The Handheld Laser-Focus Camera System for small-spot testing captures a digital picture and test results for compliance RoHS screening tests in an XRF Analyzer. Isolates test areas by placing a test spot down to 3 mm diameter and displaying the image and sample target on the color PDA screen in real-time. Ideal for evaluating non-homogeneous parts such as PCBs where the beam can be focused on a small component, solder joint, lead or terminal. Can switch from collimated pinpoint to full-field analysis. Snapshot images of samples analyzed plus laser-targeted small-spot analysis are saved in test records. Said to measure up to 25 elements in a single test. 
 
Innov-X Systems, www.innov-x-sys.com

 The X-50 Mobile XRF tests Cd to 1 ppm in many sample types, 10 ppm in alloys. Ideal for RoHS Packaging Directive, which requires sum of Cd, Hg, Pb, Cr less than 100 ppm. The Inspector Series XRF tests Pb content in solder and parts. Alerts users to banned metals using pass/fail criteria and documents total Cr, Br, Pb, Hg, and Cd. Angled front display plus rear display for easy viewing of test results; no wipe tests; said to eliminate the liability of isotope control, improper use, theft and disposal.
 
Innov-X Systems, www.innov-x-sys.com

Hawk Micro XRF benchtop analyzers deliver identification and elemental analysis from Ch to U. Use collimated beam of 13 to 0.2 mm diameter, with laser beam focusing. Ideal for testing small or nonhomogeneous samples. Applications include RoHS compliance analysis for electronics, PCB and components. Reportedly can perform standard-less quantitative analysis with statistical accuracy. Movable X-Y stage affords precise measurements across samples. A color CCD camera enables digital snapshots with magnification of up to 68X; combined with the laser spot tool, enables digital pictures to be analyzed and stored. Includes a large testing chamber, X-ray tube source and Si PiN-diode detector interfaced to a PC. 
 
Innov-X Systems, www.innov-x-sys.com

The SolderStar PLUS is the latest Neptune USB data logger. The system adds an integrated high-speed USB interface. Reportedly offers easier connectivity, speedier offloading of data and simultaneous rapid charging of the high temperature on board battery. Is ready for use.
 
SolderStar, www.solderstar.co.uk   
 

The WaveShuttle PLUS enhances the use of the SolderStar 4 & 6 channel Neptune data loggers for the wave soldering process. Additional software tools are included, along with a wave soldering fixture and second heatshield, allowing comprehensive testing of both reflow and wave soldering processes with one device.
 
SolderStar, www.solderstar.co.uk
 

The RD52 inline vapor phase reflow oven is for high-volume production and inline processing. Features adjustable pin chain conveyors, a four-zone preheat section, horizontal reflow position and left to right product flow. Provides touch-screen operation, fully integrated controls, SMEMA upstream/downstream interface and bar code capability. Offers a working envelope of 18 x 15" with a product clearance height of 1.5", using an adjustable pin chain conveyor for dual-side board capability; a 5.7" high-visibility touch-screen display for easy operator use, post-reflow cool down zone, and a working fluid auxiliary tank and filter system.
 

 

MicroPILR platform has low-profile, pin-shaped contacts that replace solder balls on semiconductor packages and plated vias in package substrates and PCBs. Benefits reportedly include reduced profile, fine pitch, improved electrical and thermal performance, and enhanced reliability. Pins can be used as internal or external interconnections in a variety of applications, including the interconnection between semiconductor die and package substrates, semiconductor packages and PCBs, the layers within package substrates, and PCBs to PCBs. Can be formed directly onto substrates and are typically nickel/gold plated copper. Range from 25 to 175 microns in height and 40 to 200 microns in pin tip diameter. Is capable of enabling contact pitches to 100 microns in a die-to-package substrate; in package-to-PCB applications, pitches to 0.3 mm or lower; and within package substrates, pitches of 150 microns or lower. Specific device applications include high-density stacked flash, DRAM and SRAM; logic plus memory packaging; and stacked and mobile memory packaging. 
 

The PMT400 rework system is designed for rework of microBGA, BGA, CSP, SMT, MCM and PTH assemblies. Proprietary Windows-based X-PC Advanced Process software provides GUI, featuring intuitive programming and Teach Mode profiling. Is Pb-free capable. Features precision gantry motion and a standard two-zone IR bottom heater. Provides performance in a small 28" sq. footprint. Includes a six-nozzle starter, network data management (XP Pro), real-time thermal control (external TC), automatic retract optics and an automated component pickup nest. Can handle 0.010" minimum component size, and offers a 2" sq. field of view, as well as 2" top- and bottom-side clearance. Provides 1 kW focused convection top heater and 14 x 20" maximum board size with 1.5 kW IR bottom heater.
 
VJ Electronix, www.vjelectronix.com
 

For low-profile IO applications, this surface mount SIP socket strip is assembled parallel to its board surface. Ideal for placement near the board edge for easy access test connections and creating pluggable adapter modules, which can sit perpendicular to the motherboard. The brass alloy receptacle press-fit accepts mated pin diameters between 0.025-0.037" and 0.025" square posts. This socket is rated at 4.5A per pin position. Suitable for reflow soldering operations. Standard configurations are available from 2-10 positions with a 0.005" coplanarity rating. 
 
Mill-Max Mfg. Corp., www.mill-max.com

The Aerial flying probe is based on Viva Integrated Platform core hardware and software. Is said to be for testing prototypes, samples and small-to-medium production runs. Uses four independent mobile test probes, which reportedly enable simultaneous double-sided testing. One Touch Per Net technique characterizes nets and identifies faults on subsequent boards, executing additional tests at the same time. Data collection and statistics functions come standard. Is compatible with Pilot flying probe, Strategy ICT and Valid functional testers. Firefly concentrates power and control of laser technology into automated selective soldering. Thermal control said to be guaranteed by an integrated temperature control system that provides continuous feedback during the soldering process. A CCD camera is included for optical inspection for testing component presence/absence and orientation. 
 
Seica Electronics, www.seica.com 
 

The USB-1149.1/4E is a USB 2.0-based boundary-scan test and in-system programming controller. Offers board testing and in-system programming of CPLDs, FPGAs, and flash memories at full theoretical programming speed. Delivers test vectors at a sustained test clock frequency of 100 MHz. Includes direct I2C and serial peripheral interface-based device programming capabilities. The SPI and I2C interfaces are independent of the JTAG test interface. Features automatic signal delay compensation for long cable runs to the UUT, slew rate control, adjustable input thresholds, software controllable signal pin reassignment, and eight analog channels for measuring target supply voltages or other signals up to +5VDC.
 
Corelis, http://www.corelis.com