The Medalist SJ50 Series 3 automated optical inspection system improves ease of use, throughput, component location and supportability over the previous generation and can handle 01005 components.

Includes algorithms designed to bring greater image clarity to low-contrast components, for better defect analysis. The image clarity results in lower false-call rates and improved defect detection.

Is ergonomically advanced with significant user and system interfaces. Can be deployed in a 2-D paste, pre-reflow, mixed-mode and post-reflow environment while quickly converting the optics head for inline 3-D solder paste inspection.

Links to downstream repair stations and statistical process control.

Agilent Technologies, www.agilent.com/see/aoi.

Cadstar 9.0 desktop PCB design software features major usability and flexibility enhancements, along with functionality for adopting new technology. Improvements include graphical representations of every function assignment, making the tool both easier to work.

"Trunk" routing functionality, within P.R.Editor XR, can now swap equivalent pins quickly and easily to improve routability. The report generator, post drill files, DXF post processing, general menu and tool bars have been made more user friendly. Back annotation function has been enhanced to make file transfer from PCB design into the schematic smoother and simpler.

Cadstar SI Verify, which offers a complete post-layout signal integrity simulation toolset with seamless integration into Cadstar, also features many new functions for ease of use and accuracy. This includes upgrades to the via modelling function, to provide more in-depth analysis details and user defined n-port circuit models to take into account components such as filters and ferrite beads. Both of these enhancements are also supported by Scenario Editor, a “what-if” simulation scratch pad.

Zuken, zuken.com

The latest addition to the Helix automated device programmer has the same dph and is based on the Helix-TU-10 design. As a desktop automated system, the Helix comes standard with two precision-designed tray input and output handling systems with a reject location.The tray version uses the same core programming technology and socket modules as standard automated lines. The pressure plates are exchangeable between the two units. Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability, which permits programming of up to four devices simultaneously per site.

Handles such packages as MSOP, SOIC, PLCC, SSOP and TSSOP.

A tray-only version will be available at a later date.

BPM Microsystems, www.bpmmicro.com.

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The GEM Series tabletop AOI comes with new easy-to-use iPro√ software with a new graphical interface said to be easier to use. The software guides users on setting up inspection parameters, resulting in improvd productivity and less training time.

Also, coverage of the Ultra 850G system has been expanded to wire bond and die placement inspection. Flying Color Technology has been added to broaden the defect coverage and lower false rejects.

Machine Vision Products, www.machinevisionproducts.com.

The Quadrus Mini ESD-safe miniature fixed-mount imager is for reading codes on sensitive components without discharging static. Can be safely and easily integrated into ESD-sensitive assembly processes. Has a nickel coating and ESD-resistant labels, and requires no aerosol coating or restrictive mounting distances. Permits close-range reading of static-sensitive parts and components. Features a megapixel sensor and powerful algorithms for reading long bar codes and high density 2-D symbols in any direction on multiple surfaces. Autofocus, EZ button setup, and Good Read green flash provide exceptional ease of use.
RoHS/WEEE compliant.

Microscan, microscan.com

The KE-2080 high-speed flexible mounter is a sixth-generation multi-purpose mounter featuring six nozzles that have a laser alignment and an additional IC head for fine-pitch components. The system has a reported IPC-9850 speed of 15,400 cph, 23% faster than its predecessor.

Handling ranges to 01005 placement capability (0402 in metric) and up to 33.5 mm sq. The LNC60 laser align sensor, which includes laser-centering placement capability for most 1.27 mm pitch BGAs and an optional placement load control, can measure six parts simultaneously. Step motors control the input and output buffer conveyors, enhancing speed. Data, feeders, nozzles and floor trolleys are interchangeable with other Juki lines. Comes standard with a new axes control system, which means more motors on the pick-and-place head but fewer cables. Conforms to RoHS.

Juki Corporation, jas-smt.com

Mentor Graphics released of the latest version of its Board Station design flow for large, enterprise customers. The Board Station flow includes tools for design creation, layout and manufacture, and is for enterprise design teams.

The release offers improved integration with the enterprise, as well as improved design productivity and 'what if' signal integrity analysis. New feature include:

• Library and data management -- Tighter integration with DMS and added functionality to provide off-the-shelf RoHS design-for-compliance capabilities.
• Constraint editor system -- Addition of electrical rules entry, layout and analysis functionality to complement the high-speed physical rules already provided.
• Signal integrity verification -- Addition of the newly released ICX Pro Explorer functionality to the flow, Mentor's high-speed constraint development tool.
• Design layout -- Significant productivity enhancement capabilities including additional support for layout of flex boards; trace glossing so designers can more closely control interactive routing on dense designs; hard and soft autorouting "fences" to help control routing around dense BGAs as opposed to through them resulting in higher routing completion rates; additional gate and pin swapping capabilities to optimize layout.
• FPGA-on-Board -- Improved integration of I/O Designer to accommodate high pin count, high performance FPGA implementation.

Mentor Graphics, mentor.com

Practical Components, the supplier of dummy components, has added Amkor Technology's PoP (PSvfBGA), a stackable very thin fine-pitch BGA package. 

Also new is Amkor's tsMLF (Thin Substrate Micro LeadFrame-TAPP), a sub-100 micron flip chip test die, and the redesigned Cookson, Indium and AIM print test boards and kits.

Also new is Amkor's CVBGA very thin ChipArray BGA.

practicalcomponents.com

VJ Electronix is releasing an update to its Summit 2200 advanced rework station. New features include:

• Automated site prep (scavenging) system that permits fully automatic, component removal, noncontact, site prep, and placement of components with minimum operator intervention.
• Automatic and vision assisted placement, which facilitates precision placement of high lead count components such as Cu-CGAs. The system uses machine vision components and software to reduce cycle times and, improve yields. The system can be fully manual or manual with visual assist to allow fast and accurate placement of components that, without this benefit, are difficult to align.
• Wide area profile storage compatibility, which permits central storage of processes and profiles. During runtime, the system checks for the most updated profile through the network and downloads the latest process file on demand or automatically. This allows a central process lab to always maintain and distribute the latest data globally.
• New bottom heater and motorized table, including a 4.0 or 5.6 kW bottom heater designed for Pb-free processes. Also new to this table design is the ability to have a bottom heater cooling boost that decreases cycle times and meets maximum time above liquidus constraints.
• Integrated technical documentation. All manuals, help files, schematics and knowledgebase troubleshooting are imbedded in the SierraMate 7.0 application software. This allows operators and engineers to access all information about the machine locally. All GUI documentation, screens, help files and reports can be localized into native languages to ease in new operator learning.

vjelectronix.com

KIC 24/7 thermal process monitoring system version 2.3.0.0 includes bug fixes, improved printing capabilities, oven communication with SEHO reflow ovens, improved alarm functionality and more. 
 
Market drivers such as OEM requests for process traceability, conversion to Pb-free electronics and more are compelling electronics manufacturers to move from a manual spot check routine to automatic and continuous monitoring of their reflow process. The software provides full process traceability in thousands of installations around the world, along with automatic profiling and SPC charting. 
 
Version 2.3.0.0 is free of charge to all customers. 
 
KIC, kicthermal.com

CyberOptics will display Process Insight statistical process control software in booth 2D21 at the Nepcon South China this week.
 
The SPC software package is based on an enterprise-level database and open computing standards. Provides complete analysis of process performance. Offers comprehensive SPC charting capabilities, is a common interface for SE 300 Ultra and Flex Ultra for data analysis and correlation. Features chart-specific alarms to signal out-of-control data and trends, and data output from an SQL database for connection into shop floor control software. Provides real-time information to operators and customers, can be integrated into a shop floor management system, allowing full traceability.
 
Features the ability to access password-protected databases, faster loading of databases from SE 300 and Flex with new XML file watcher, and improved database structure.
 
Provides updates within line cycle times to allow for real-time corrective action. Features tools to access and manage all system data to allow for historical analysis. Data output for shop floor management system integration allows users to identify trends and increase yields.
 
CyberOptics Corp., cyberoptics.com

ADS 02M offline depaneling system is designed with an X/Y/Z gantry and features a rotary table, so the operator can load a panel while the system is cutting the next one. This is said to reduce overall cycle time.
 
Visit the EASi Line for a live demonstration of the High Speed Laser Marking System ALS 03. Features code verification with 1-D/2-D scanner, FIS dataconverter and repeatability +/- 100 micron at 6 sigma.
 
ASYS, asys-group.com
ATE Booth 5201