Adding to its series of recently introduced optimized material sets, Henkel has announced a materials combination designed for stacked CSP (SCSP) devices. Uniting die attach material Hysol QMI536NB with mold compound Hysol GR9820, this material set reportedly delivers JEDEC Level 1/260° reflow performance.
 
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
 
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.  
 
Henkel, www.electronics.henkel.com

CTS Connect air-actuated internal or external connectors for effective sealing on smooth, rough or threaded circular features of a part create a tight, long-lasting seal. New leak test accessory products include:
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
 
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
 
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
 
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540

Eunil H.A. Americas has added the PARMI SPI 3-D paste inspection system to its product line.

The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.

Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.

Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.

440-R SMT Detergent is available in a ready-to-use spray bottle for safe, effective manual cleaning of SMT stencils and related tooling.  The stencil-cleaning chemistry  is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program. 
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly.  Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user.  This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning. 
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027

Speedline Technologies has added a chemical isolation option to its Accel MicroCel S2 centrifugal cleaning system. This platform enhancement improves existing zero-discharge systems and extends the life of mixed-bed deionizing resins.   

The open programming platform and interface are said to make the chemical isolation option simple to set up. The system can be configured as a complete on-board, internal closed-loop recycle system, and as such the option can reduce operating costs. 

The chemical isolation option will help minimize the amount of residual chemistry carried from the process chamber to the rinse vessel. The system can then reprocess the used rinse water through the internal closed-loop recycle system without contaminating the mixed bed deionizing resins, then recharge the rinse water to its previous deionized state.

Speedline Technologies, speedlinetech.com

FEINFOCUS HDCT-FOX  2-D/3-D x-ray inspection system combines high-resolution 2-D X-Ray technology and enhanced 3-D computed tomography techniques with Feinfocus HDX-Ray technology for inspection and analysis of complex electronic devices in the third dimension. For thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects and hybrids.
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.

Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.

Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.

COMET, comet.ch

UV40 UV curable conformal coating is for high-volume automotive and consumer electronics manufacturers who want the rapid cure of UV products, but require the processing ease of their current coatings. Maintains the speed of cure and environment-friendly chemistry required for electronic fabrication.

Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.

Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
 
HumiSeal, humiseal.com

DEK has developed an equipment and tooling package that coats wafers with ultra-thin die attach materials down to 25 microns in thickness with tolerances of +/- 7 microns using a printing process.
 
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
 
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
 
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.
 

MFR Soldering/Desoldering systems offer assembly companies a solution tailored to their needs, whatever their size, manufacturing volume, product complexity and budgetary constraints.
 
MFR-DSI and MFR-DSX Systems for desoldering, comprise a compact bench-top MFR power supply and its desolder gun. Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench. MFR/DSX uses compressed shop air, making it powerful for high-volume desoldering tasks.
 
Add soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.
 
All four packages use lightweight hand-pieces.
 
The handle of the desoldering tool is fully adjustable from “gun” to “pencil” position, for operator comfort. Incorporates a reactivation switch that senses when it is in use, and that works with “Auto Standby” and “Auto Off” functions to save on energy usage and prolong tip life.
 
Large-capacity chamber that catches molten solder during desoldering is made of thermal plastic and contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution. Fume filter traps solder fumes that can harden on cooling and block pumps.
 
Press-fit desoldering tips make changeovers easy. The operator simply handles the tips using a heat-resistant cartridge removal pad. Includes long-reach geometries for access to high-density areas on the PCB.
 
All soldering/desoldering tips are driven by SmartHeat technology, which senses the amount of heat energy needed at the pad.
 
Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in ‘standby’ or ‘off.’ Will flag when the system or a tool are not grounded, and the unit will shut down. 
 
Power units offer two ports to which any of the tools can be attached; for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.
 
OK International, okinternational.com          
 

LMS6000 is a fully functional, closed loop, ytterbium-doped fiber laser system capable of marking a variety of flat label materials and direct marking on specific metallic and plastic substrates. Includes an in-line mark grading system with error detection capability. Features reel-to-reel transportation with integrated fume extraction and vacuum hold-down of the material being marked.
 
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m² marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
 
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
 
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
 
Tyco Electronics Corporation, www.tycoelectronics.com

The electronics group of Henkel has introduced a new process, Accelerated Cooling (AC), to be used with its two flip-chip in package non-conductive paste (NCP) underfill encapsulants. The NCP materials, Hysol FP5000 and Hysol FP5001, provide moisture resistance, thermal cycling resistance, expedite the assembly process and are designed for Pb-free interconnects.
 
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning. 
 
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
 
Henkel, electronics.henkel.com

DataFlex Plus thermal transfer overprinter (TTO) provides on-line printing of variable and real-time data, such as expiration dates, batch/lot codes, ingredients/parts listings, bar codes and logos.
 
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
 
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
 
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.