Unifilm U801 and U801NP are acrylic transfer adhesives that reportedly deliver excellent peel strength and high temperature resistance.
 
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF.  Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
 
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.

Scapa Industrial, scapaindustrial.com

Model 2200-545-037 two-component Miniature Mix-Dispense Valve precisely dispenses miniature beads and small volumes of low-viscosity pourable materials and abrasive or filled materials. Ideal for low-flow applications typically found in miniature potting, doming, filling and bonding operations.
 
The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow.
 
Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting.
 
Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps.
 
Sealant Equipment & Engineering, sealantequipment.com

A.C.E. Production Technologies will exhibit the KISS line of selective soldering systems suitable for Pb-free solders at Nepcon East in booth #6028. A.C. E. will also introduce its Dual Head Fluxer option that facilitates quick changeover of flux types. It is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. 

Rugged, reliable and compact, the line consists of the basic KISS 101 system and programmable KISS 102. The systems feature Pb-free compatible solder pots for assembly, prototyping and rework, post-reflow offline assembly and other selective soldering applications such as odd-form devices. 

Standard and custom nozzles are available for both machines. Both are bench-top models with optional carriages for stand-alone use. A dual-head fluxing system for the 102 makes it possible to change flux types quickly.

Both can accommodate PCB’s from 2 x 2” up to 18 x 24”, and connectors up to 10” long.

A.C.E. Production Technologies, ace-protech.com

TNC 320 is a full function control that incorporates the features of the iTNC 530 control, including the ability to control five axes, but at a lower cost.  Has analog drive interface, good for interfacing to existing drive systems on retrofit applications. Its one-piece construction minimizes cable runs. 
 
Features a 15” TFT color flat-panel display (1024 x 768 pixels) for programming graphics and on-screen user support. Main computer has a large number of onboard cycles to simplify machining operations, from drilling and milling to workpiece probing. Conversational programming is standard and G-code programming is now possible with an added USB keyboard. The compact flash memory card stores the PLC program, commissions information and offers more user memory for NC files. Data interfaces include RS 232 as well as USB and ETHERNET.
 
Based on the new NC Kernel software platform. Benefits include a powerful interface between PLC and NC, eliminating redundant operations.  Detailed help can by called for each parameter by pressing a button. Has expandable I/O capabilities making it viable for more complex machine applications.
 
The control will make its North American debut during the WESTEC show, March 27-30.
 
Heidenhain Corp., heidenhain.com

Master Bond Supreme 3HT-80 is a one-component heat curing epoxy adhesive. It reportedly exhibits high shear and high peel strength. Offers resistance to impact, thermal shock, vibration and stress fatigue cracking. No-mix compound, has an unlimited working life and cures within 30 min. at 175°F (80°C).


Said to have excellent adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics. It forms bonds that are resistant to water, oil, fuels and most organic solvents even upon prolonged exposures. Operates at -100° to +350°F. Is 100% reactive and does not contain any solvents.


Available in half-pint, pint, quart, gallon and five-gallon containers. Also available in convenient cartridge applicators.


Master Bond Inc., masterbond.com

BP Microsystems will showcase the latest addition to its automated device programmer family, the Helix, in Wong Kong King (WKK)’s booth 1F15 at Nepcon China/EMT China, scheduled to take place April 4-7, in Shanghai.
 
With the introduction of the Helix programming system, device programming customers can get the quality of automated device handling at a lower price point than traditionally available. 
 
The desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7^th Generation programming sites with FX4 socket module capability. This technology can program up to four devices simultaneously per site. Can handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
The operational sequence of the machine picks the part from tube input, transfers the part to the programming socket, programs the part and returns the part to tube output. Integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. The tooling head requires no vision system for handling fine-pitched parts, for an overall throughput of 800 devices/hr.  One computer and software interface controls both BPWin software and handler control operations.   
 
BP Microsystems, bpmicro.com

 
Features an Easy Test Case generation with GUI and does not require programming. It integrates easily through COM interface. It also supports a range of Firewire (IEEE-1394) and USB 2.0 cameras. Run-time version with calibration features is also available.
 
Features include unlimited maximum resolution, support for up to 254 cameras, test cases controllable with separate customer-specific applications and image processing in a computer with no extra hardware. No third-party low-level image processing libraries are needed.
 
Has tools for display location and alignment as well as for pixel defect and contrast identification. It performs the measurements for pattern matching, colour and greyscale illumination and keypad backlight. Inspects the icon presence and measures the keypad distance and size. The calibration tool uses pixel grid or checkerboard pattern method. Focus analysis tool extends usage to camera module testing.
 

Europlacer will display the Xpress 25 flexible, high-volume SMT placement system in booth 1F01 at the upcoming Nepcon China/EMT China  trade show and exhibition.
 
Claims to bring new vision to modular placement ¾ combining high-speed and fine-pitch capabilities in a compact footprint. Twin heads can place an array of devices from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec. (25,000 cph). Equipped with “smart nozzles” and on-the-fly vision.
 
Benefits include intelligent feeder technology, “smart” nozzles and more.
 
Has feeder capacity of 92 x 8 mm and an accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (with an 0.3 mm optional) and a tape size range of 8 to 88 mm.
 
Available options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
 
Europlacer, europlacer.com

At SMT/Hybrid/Packaging on May 30-June 1, in Nuremberg, Germany, GÖPEL will exhibit products for AOI and JTAG/Boundary Scan.  Visitors can see the OptiCon AOI platform, the JTAG/Boundary Scan hardware architecture Scanflex and the latest version of the Integrated Boundary Scan Development Environment  System Cascon in stand 339, hall 4.
 
The OptiCon system’s core element is a modularly extendable camera. This camera allows the alternative selection between a one- and four- MegaPixel camera module. For even higher test coverage, the user can install additional camera options for THT components, color inspection or 3-D measurement as well as angled view inspection. The platform is said to offer high test speed, reduced debug times, minimal false call rate and high fault coverage.
 

SPRINTavi automatic in-line printer accepts the standard 29" (737 mm) stencil frame. Using Speedprint's "look down, look down" vision alignment technology, the printer facilitates "pase on stencil" inspection. The camera ensures 6 sigma repeatability.

Options include 2-D paste inspection, programmable paste dispenser, SPC data collection and tooling options such as a laser-guided tooling system and the Vacunest tooling package.

Designed for flexibility, easy changeover and long-term reliability. 

A-Tek, atekllc.com

Magnet Wire Stripping Pot strips film insulations from wires of all sizes and configurations. The wires are dipped into the stripping solution to quickly remove the insulation. This stripping method will not cause mechanical stress or abrasion to the conductor. Units are available in two models: DSP1 has basic temperature control and DSP2 has a programmable temperature control for selecting and maintaining an exact temperature. Both are available in 115V 60Hz or 220/240V 50/60Hz. Custom sizes can be quoted.

The Eraser Co. Inc., eraser.com

Finetech will highlight the Fineplacer Pico system in booth E1A02 during Nepcon China/EMT China on April 4-7.
 
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
 
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
 
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
 
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
 
Features "WinCOMISS" software that controls bond force during placement and soldering.
 
 
Finetech, finetechusa.com