Axiom X-1022 Dual-Lane dispensing system maximizes throughput during multi-pass underfill operations. Increases the number of units per hour (UPH) produced in high-volume semiconductor applications such as flip chip and CSP underfill. Allows parallel processing on two lanes for continuous dispensing, eliminating lost time in non-dispensing activities. In some applications, a 60 to 80% increase in throughput over single-lane dispensers can be achieved.
 
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
 
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails. 
 
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
 
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
 
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.  
 

Model 3500-III flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach and flip chip operations over a 720 sq. in. work area.  Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules and hybrid microcircuits.
 
Capable of automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.
 
Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the sub-micron axis resolution yields placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications. 
 
Placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms. 
 
Machine base is a honeycomb core optical table that provides vibration damping and thermal settling response. Large work area. Cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in pickup and placement of fragile devices. Eight-position turret head can rapidly change tools on the fly without a tool dock assembly.  Constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, so any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.  
 
Has infrared light curtain around the open perimeter of the assembly cell. This sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 millisec.) shorts the inputs to the digital servo driven motors, stopping all motion.
 
Uses Windows XP.
 
Palomar Technologies, www.palomartechnologies.com

EPM-2493 low-viscosity, thermal interface material meets the challenges of the high-temperature and high-stress operating conditions in electronic packaging. Low outgassing property is ideal for situations, such as electro-optic systems, in which contamination is a concern. Low viscosity provides an easy-to-dispense material that flows easily through dimensionally intricate electronic configurations.
 
NuSil Technology, nusil.com
 

GÖPEL has developed a new option in its System Cascon software suite to support Altera’s USB-Blaster download cable. The driver integration of download cable in the software suite enables the USB Blaster download cable to be used as a native JTAG/boundary scan controller throughout the entire product life cycle.
 
USB-Blaster can also be used to program Flash devices in-system and configure Altera FPGAs via the Jam Standard Test and Programming Language, JEDEC standard JESD-71, Simple Vector Format specification or IEEE-Std.1532 specification. Additional software support for boundary scan chain designs with multi-drop devices is automatic, including all scan router devices by Firecron, National Semiconductor and Texas Instruments.
 
All test and in system programming procedures generated with the download cable are cross-compatible with other JTAG/boundary scan controllers by GÖPEL, including the hardware platform SCANFLEX.
 
Support is included for no additional charge beginning with release 4.3. Customers can purchase the USB-Blaster download cable through Altera distributors.
 
GÖPEL electronic, www.goepel.com

Scapa C401 is a glass cloth, single coated with a silicone adhesive for high-temperature masking and protection. On PCBs, the non-flammable adhesive tape masks and protects circuitry during wave solder processes.
 
Withstands temperatures up to 500ºF.  Glass cloth backing provides dimensional stability and strength, allowing the product to retain its physical properties at elevated temperatures. Offers excellent adhesion to a variety of surfaces, yet removes easily without leaving adhesive residue. 
 
Scapa Industrial. www.scapaindustrial.com

SinguLign enables the high accuracy mass imaging of multiple materials such as solder paste, solder spheres, flux and adhesive onto singulated substrates or components directly from the carrier, allowing the accurate processing of known good parts down to 20 mm in size.
 
With an accurate printing platform, specialized tooling, a carrier and a miniaturized print or ball placement head, repeatable and precise deposits can be applied to parts individually. The carrier, which can hold multiple substrates, is transported into the printer where a vacuum tower raises the first substrate or component to print height, secures it in place and aligns the substrate. The substrate is then imaged with the appropriate material for the specific application and is gently lowered back into the carrier. This sequence is repeated for all of the parts and then the carrier is transported to the next process step. 
 
The tooling and parts handling mechanisms allow for maximum print support and enable high-speed processing times for individual parts – as little as 20 sec. for ball placement and less time for other print processes. Said to deliver increased accuracy through the ability to align to substrate features (not package edges); enables ultra fine pitch imaging, providing yield improvement driven by the capability to process only known good parts and supports multiple processes, depositing paste, flux, solder spheres or adhesive. Allows for imaging onto substrates or pre-packaged, 3-D components; permits easy re-deployment for other packaging processes.
 
Gives packaging specialists the ability to align and image multiple substrates and components at ultra-fine pitch individually.
 
DEK, www.dek.com

Disposable Flextac stencils are an easy, reliable method for stencil printing solder paste on individual BGA component sites for rework. An adhesive side attaches temporarily to the PCB, preventing misalignment and solder paste smearing. Are inexpensive and disposable, help users keep Pb-bearing and Pb-free soldering materials separate, preventing cross-contamination. Are RoHS compliant.
 
Are part of a complete BGA stencil kit that includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.
 
Are laser cut for correct aperture size from high quality, anti-static polymer film with a residue-free adhesive backing. No tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when solder paste is applied. Easy to use and leave no residue on the board surface.

Can be repositioned. The side tabs also serve as solder dams preventing solder paste overspill. Since the residue-free adhesive seals around each BGA pad, one may make as many passes with the squeege as needed to ensure proper aperture filling. The stencil is then peeled off, leaving a perfect deposit of solder on each pad. Disposable, but can be used several times.
 
CircuitMedic, CircuitMedic.com

The Micromex submicron, high-resolution system is optimized for manual and semi-automated solder joint inspection of BGA, CSP, MLF and QFP components. Has an integrated 2 megapixels camera, open 160kV or 180kV submicron x-ray tube and total magnification of up to 13.3X for process control and failure analysis of PCB assemblies.
 
Comes with new inspection software, quality|assurance 2006. This software automates inspection of PCB assemblies, making pass/fail decisions for BGA, CSP, MLF and QFP without operator interpretations, reducing the numbers of false identifications while speeding throughput and improving efficiency. A powerful algorithm toolbox XE offers solutions for application testing. 
 
Possesses high precision manipulation through its 360° rotation axis and the ability for oblique views up to 70°. A scanning area of 18x14” allows samples with a size up to 26.75 x 25” (680 x 635 mm) with weights of up to 11 lbs. (5 kg). 
 

Henkel has developed a die attach and mold compound material set that is Pb-free compatible and designed for thin and ultra-thin surface-mount device applications.
 
Combined, the Hysol QMI529LS die attach material and Hysol GR828A mold compound deliver the thin, yet highly reliable, materials properties necessary for packages in  low-profile products such as cell phones, PDAs, portable music players and entertainment devices . 
 
When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of the die attach adhesive with the “Green” mold compound reportedly produces superior material set reliability and performance. QMI529LS’ formulation provides hydrophobic properties, while delivering stability at high temperatures. GR828A is a low stress molding compound that exhibits excellent gate leakage performance. Testing of this materials combination to JEDEC Level 1, 260°C has confirmed robust performance even in demanding Pb-free manufacturing conditions. 
 
Henkel,is one of the world’s leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across electronics.henkel.com

Model 325 Electrostatic Voltmeter, an ultra-sensitive instrument which is ideal for noncontacting electrostatic voltage measurement and monitoring in applications within high-tech, semiconductor, materials processing, materials science and R&D sectors. 
 
Designed for applications that require highly accurate, low noise, noncontacting measurement of electrostatic voltages from millivolts to +/- 40 V over a range of probe-to-surface distances. 
 
Applications include electrostatic monitoring of devices sensitive to ESD, and testing of the reliability and characteristics of dielectric materials and films in electronic applications.
 
In semiconductors, is designed to measure the surface potential of bare or processed wafers to analyze doping and thin film characteristics. Also useful for measurements of polarization, residual charge and characterization of electrostatic chucks.
 
Can monitor electrostatic charge where the build-up of such charge can cause productivity or yield problems, as in high-end processing of paper, plastic, textile or other film products. 
 
In materials science and R&D, applications include contact potential (surface work function) determination, materials evaluation and electret studies.
 
Features include sensitivity of 1 mV, speed of response less than 3 ms and accuracy better than 0.05% of full scale. Low impedance probe sensor assures measurement accuracy which is essentially independent of probe-to-test-surface spacing while eliminating the external  environmental effects of high humidity and contamination on measurement accuracy. Contaminants include airborne dust, ions, chemicals and other particulates.
 
Offers a higher performance alternative to Model 320C Electrostatic Voltmeter with faster speed of response, lower noise and higher accuracy. Smaller probe also increases the unit’s utility in space-constrained environments. Designed to address demanding semiconductor parameters for permittivity, oxide thickness and integrity, contact potentials and higher-speed automated voltage profile scanning.
 
Special features allow tuning the performance of the unit to compensate for specific test conditions.  Can be operated as a bench top unit or in a standard rack (with optional hardware).
 
TREK, Inc., trekinc.com

K-Alpha materials characterization instrument uses x-ray photoelectron spectroscopy to quantitatively determine the surface chemical composition of the top few nanometers of solid materials. Insulators, semiconductors and metals can be analyzed in a user-friendly, reliable and automated way. An integral ion source provides a high-resolution depth profiling capability, thus facilitating true 3D analysis. For high-throughput sample analysis.

Thermo Electron Corp., thermo.com/surfaceanalysis

The VPD-5 depaneler is said to permit stress-free board separation with components (inlcuding ceramic capacitors) as close as 0.5 mm from the score line. Reportedly handles boards as thin as 0.32", and can separate boards with tall components near the score line (up to 0.800" from the top of the PCB). Panel insertions limited to the score line, preventing operator errors. In two models; for boards up to 10" and 13", respectively.

Fancort Industries, fancourt.com