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Atotech introduces StannoPure HSB Bright Tin Plating and Stannopure HSM Matte Tin Plating Products in the U.S. 
 
The range of pure tin processes have been developed to meet the EU directives WEEE and RoHS, which ban the use of lead in the electrical and electronic industries. While matte tin has become a favored SnPb alloy replacement option in plating connectors, bright pure Pb-free tin has not yet gained market attention in electronic applications.
 
“With StannoPure HSB, your customers can now benefit from a ‘whisker-mitigated’ bright tin electrolyte, complying with JESD 22A121.01 requirements,” said Gene Barlowe, U.S. functional electronics coatings manager.
 
Atotech, atotech.com
 
Boston, MA -- Innov-X Systems has joined with GoodBye Chain Group and NSL Analytical to present a series of online webinars to build awareness and provide information and knowledge on RoHS/WEEE Directives.
 
An hour-long meeting on June 15 at 2 p.m. EST will enable discussions with legal, technical and business experts regarding Pb-free due diligence.
 
For more info, visit goodbyechain.com/content/view/46/61/ 
Dimatix has added software capabilities to its DMP-2800 materials deposition system. Aimed at providing increased flexibility for designing printed patterns, Dimatix Drop Manager software adds the capability to print standard Windows bitmap (BMP) image files with an optional Gerber File Import (GFI) feature.
 
Martin Schoeppler, VP, strategic business development, saic, “This software release dramatically increases the complexity of patterns that technology professionals can print. Developers of jetted electronics in particular will benefit from the easy-to-use Gerber converter.”
 
The new capability allows designers to utilize image editors, such as Adobe Photoshop or Microsoft Paint, to directly edit files for precise single drop placement. Third-party conversion programs can be used to create BMP files from AutoCAD, PDF or other vector-based applications.
 
With the GFI option, DMP-2800 users can print Gerber files from all popular PCB layout packages at resolutions up to 5080 dots per inch (5 µm droplet pitch). The GFI option also includes a copy of GerbMagic, a popular Gerber file viewer and manipulation tool. GerbMagic allows rotations, mirroring, panelization and compositing of multiple Gerber images into one.
 
 
The Dimatix DMP-2800 series printer is a bench-top precision digital materials deposition system for high-precision patterned jetting of functional fluids – including nanoparticle-based metallic and organic materials – on any type of surface, such as plastic, glass, metal sheets, silicon, membranes, gels and paper.
 
The system is an easy-to-use tool to quickly develop and test processes and prototypes, as well as to conduct low-volume manufacturing of a broad range of products – from PCBs, RFID tags and flexible or rigid displays to DNA arrays, optical microlenses and wearable electronics.
 
By directly printing on their substrates, customers can develop prototypes and keep process technology in-house. Customers can fill the single-use cartridges with any type of fluidic material to perform print and deposition functions without having to become fluid jet experts.
 
Dimatix, www.dimatix.com
Cognex has added new features to its VisionPro machine vision systems to accelerate development of PC-based machine vision solutions for automated inspection and quality assurance applications.
 
“VisionPro’s new interactive tools make it fast and easy to evaluate, implement, and deploy multi-camera applications completely without programming,” said Marilyn Matz, senior VP, PC Vision. “With VisionPro, customers can maintain the power and flexibility of a fully programmable PC vision system, yet significantly reduce setup time and development cost. VisionPro provides a vision development environment with something for everyone…interactive drag and drop, .NET scripting, and a full programming toolkit.”
 
The system now offers a set of interactive tools for creating vision applications without programming:
QuickBuild environment quickly defines image acquisition, vision tools, and accept/reject criteria.
Communications Explorer sends inspection results to input/output lines and communication devices, such as PLCs or reject mechanisms.
Optional Scripting extends QuickBuild without programming the entire application.
Application Wizard automatically generates a runtime application with an operator interface in minutes.
 
Cognex Corp., cognex.com
Transition Automation will showcase Permalex SMT printing squeegee blades and holder products in booth 9-634 at the SMT/Hybrid/Packaging exhibition this week in Germany.  The products will be showcased by PB Technik, GmbH. 
 
The company is also releasing many new holder designs based on a patented pin-reference alignment system. The lightweight, feature-packed SMT blade holder allows users quick change of blades, high visibility and light mass for user comfort. The lightweight design is important to eliminate handling damage to squeegee edges.  The holder integrates a reference “window” through which users can confirm the proper seating of the squeegee blade. Can be easily updated with a new or repositioned blade, and is easy to clean and maintain. 
 
PB Technik will also demonstrate The Permalex Paste Manager, a self-cleaning squeegee system.

Transition Automation, transitionautomation.com
SMT/Hybrid/Packaging Booth 9-634 (with PB Technik)
DX-200 Series of Digital Dispenser/Controllers are affordable, accurate and repeatable micro-air dispensing systems.
 
DX-200 offers an operating pressure of 0 to 100 Psi, (0 to 6.9bar), and is configured for general dispensing applications; DX-215 has an operating pressure of 0 to 15 Psi, (0 to 1 bar), and is designed for specific low viscosity fluids. Applications range from the precision deposition of surface-mount solder paste and adhesive to semiconductor under-fill.
 
The units are supplied with a power adapter, air hose, sample tips, barrel, syringe adapter and syringe stand. Operating from a 24V DC supply, the CE-certified dispensers feature a timer range of 0.008 to 99.99 sec.
 
Specified for manufacturing environments where accuracy and repeatability take priority, features a digital timer and adjustable vacuum for controlling drips between dispense cycles.
 
The contemporary, robust housing is designed with a small footprint to conserve workspace, and can be easily carried between work locations. Units can also be stacked and fastened on top of each other for further bench top efficiency.
 
OK International, okinternational.com

Polymer System Supreme 10HTFL is a one-component, flexible, high-performance, epoxy resin-based adhesive/sealant with a service temperature range of -300° to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250° to 300°F and above. Features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Said to exhibit high physical strength properties and excellent adhesion to a wide range of metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions.
 
Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding.
 
Has high resistance to severe thermal and mechanical shock and vibration. Pertinent physical strength properties including flexibility are retained when bonded assemblies are subjected to demanding service conditions. Performance properties are impressive when bonding substrates with wide differences in their thermal expansion coefficients. Reportedly has superior chemical resistance to water, salts, oils, fuels and many organic solvents. Is an excellent electrical insulator. Does not require mixing prior to use.
 
Master Bond Inc., masterbond.com
Pittsburgh, PA -- On Tuesday, June 6, Dr. Jonathan Cagan, chief technologist and co-founder of DesignAdvance and professor of Mechanical Engineering at Carnegie Mellon University, will give a keynote address at the Pittsburgh Technology Council’s “Innovation Day.” His topic will be “Pragmatic Innovation – Understanding Innovation in the 21st Century.”
 
Dr. Peter Boatwright, professor at the Tepper School of Business of Carnegie Mellon University, will also speak at the event. Dr. Cagan and Dr. Boatwright are co-authors of the book The Design of Things to Come.
                     
The Drs. will then moderate a panel on the same topic. Participants include:  Tom Bonnell, director of design at Repironics; Randy Eager, CEO of DesignAdvance; Eric Close, CEO of RedZone Robotics; and Todd Summe, manager of new product innovation at Alcoa.
    
The event will take place at the Westin Convention Center in Pittsburgh. For more info., visit pghtech.org/events/innovation.asp.
 

El Segundo, CASpansion LLC in the first quarter retained its position as the world’s leading supplier of NOR-type flash memory, according to preliminary market-share data from iSuppli Corp.
 
The U.S.-based company achieved NOR sales of $562 million in the first quarter, down 6.5% sequentially. Intel held onto second place with revenue of $537 million, down 10.5% from $600M in the fourth quarter. Europe’s STMicroelectronics remained in third place with revenue of $327 million, a 2.4% decline from Q4.
 
 
Read more ...
Woodinville, WA – PCB manufacturer UMC (Universal Manufacturing Corp.) has acquired additional advanced technology processing equipment, including two Pluritec auto loading CNC drilling machines, a Lohr Herman CNC jump scoring machine, an X-ray registration/ verification system, a thin core/fine line copper etching system, an advanced fine line laser photo plotter and an RoHS-compliant immersion silver/gold plating line.
 
UMC also announced that Ken Stowers, former owner of Velie Circuits Inc. (Costa Mesa, CA), joined UMC as VP of marketing. Rob Newton and Shaun Salas, also formerly of Velie Circuits, joined as direct sales people.

PHOENIX, AZFlipChip International and Engent have formed an alliance to accelerate the development and deployment of 3-D Wafer Level CSP (WLCSP) technologies for highly integrated stacked die packaging applications. This technology may enable packaging solutions that are quicker to market and lower cost than system-on-chip alternatives.

The partnership couples FCI’s high-volume, ultra-fine pitch wafer bumping capabilities and 2-D Wafer Level CSP package portfolio with Engent’s abilities in advanced surface-mount and flip-chip assembly technology. The flexible technology platform emerging from this partnership supports a range of ultra-high volume IC packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3-D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.

SUZHOU, CHINA -- Kemet will add a third tantalum capacitor manufacturing facility in the Suzhou area within the next two years, the company said.

The company has already invested a total of $70 million on two plants in the area, and its two factories total 20,000 sq. m. and employ 940 workers.

Kemet's customer base in Asia accounted for 37.9% of sales in fiscal 2006.

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