Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity.
 
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
 
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
 
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
 

GÖPEL electronic introduces the SFX-5704 as additional component to the JTAG/Boundary Scan hardware platform Scanflex. The I/O Module (SFX Module) was developed for the production test of mixed-signal applications and provides four parallel and independent channels.
 
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
 
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
 
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
 
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
 
GÖPEL electronic, www.goepel.com

B300 tabletop ultrasonic cleaner includes a stainless steel cleaning tank using industrial-style ultrasonic transducer technology, at 40KHz. Includes an automatic 15 min. timer and comes with a cover and perforated stainless steel basket.
 
Inside tank dimensions are 11.8 x 3.9 x 2.9”, with half-gallon capacity, in either a 115 or 230 volt unit.
 
Applications include difficult soils or contaminations, removing brazing fluxes, polishing compounds, lens cleaning.  Ideal markets include jewelry, optical and veterinarian markets.
 
Branson Ultrasonics Corp.,  www.sonifier.com
 

AccuCheck ESD inspection template allows Photo Stencil to offer precision component verification inspection templates to its customers, directly from its headquarters in Colorado Springs, CO.
 
“Now that the equipment is located at Photo Stencil’s facility, the company can offer full design and fabrication capabilities, as well as the timely deliveries our customers have come to expect. This is yet another in-house service that Photo Stencil has the capability to offer,” said Mike Burgess, stencil product manager.
 
Plastic laser-cut templates are a cost-effective and timely alternative to automated optical inspection equipment. Can be used for all board types including SMT, Pin Through Hole Technology (PHT) and combinations of both. The standard turn time is 24 to 48 hrs, depending on the verification of data received.
 
Photo Stencil, www.photostencil.com

Multi-Seals offers an alternative to liquid epoxy for high-volume epoxy sealing applications.  Uni-form epoxy preforms are one-part epoxy resins that are solid at room temperature.  When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. 
 
Features close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch. Preforms can be dispensed at 200 to 600 parts/min. with little or no operator training.  Eliminate pot-life concerns and costly cleanup procedures. Available in a range of shapes, sizes and materials to accommodate diverse applications.
 
Multi-Seals Inc., multi-seals.com

JNJ Industries’ AquaSonic AQP Solder Paste & Flux Remover has been certified by the South Coast Air Quality Management District (SCAQMD) as a Clean Air Solvent, meeting their new, more stringent requirements of 25 grams per liter or less of VOC.
 

 

 
JNJ Industries Inc., jnj-industries.com

Bishop and Associates recently released the 2006 edition of the Connector Market Handbook. The comprehensive seven-chapter report analyzes all aspects of the world electronic connector market, providing detailed connector statistics by equipment sector and product category for North America, Europe, Japan, China, Asia Pacific and the ROW.
 
Includes a chapter on worldwide connector industry results by region, equipment sector and product category. Data is provided for 1999-2005, with projections for 2010 (including five-year CAGRs). Includes 2004/2005 results by country for the European and Asia Pacific regions, as well as a 2010 forecast.
 
 
Bishop & Associates Inc., connectorindustry.com

Aqueous Technologies will showcase Model SMT1000-CL Aqueous Cleaning/Defluxing System in Altus Group Ltd.’s booth, G20, at the upcoming Nepcon UK show.
 
Can remove water-soluble flux residues. Is equipped with a built-in closed-loop recycler, directing all process water through a filtration and de-ionization system. No water is sent to drain.
 
All SMT-Series cleaning systems feature an Intel X-Scale computer controller operating under Windows CE.  A 10.4” (26.4 cm) touchscreen interface provides for intuitive programming. Real-time graphic displays allow an operator to monitor all program functions from a highly visible screen while multi-level password protection prevents unauthorized program changes.  Optional features include multi-language support and SPC data-viewing via a built-in web server. 
 
Focus-Wash spray system directs cleaning solution to all areas of the boards, including between and under components. The oscillating board rack and asymmetrical spray nozzle design produce millions of overlapping spray patterns, to eliminate shadowing. Produces more than five times the impact pressure of former models. Designed for fine-pitch, high-density SMT assemblies.   
 
An onboard cleanliness testing system automatically monitors cleanliness and continues the cleaning cycle until the desired cleanliness level has been achieved.  Access to historical cleanliness results is available via the built-in SPC data Web server.
 
A 1,500 CFM blower directs heated air into the wash/dry chamber. 
 
Aqueous Technologies Corp., aqueoustech.com

Aquanox product family consists of aqueous chemistries for cleaning electronics assemblies. Superior solvency, mild pH and robustness make them suitable in a range of cleaning applications. Safely clean under low standoffs to remove tough surface-mount residues. Said to be easy to use, biodegradable, completely water-soluble and residue-free.
 
All products are RoHS compliant and designed with the environment in mind.
 
A4630 cleans Pb-free materials while providing low cost of ownership. This 6^th-generation product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. Typically used in aqueous spray-in-air equipment at 10 to 20%, from ambient temperatures. Said to provides brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
 
A4520T aqueous chemistry for flush mounted and fine-pitch components cleans under low standoffs and in the tight spaces caused by smaller and more heavily populated devices. The 8^th generation chemistry has proven effective on Pb-free, no-clean and eutectic materials. Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety.
 
A4520, a cleaning agent designed for reflowed no-clean flux residues, has been tested on more than 100 leading solder pastes, tacky fluxes and wave solder fluxes. Is effective on reflowed solder paste as well as uncured SMD solder adhesives. The concentrated cleaning solvent for aqueous batch or in-line spray machines is subjected to thorough screening of leading solder pastes prior to release. Is aqueous, non-hazardous, non-regulated and environmentally safe.
 
Kyzen Corp., kyzen.com
Booth G62

BP Microsystems will display the 4710 automated programming system, in Adaptsys’ booth at Nepcon UK .

Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
 
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
 
BP Microsystems, www.bpmicro.com

Zestron, a supplier of high precision cleaning processes and services, will be exhibiting at Nepcon East on May 10 – 11. 
 
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
 
Zestron America
Nepcon East Booth  2040

Huntsman Advanced Materials has introduced two halogen-free laminating resins that comply with regulatory requirements for PCB manufacturing.
 
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
 
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations.  This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
 
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
 
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion  and low shrinkage. 
 
Huntsman, huntsman.com/electronics