/siwave

 

SMP300 screen printer has a three-stage conveyor to eliminate additional buffer units. Features a patented clamping process to ensure the board is in the proper plane. Uses two CCD cameras to view and teach fiducials for aligning the board to the stencil within ±0.025 mm. Has a closed-loop, pneumatically controlled print head, and comes with 2-D post print inspection and automatic wet or dry stencil cleaning. Prints for 01005 pads.

Samsung Techwin, www.samsumg-smt.com
Dynatech Technology, www.dynatechsmt.com
 

The Niton XL3 Series third-generation handheld XRF analyzer is said to provide the fastest solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers. Typical time for routine solder screening measurements is said to be less than 5 sec. Features a 50 kV, 2W x-ray tube. Comes in a range of configurations with an assortment of optional features and accessories; quick screening to simultaneous measurement of up to 25 elements in a sample. Offers component testing; solder analysis; populated PCBs and finished goods; hi-reliability screening.

Thermo Fisher Scientific Inc., www.thermo.com/niton

The Symbion P36 Plus AOI features 3-D and 2-D detection and is said to provide 100% volumetric solder paste inspection accuracy. Enhanced with latest architecture and high-powered processing capabilities. Includes process control software. Has central data hub where all relevant data are stored. Automatically links post-reflow AOI inspection data with solder paste inspection data and SPI results with paste printer machine events. Alerts when processes are out of operator-defined parameters and can stop a related machine.