Elpeguard SL 1400 ECO-FLZ one-pack conformal coatings reportedly exhibit optimum climatic protection at high temperatures and humidity (85°C/85% relative humidity). Have standard layer thicknesses of approx. 30 microns. Said to initially cure physically and then by reacting with humidity. Said to be colorless, transparent conformal coatings based on chemically reacting polyurethane resins. Reportedly have high solids content and are free of aromatic solvents and heavy metals. UL approved as “permanent coating.”

A comprehensive line of end-to-end RFID solutions includes RFID tags, inlays, readers, antennas and software. The RFID labels and tags are available in molded, removable and self-adhesive styles. Are suited for rugged use in harsh environments, including aerospace, defense, transportation, and medical applications. Also offered: ruggedized system-level solutions encompassing UHF, HF, and LF technologies for readers and antennas.

Tyco Electronics, www.tycoelectronics.com

The Analyst fcs ICT directly accommodates bed-of-nails test fixtures built for Agilent 3X7X-series
in-circuit test systems. A fully-equipped, four-module Analyst fcs costs about $150,000.

Allows users to use existing Agilent fixtures directly. Boards not requiring digital vector test are tested on their
original fixtures using the Analyst tester, which has built-in "headroom" for power-on test, boundary scan, and ISP device programming. The tester accepts 1-, 2- and 4-module 3070-style bed-of-nails test fixtures. The system can be equipped with up to 5184 points and supports available Agilent Device Under Test power supplies.

CheckSum, www.checksum.com

DES PLAINES, IL – PCB Libraries Inc. has released a free IPC-7351 land pattern calculator that reportedly generates results that match the LP Viewer library documentation.

The calculator is a scaled down version of the LP Wizard. It calculates CAD library parts that comply with the latest IPC-7351 revision. It relies on the data underlying the IPC standard, which includes fabrication, assembly and component tolerance-based mathematical algorithms.

IPC-7351 uses calculations that represent a change in the way land patterns are defined, developed and categorized. It is published by IPC, Association Connecting Electronics Industries.
 
“We’re pleased to be working with IPC in a unified effort to provide PCB designers worldwide with access to our IPC-7351 CAD libraries and LP Software tools," said Tom Hausherr, CEO and director of technology at PCB Libraries.
 
Visit www.PCBLibraries.com to download the calculator.

The SM321 pick-and-place machine is said to assemble up to 21,000 cph at ±50 µm accuracy, based on IPC-9850. It places QFPs and BGAs at speeds up to 5,500 cph at ±30 µm accuracy. Handles boards up to 20 x 24" at production speed. Comes with high-resolution flying vision system and enhanced board handling capabilities.

Has a low mass head mechanism with high speed motor to deliver a stable motion platform for consistent, on-target placements. The board transport system features an enhanced drive system with a flat handling system to safely move large PCBs and thin, flexible substrates. Is configured for Samsung SM Series slim format tape feeder system; handles EIA-481 tape sizes, and holds a maximum of 120 8-mm feeders. Tape feeder monitors inventory on the supply reel and notifies before replenishment is needed. A one-touch clamping feature permits users to replace tape feeders during operations, while the system's endless-discharge method for non-stop operation provides efficiency, reliability and repeatability of component pickups. Performs complete lot tracking and inventory management, and automatically optimizes placement sequence.

Samsung Techwin/Dynatech Technology www.dynatechsmt.com

The Pyramax 125 Air solder reflow oven is optimized for lead-free processing. Has an ergonomic design that provides easy access to all maintenance points, maximizing uptime. Thermal performance is achieved by precision control of critical thermal processing variables. Uses novel Closed Loop Convection Control to control heating and cooling. Constant heat transfer optimizes process control flexibility, and improves process repeatability from site to site and line to line. Features side-to-side recirculation, which enhances temperature uniformity, user-friendly Windows-based WINCON® oven control software, a wide range of flux management options, advanced conveyor solutions and smart tracking SMEMA.

BTU International, www.btui.com

The SVS Ascent platform is for in-line, 3-D SMT inspection of solder paste depositions and component placement process control. Handles boards up to 20 x 24". Features an all-solid-state laser scanning platform with a reported 8 MHz data acquisition rate, all digital processing, and 8X oversampling. Analyzes data pixel by pixel, without merging or blending areas of acquired data. Said to permit panel setup from CAD data within 10 minutes and to detect flaws in volume, area, height, x/y position, coplanarity and bridging.
 
GSI Group, www.gsig.com

 

The Brave-Mission Message Broker Service reportedly provides a test environment for message service compliancy and verification that the device is sending and receiving CAMX messages of correct form and consistency. The Internet-based prototyping service is free, and for those who want to attach a machine to a live message broker before integrating in a production line, or who want to gain IPC-2501 experience. A test copy of Bomber-Mission, a CAMX Client simulation tool from its eX-Mission Solution Suite, is downloadable from www.ex-mission.com. 
 

The X1 automated x-ray inspection system automatically analyzes images of solder joints to detect structural defects. A typical inspection program is said to be created in fewer than 30 min. Uses a standard package library. Said to offer high defect detection, fast throughput and low false calls. Remote programming and real-time SPC software provided. 
 
YESTech, www.yestechinc.com
 
  
 
 

Board Station XE leverages customers’ existing IP, such as libraries, design data, and design capture infrastructure. This extended design flow is added to existing Board Station design environment. Said to offer the productivity design features found in AutoActive placement, routing and manufacturing environment; integrated access to the Topology Planner/Router and XtremeAR and XtremePCB applications. Said to leverage Board Architect schematic capture tool and is integrated with Library Management System (LMS), DMS (Data Management System), I/O Designer and the Constraint Editor System (CES).  Also integrated in the flow are ICX Pro, ICX, HyperLynx and Quiet Expert.
 
Mentor Graphics, www.mentor.com
 

The FS2500N flip chip packaging system is reportedly capable of aligning and bonding at 1.7 sec. per chip at 2 micron accuracy. Underfilling chip with gaps of 14 microns has reportedly been demonstrated in production volume with zero voids. Said to be capable of bonding via thermocompression by pulse heating head, thermosonic by 50 KHz ultrasonic system, Au/Au, Au/Sn and solder. Reported chip sizes of up to 20 x 20 mm with more than 800 bumps and pitches of less than 40 microns.
 
Toray Engineering Co., Ltd., www.toray.com
 
 

CadStar Express includes all the latest features of CadStar 9.0, with a limit of 300 pins and 50 components. A back annotation function is said to smooth file transfer from PCBs into schematics, assisting in ECO management -- particularly those associated with high-speed designs. A Do-It-Yourself booklet was created to guide the user step-by-step through the solution using design examples. The free tool can be downloaded at www.cadstarworld.com/express.
 
Zuken, www.zuken.com