Practical Components announces the availability of dummy versions of Amkor’s new Dual Row MLF (MicroLeadFrame) package. With two rows of lands, for devices requiring up to 164 I/O.

Corelis has added direct I2C and SPI-based device programming capabilities for the ScanExpress Boundary-Scan System that employs JTAG controllers. SPI and I2C interfaces are independent of the JTAG test interface; the user can use the same JTAG controller to test the board and perform direct programming of serial EEPROM and flash memories without removing the JTAG connector or switching to a dedicated SPI and I2C programmer.
 
The user needs only to enable the direct programming option on the Test Programming file Generator (ScanExpressTPG) to create the SPI and I2C programming files. The programmer automatically detects the file type and programs the device using either the SPI protocol or the I2C.
 
Serial FLASH/EEPROM devices can be programmed at speeds up to the device theoretical programming time. This typically 10 times faster than programming the devices indirectly using JTAG. Programming capability allows versatile I2C and SPI device access.
 
Customers can upgrade their old controllers to include the new direct programming feature.
 
Corelis, corelis.com

Easyteach is a software tool that makes selective soldering set-up fast and simple. An operator uses a simple graphic image of the assembly – a JPEG or flat scan – to program the soldering sequence for any assembly in a matter of minutes with a few mouse clicks.
 
Anyone who can use a photo-editing program, or layout a newsletter, can master ‘Easyteach’. No specialized CAD tools, sophisticated training or computer programming abilities are needed. Begins with a simple graphic image of the PCB that will be soldered. The user selects fluxing and soldering points on the image, clicks to mark the fluxing and soldering points, and the program automatically sets up the fluxing and soldering sequence in minutes.
 
Sets of sequences can be copied or duplicated for multiple boards, and the program automatically calculates the path and sequence for the soldering points. The operator marks the sites to be soldered and indicates the board’s outer dimensions.
 
Part of mySelective 6745, an in-line capable, compact, modular selective soldering system for medium volume, high-mix assembly. Features precision flexible robotics, optimized product handling and a compact footprint. Preheat modules and fluxing units can be added. Incorporates an IR preheating module, dropjet fluxer and SelectWave nozzle.
 
Vitronics Soltec, vitronics-soltec.com
 

AkroMetrix will display its latest product, the LineMoiré automated flatness measurement system, Model J5000, at Semicon West booth #8301. 
 
The high-speed, full-field shadow moiré technique allows for flatness measurement of chip-carriers/substrates, packages and ICs in JEDEC (or similar) trays. Can measure the full contents of a tray simultaneously (with one-sec. data acquisition time per tray), has integrated tray stack/destack and part sorting capabilities. Can measure stacks of trays, replace “bad” parts (i.e., parts that fail a user-specified warpage specification) with known good parts, and then stack good and bad trays separately. This is important for incoming/outgoing inspection of parts.  Enables flatness characterization before any value added processing is performed.
 

COMET has added an upgrade to its Feinfocus Cougar X-Ray platforms: Computerized Numerical Control (CNC). This enables operators to program and automate x-ray inspection procedures, as well as perform 2-D measurements of hidden details during failure analysis without the need for calibration.
 
CNC provides numerous benefits, facilitating an efficient failure analysis process. With the ability to program the manipulation system of the platform, CNC can automatically position the optical overview camera in the optimal position for inspection. Operators can even program the entire inspection process with CNC, including x-ray parameters and image processing, eliminating costly variables associated with manual control. User-friendly “teach-in” buttons enable easy programming.
 
The platform provides x-ray inspection for a range of inspection needs, from 2-D failure analysis of manufacturing components to advanced 3-D imaging of complex BGA and wafer-level packages. Has a small, ergonomic design, small footprint (approximately 1 m x 1 m), low system weight (approx. 1,450 kg) and convenient front- and side-door service access. Includes a microfocus x-ray tube up to 160 Kv, standard 5-axes manipulator with Auto Isocentric Motion (AIM) Technology for oblique viewing, CNC Capabilities, HDX-Ray real-time 16-bit image processing, digital flat panel detector and a hardware-driven anti-collision system.

PCB Probe Kit provides new or additional test points on PCBs. Engineers attempting to debug an existing system will find this tool useful for hands-free probing and viewing signals on a logic analyzer, oscilloscope, meter or other instrument. 
 
The following components are included: arm probe with a heavy base, spring loaded tip, rotatable head and fine vertical adjustment knob for precise positioning to adjacent test points; small lead clips enabling quick connection to SMD leads from 0.5 to 0.2 mm lead pitch; large lead clips for connection to leads from 1.25 to 0.3 mm lead pitch; SMD clips in four sizes (0201, 0402, 0603, and 0805); SMD clip support with guide wire; and an integrated magnifying glass with tweezers.      
 
OptoTherm, optotherm.com

FLIP Solder Bath for lead-free reflow soldering features linear induction pumping technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming’s left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in selective soldering systems.            
 
Features advantages over other solder bath systems, including less solder used (300 kg, instead of 450 kg) and less solder dross (7 kg vs. 15 kg), after 8 hours of operation.This results in less waste. This feature uses one third less solder for cost savings. Offers ease of maintenance — open space to access inside bath – and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized — no motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated and a quicker response results.
 
Tamura H.A. Machinery, tamura-ha.com

Omnify 3.0 enables efficient collaboration in product development and helps companies meet RoHS compliance. Meets compliance objectives for such companies as LuminentOIC, Agfa and Mangrove Systems. 
 
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
 
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
 
Improvements include:
Accelerated performance for faster BOM loading, saving, releasing changes and searching;
Vendor part composition fields allowing unlimited vendor attributes;
Enhanced permissions offering extended field/attribute and project level permissions;
Improved document vaulting and new caching options;
Attribute Groups for easy field navigation;
New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields;
Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters;
XML file formats enabling easy importing and exporting of item and database schema information.
 
Omnify Software, www.omnifysoft.com

 

 

 

Visitors to DEK’s booth at Semicon West show will see live demonstrations of the company’s DirEKt Ball Placement process. Utilizing two in-line Micron-class platforms, this technology enables the placement of solder balls as small as 0.3 mm in diameter onto substrates or wafers at repeatable first-pass yields better than 99%. The first in-line system, a Europa, uses flux imaging technology to deposit flux precisely at each interconnect site.  The second machine, a Galaxy, then uses a fully enclosed ball transfer head capable of holding up to 50 million solder balls to guide each solder ball directly to the surface of the stencil and seat each ball in the flux. Process cycle time is fast, regardless of I/O count.
 
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm. 
 
DEK, dek.com
Semicon West Booth #7139

CSS4050 SMD Tower can store up to 546 reels and trays protected against electrostatic damage in an area of 1 sq. m. Each component can be stored or taken out in less than 10 sec. Can prepare a complete batch with one mouse click; saves search and setup time.
 
Storage is reportedly easy and secure. Each reel and tray is characterized by a bar code. The operator puts the container on the input/output plate, where bar code and dimension are automatically checked. A robot picks up the container and stores it in a free place. Components that are often moved will be placed in an easily accessible area.
 
Control software takes over all storing tasks. It supervises the stock and ensures the “first in first out” principle. Each component can be assigned to a moisture class (IPC-Standard 033A) and the allowable operation time in a wet surrounding is controlled. Offers a variety of statistical functions and can include external storage places.
 
Within the Tower, sensitive components are secure. The materials in use guarantee full electrostatic, temperature and moisture protection.
 
Can be used in low- or high-volume production. If batch sizes are low and changeovers are frequent, the automatic storage system saves time and reduces search trouble. Can be expanded with additional SMD Towers. The database can be connected to existing ERP systems or to MIS optimization setup software.
 
ESSEMTEC, essemtec.com
           

ELC-200 applies labels on PCBs or final products, and can print barcodes in 1- and 2-D onto PCBs. Operated by PC control, features an extruded aluminum frame with painted vanity panels and a transparent cover.
 
Features the ability to handle PCBs from 50 x 50 mm to 330 x 250 mm, three-color light tower lamp with audible alarm, conforms to SMEMA Spec.1.2, mechanical front stopper and clamper, and more.
 
Has a maximum fixed conveyor speed of 200 mm/sec., and a maximum processing speed average of 8 sec./label. With a 15" LCD monitor, the system features left to right travel with the front rail fixed, labeling head rotation of 90°/180°, and attaches by vacuum pick-up and blow. Robot control on the x-axis is 600 mm and 400 mm on the y-axis, and cylinder control is 300 mm on the z-axis. The label printer is a 300 dpi Zebra 110X13.
 
Printer features include a maximum print area of 99 x 100 mm, 300 dpi resolution (12 dots per mm), 22 kg weight and the following media specs: label and liner width of 20 to 114 mm, and ribbon width of 20 to 110 mm.
 
Options include a barcode reader, a 15" LCD touch-screen monitor, ESD grounding receptacles, auto-Z axis adjust, auto-width adjust and a 600 dpi printer.
 
Eunil H.A. Americas, eunil.com