Flowserve Guardian 3000 electronics cooling pump is designed to cool computer processors and graphics chips in high-end consumer personal computers.
 
Measuring approximately 90 mm in length and 36 mm in diameter, it is the smallest pump the company has ever developed. While the largest pump built by Flowserve has an impeller diameter of 4.24 m and would fill an Olympic size swimming pool in 25 sec., the Guardian 3000 has an impeller diameter of less than an inch and would take nearly three min. to fill a kitchen sink.
 
It addresses a daunting challenge facing manufacturers today – how to cool computer electronic components within limited dimensional, cost and power budgets. An overhung centrifugal, nonmetallic, magnetic-drive, seal-less pump, its patented motor technology and design achieve the small form factor necessary to fit microcomputer and other electronic package applications.
 
Is powered by a brushless 12-volt DC motor, designed for a minimum five-year maintenance-free life. Collaboratively designed and manufactured by the company's Memphis, TN; Vernon, CA; and Dayton, OH facilities, has successfully completed tens of thousands of hours of endurance testing and more than 40,000 cycles of on/off tests.

Flowserve Corp., flowserve.com

OK International has developed a series of enhancements for its Metcal MX-500 and SP200 soldering systems to optimize them for Pb-free manufacture.
 
The first is a range of SmartHeat PowerTips for the MX-500 system. Designed for Pb-free applications, the tips provide the high thermal performance, allowing the user to solder demanding joints without heat damage. European product manager Craig Brown explains: “If you simply turn up the temperature, you risk burning off the flux and ending up with an insufficient joint. Instead, we have developed a series of tips that are extremely efficient in transferring more energy to the joint.”
 
Different solder tip geometries allow different amounts of energy to flow to the solder joint. Calculated mathematically using its length, width and shape, each solder tip’s “Conductivity Factor” indicates how efficient it is in conducting this energy – the higher the number, the more efficient the tip.
 
Based on its most popular tip geometries, the company has introduced seven SmartHeat PowerTips for use with MX-500. It plans to add new geometries as Pb-free manufacture takes hold.
 
For the SP200 soldering system, the cartridges have been upgraded with a high-power coil assembly for additional power for Pb-free solder joints, with no need for increased source temperatures.
 
Both systems use SmartHeat technology to ensure that the solder joint being reflowed receives exactly the energy required. This eliminates the risk of heat damage and allows the solder tip to work at lower temperatures for a longer useful life.
 
In addition, Auto Sleep Stand interrupts the energy flow to the solder tip when the hand-piece enters the cradle, reducing tip temperature to a minimum idling level as it rests in the stand. Reduces oxidization that can be a problem with high-temp Pb-free solders and fluxes; this can be further reduced with the stand’s brass wire wool cleaning compartment. Tip temperature returns to optimum working levels within a second of the hand-piece being removed from the stand, so no working time is lost.
 
Two accessories clearly identify Pb-free equipment: first, a green cradle that can be inserted into the Auto Sleep Stand; and second, green Pb-free identification rings that can be slipped onto soldering tips and cartridges. 
 
OK International, okinternational.com
 

Compact, modular mySelective 6745 is an in-line capable selective soldering machine that is quick to set up and suited to a high mix environment. Ideal for medium volume assembly, makes setup fast and simple using ‘Easyteach.’ A simple graphic image of the assembly – a JPEG or flat scan – helps set up the soldering sequence for any assembly in a matter of minutes.
 

 
Incorporates a flexible robot arm that is controllable and allows soldering under an angle over its SelectWave, for better soldering in difficult-to-reach areas. Is highly controllable, providing flexibility and the capability to swap process steps.
 
Features a specialized lifting unit and SecureGrip PCB Gripper system. Gripper can be extended with specific functions, including warpage prevention; holding functions for non-planar PCBs; or holding critical components in position. Provides free movement to revolve around its U-axis, easy swap-out through quick- disconnects and is fully adjustable in length and width.
 
Eliminates the need for custom pallets; reduces waste and dross problems. <F"65 Helvetica Medium">
 
Vitronics Soltec, vitronics-soltec.com

A wide range of compact four-, five- and six-axis robots handle payloads up to 20 kg, with reaches from 350 to 1,300 mm. Repeatability is within ±0.015 mm. Standard, cleanroom and dust- and mistproof (IP65) models are available. Easy-to-use programming software, controllers and teaching pendants are also offered.
 
DENSO Robotics
AT Expo, booth 311

Specialty Coating Systems (SCS) has confirmed that their equipment lines meet the requirements of the EU’s Restriction on the Use of Certain Hazardous Substances directive 2002/95/EC, which goes into effect tomorrow.
 
SCS designs and manufactures the following:
Conformal coating spray and dispense systems
Spin and dip coating systems
UV and thermal cure ovens
Ionic contamination test systems
Parylene deposition systems
 
The RoHS directive stipulates that all new electronics products and equipment sold in Europe after July 1 must be free of certain hazardous materials, including lead, cadmium, mercury and hexavalent chromium. Other countries, including China and Japan, and individual states within the U.S. are also developing similar directives.
 
Specialty Coating Systems,  .scscoatings.com
 

STATSHIELD Metal-In green ESD shielding bags provide easy identification of Pb-free assemblies and components in the manufacturing process. Are appropriate ESD packaging for lead-free products. 
 
Have integral antistatic, low-tribocharging properties and are printed with ESD protective symbol, RoHS compliant Pb-free symbol, manufacturer name and date/lot code for traceability.  Meet ANSI/ESD S20.20 and MIL-PRF-81705D Type III. 
 
Bag film thickness is 3.1mil. The buried metal layer is not susceptible to scratching. 40% light transmission allows identification of bag contents. 3/8” wide seals offer interior sealing layer. Polycarbonate compatible. Contains no amines or N-octanic acid. 12 stock bag sizes are available from 4x6” to 18x24”. Custom sizes and custom printing are available.
 
Protektive Pak, protektivepak.com

NEA announces solid titanium retrofit kits for a variety of wave solder systems. The titanium upgrades help in Pb-free environments, as titanium withstands the corrosive effects of high tin content in Pb-free solder. Available for a variety of wave solder system components, including nozzles, chimneys, impellers, shafts and solder pots.
 
According to the company, solid titanium components have proven to be superior to coated components. Because coatings can be removed or scratched, components run the risk of being exposed to corrosive Pb-free solder, thereby reducing their productive life. Solid titanium components are reportedly less expensive than upgrades offered by OEMs.
 
Can be retrofit in the field, turn around of 10 days on standard size nozzles.
 

Visiprise Manufacturing 4.2 enhances the user experience with increased performance, integration, reporting and business intelligence.
 
Includes:
Enhanced machine integration for control and efficiency of product delivery, enabling tight integration from PLM to the plant floor;
Robust business intelligence, Production Metrics powered by Cognos, creating more than 30 pre- configured, customizable business intelligence reports;
Out-of-the-box statistical reports that query high volumes of data over a historical period and allows for scheduling of the creation and sharing of customized Web-based reports;
Additional authoring tools so users can write a report once and distribute it in multiple languages and formats and can create their own reports on demand using drag-and-drop assembly.
 
Allows users to log in to access, design and visualize reports directly inside Production Metrics powered by Cognos. Can manage performance by delivering a consistent, accurate view of all business information.
 
Visiprise Manufacturing is an enterprise- level, scalable, J2EE manufacturing solution that enables global manufacturers to manage and control manufacturing and shop floor operations. Integrates business systems to the shop floor, allowing for component and item-level visibility for single and global installations.
 
Visiprise, www.visiprise.com

DVT 515 and 535 are easy-to-use vision sensors with a suite of vision tools.
 
“The DVT 515 and 535 are not limited to a single or even a few generic machine vision functions, but handle a much broader range of applications than similarly-priced vision sensors,” said Kris Nelson, Sr. VP, Vision Sensors. “It’s also very easy for users to combine vision tools to inspect, measure, count, find features and compare patterns in order to automate inspection and ensure quality in a variety of applications and industries.”
 
Are the lowest cost models in the DVT vision sensor family, which includes products for simple part inspection to defect detection, high-resolution and color applications.
 
Operate with easy-to-use Intellect software that facilitates setup, integration and maintenance; are backward-compatible with FrameWork. Have built-in Ethernet to connect to factory networks and software, making communications with other vision systems, PLCs, SCADA systems, PCs and databases fast and easy.
 

GÖPEL electronic and SPEA have developed a boundary scan option for the Flying Probe Tester (FPT) 4040 within the scope of an OEM agreement. The solution is based upon the integration of the Cascon Galaxy software and Scanflex hardware into the flexible Flying Probe test system, involving the FPT probes to extended the Boundary Scan tests.

“Combining the capabilities of SPEA Flying Prober with GÖPEL electronic JTAG/Boundary Scan solutions offers significantly higher test throughput due to optimised use of tester resources, applying the most efficient test technology for specific board structures,” said Bettina Richter, marketing and international sales manager for GÖPEL. “The possibility to reuse existing Boundary Scan applications for testing and programming Flash components or PLD, makes this solution very attractive due to a short ROI for CMs.”

The integration is based on the Scanflex USB/LAN controller models SFX/USL1149-x with TCK frequencies of 20MHz (A type) or 50MHz (B type), respectively. The JTAG test bus connection to the Unit Under Test is realized with a Scanflex transceiver model SFX-TAP4/CR, which provides four parallel TAPs with interposing relays and up to eight programmable interface parameters for the optimal adaptation to the UUT, connected to the standard interface of the Flying Prober. The distance between TAP-Transceiver with CION interface and UUT can be up to 1.5 m., without the need for additional signal conditioning. The flying probes extend boundary scan test coverage and are controlled by the native pin electronics of the 4040, requiring no extra driver/sensor circuitry.

The software development and execution environment has been integrated into the Flying Prober's operating system Leonardo via the CAPI interface. The test vectors' link to the Flying Probes is managed through Hyscan, which enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The flying probes make up this physical I/O interface.

The automated or manual generation of test vectors, debugging and fault diagnostic is done with JTAG/Boundary Scan tools. Each Flying Probe acts as an additional bidirectional Boundary Scan pin at the contacted net. Data handling is done automatically.

GÖPEL electronic, www.goepel.com
SPEA, www.spea.com

Red-E-Set Green RoHS-compliant support tooling is designed for manufacturers concerned with cross-contamination when support tooling is used in both processes on the same production line. Guarantees that residual leaded solder paste on the support tooling will not be re-deposited on a Pb-free board.  Screen printers and automated placement machines often face this dilemma.
 
“With the new lead-free requirements, manufacturers are faced with the challenge of running both the leaded and lead-free processes at the same time to remain competitive and productive,” said Tom Gordon, chief engineer. “Red-E-Set Green allows operators to continuously monitor for cross-contamination by separating materials and using the color green to differentiate between the lead-free and leaded product runs. This color identification enables line and floor operators to easily discern what products and materials they can safely use in the lead-free process.”
 
Production Solutions, production-solutions.com

Endicott Interconnect Technologies will exhibit semiconductor packaging solutions at Semicon West, July 10-14, at booth, #5484C in the NY Loves Nanotech pavilion.
 
Semiconductor packaging offerings include HyperBGA, CoreEZ and Wire Bond PBGA. EI will also showcase its PCB fabrication, first- and second-level assembly solutions.
 
HyperBGA is a flouropolymer-based, organic flip-chip package for high performance applications where speed, reliability and increased signal I/O, along with reduced weight and package size, are critical. This low stress flip-chip laminate package is suited to graphics applications that require high data processing speeds or any application requiring a system-in-package approach.
 
CoreEZ uses the HyperBGA manufacturing platform to offer organic, thin core build-up, flip chip technology that combines electrical, reliability and wireability performance with cost effective materials and processes. For applications requiring low-cost build-up materials with high performance, or for aerospace applications requiring radiation tolerance.
 
To expand the market place for CoreEZ, EI entered into a Memorandum of Understanding with Meadville Technologies Group to produce the organic substrates at their Shanghai Silicon Platform facility; qualification builds are currently underway.
 
Wire Bond PBGA offers electrical performance and material properties that are matched to the PCB, to deliver high performance and field reliability. The chip-up design is economical and targets lower power applications while the cavity package provides thermal performance.
 
Endicott Interconnect Technologies, www.endicottinterconnect.com